JPH0433351A - Tape carrier for TAB - Google Patents
Tape carrier for TABInfo
- Publication number
- JPH0433351A JPH0433351A JP14031490A JP14031490A JPH0433351A JP H0433351 A JPH0433351 A JP H0433351A JP 14031490 A JP14031490 A JP 14031490A JP 14031490 A JP14031490 A JP 14031490A JP H0433351 A JPH0433351 A JP H0433351A
- Authority
- JP
- Japan
- Prior art keywords
- tape carrier
- copper foil
- pattern
- copper
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 36
- 239000011889 copper foil Substances 0.000 claims description 22
- 238000005498 polishing Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 5
- 238000003672 processing method Methods 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 230000001680 brushing effect Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、パターン欠陥（パターンショート）の発生を
軽減したＴＡＢ用テープキャリア〈従来の技術〉
ＴＡＢ用テープキャリアとして、例えば第１図に示すも
のがある。 一般に、ＴＡＢ用テープキャリアは、厚さ
７０〜１２５μｍ、幅３５ｍｍ（あるいは、７０，１４
０ｍｍ等の幅）を有する有機ポリイミドフィルム、ガラ
スエポキシフィルム等の絶縁フィルム３に、パンチング
加工によりＴＣ素子（図示せず）に対応するデバイスホ
ール３ａおよび実装時にテーブキへ・リア本体を送り出
すためのパイロットポール３ｂを形成し、この絶縁フィ
ルム３に接着剤４を介して厚さ１８〜３５μｍの圧延銅
箔あるいは電解銅箔等の銅′ｆ３２を貼り合わせた後、
ホトエツチングによって所定の配線パターンを施して成
る。[Detailed Description of the Invention] <Industrial Application Field> The present invention provides a TAB tape carrier that reduces the occurrence of pattern defects (pattern shorts). There is something. Generally, TAB tape carriers have a thickness of 70 to 125 μm and a width of 35 mm (or 70 to 14 mm).
A device hole 3a corresponding to a TC element (not shown) and a pilot for feeding the rear main body to a table plate during mounting are formed by punching an insulating film 3 such as an organic polyimide film or a glass epoxy film having a width of 0 mm, etc. After forming the pole 3b and bonding copper 'f32 such as rolled copper foil or electrolytic copper foil with a thickness of 18 to 35 μm to this insulating film 3 via adhesive 4,
A predetermined wiring pattern is formed by photo-etching.
第２図は第１図における配線パターン部分の断面図を示
し、接着剤４を介して銅箔２と絶縁フィルム３が貼り合
わされて三層構造を形成しでいる。FIG. 2 shows a cross-sectional view of the wiring pattern portion in FIG. 1, in which a copper foil 2 and an insulating film 3 are bonded together via an adhesive 4 to form a three-layer structure.
〈発明が解決しようとする課題〉
ここで圧延銅箔は、例えばファインパターンのＴＡＢ用
テープキャリアを作る場合に、圧延すじと銅のかぶり（
銅粉が表面に付着し押しのばされたものまたはおしこま
れたもの）が大きな問題となっている。<Problems to be Solved by the Invention> Here, rolled copper foil has rolling lines and copper fog (
Copper powder that has adhered to the surface and has been pushed or pushed in has become a major problem.
即ち、銅のかぶりは、銅粉の発生により、これがクリー
ンルーム内に飛散しホトレジストを塗布した表面に付着
してパターン欠陥の原因となるものである。That is, copper fog is caused by the generation of copper powder, which is scattered in the clean room and adheres to the surface coated with photoresist, causing pattern defects.
また圧延すしは、圧延ロールの回転すじがそのまま銅箔
の表面に転写されているもので、これにホトレジストイ
ンキが食いこみ、現像により除去されない部分が生じパ
ターンのつながり等の原因となるものである。 また、
圧延すしと直交する方向のパターンはエツチング断面が
ぎざぎざになる傾向があるが、これは圧延すしへのホト
レジストの食いこみが原因となっている。In addition, with rolled sushi, the rotation lines of the rolling rolls are directly transferred to the surface of the copper foil, and the photoresist ink digs into this, causing areas that are not removed by development and causing patterns to connect. . Also,
Patterns in the direction perpendicular to the rolled sushi tend to have jagged etched cross sections, but this is caused by the photoresist digging into the rolled sushi.
本発明は、前記圧延すしや銅のかぶりによりて起こるパ
ターン欠陥（パターンショート）の発生を軽減したＴＡ
Ｂ用テープキャリアを提供することを目的としている。The present invention provides a TA that reduces the occurrence of pattern defects (pattern shorts) caused by the rolled sushi and copper fogging.
The purpose is to provide a B tape carrier.
く課題を解決するための手段〉
上記目的を達成するために本発明によれば、圧延銅箔と
絶縁フィルムとを有してなるＴＡＢテープキャリアにお
いて、前記圧延銅箔の前記絶縁フィルムに接触しない側
の表面が湿式処理方法にて研磨処理を施したものである
ことを特徴とするＴＡＢ用テープキャリアが提供される
。Means for Solving the Problems> In order to achieve the above object, according to the present invention, in a TAB tape carrier comprising a rolled copper foil and an insulating film, the rolled copper foil does not come into contact with the insulating film. A TAB tape carrier is provided, the side surface of which has been polished using a wet processing method.
ここで、前記湿式処理方法は、化学的および／または機
械的研磨方法であるのが好ましい。Here, the wet processing method is preferably a chemical and/or mechanical polishing method.
また、前記機械的研磨方法は、水中ブラッシングが好ま
しい。Further, the mechanical polishing method is preferably underwater brushing.
また、前記湿式ＩＡ埋の前段にて研磨ブラシ等によるブ
ラッシングを施したものであるのか好ましい。Further, it is preferable that brushing with an abrasive brush or the like be performed before the wet IA embedding.
以下に本発明をさらに詳細に説明する。The present invention will be explained in more detail below.
本発明に用いる圧延銅箔は、無酸素銅、りん脱酸銅等の
純銅またはＣｕ−Ｚｎ、Ｃｕ−５ｎ等の銅合金の箔であ
る。 箔の厚さは限定しないが、通常１８〜３５μｍの
ものが用いられる。The rolled copper foil used in the present invention is a foil made of pure copper such as oxygen-free copper or phosphorus-deoxidized copper, or a copper alloy such as Cu-Zn or Cu-5n. Although the thickness of the foil is not limited, a thickness of 18 to 35 μm is usually used.
本発明に用いる絶縁フィルムは限定せず通常の厚さ７０
〜１２５μｍ、幅３５．７ｏ、１４０ｍｍ等の有機ポリ
イミドフィルム、ガラスエポキシフィルム等である。The insulating film used in the present invention is not limited to a normal thickness of 70 mm.
These include organic polyimide films, glass epoxy films, etc., with a diameter of ~125 μm, a width of 35.7 degrees, and a width of 140 mm.
前記圧延銅箔と前記絶縁フィルムとをエポキシ系等の接
着剤で貼り合わせる。The rolled copper foil and the insulating film are bonded together using an epoxy adhesive or the like.
前記圧延銅箔の絶縁フィルムに接触する側の表面は、貼
り合わせる前に常法により粗化処理される。The surface of the rolled copper foil on the side that comes into contact with the insulating film is roughened by a conventional method before bonding.
前記圧延銅箔の絶縁フィルムに接触しない側の表面（第
２図で見て銅箔２の上面）は、湿式処理方法で研磨処理
を施す。 湿式処理方法としては、エツチング、電解研
磨等を代表的に挙げることができる。 また、化学的
研磨または機械的研磨、さらにはこれらを併用してもよ
い。 機械的研磨方法としては水中ブラッシングを代表
的に挙げることができる。The surface of the rolled copper foil on the side not in contact with the insulating film (the upper surface of the copper foil 2 as seen in FIG. 2) is subjected to a polishing treatment using a wet treatment method. Typical wet processing methods include etching, electrolytic polishing, and the like. Further, chemical polishing or mechanical polishing, or a combination of these may be used. A representative example of the mechanical polishing method is underwater brushing.
このような研磨処理は前記絶縁フィルムに接触する側の
表面に施す粗化処理の前段で行うようにすれば、コスト
アップにならないので好ましい。It is preferable to carry out such polishing treatment before the roughening treatment performed on the surface in contact with the insulating film, since this will not increase the cost.
上記のように圧延銅箔の表面を研磨処理することにより
圧延すじや銅のかぶりが除去され、パターン欠陥（パタ
ーンショート）の発生の少いＴＡＢ用テープキャリアと
することができる。By polishing the surface of the rolled copper foil as described above, rolling streaks and copper fogging are removed, and a TAB tape carrier with fewer pattern defects (pattern shorts) can be obtained.
〈実施例〉 以下に本発明を実施例に基づき具体的に説明する。<Example> The present invention will be specifically explained below based on Examples.
（実施例１）
表面粗さが、圧延方向０，０３μｍ、これと直交する方
向０．０６μｍの圧延銅箔（３５μｍ厚Ｘ２６．４ｍｍ
幅）の片面を前記両方向共に表面粗さが０．０１μｍに
なるように化学研磨した。(Example 1) Rolled copper foil (35 μm thick x 26.4 mm) with surface roughness of 0.03 μm in the rolling direction and 0.06 μm in the direction perpendicular to this
One side of the width) was chemically polished to a surface roughness of 0.01 μm in both directions.
層液の組成と条件は下記のとおりとした。The composition and conditions of the layer liquid were as follows.
硫酸 １５０ｇ／ｕ
過酸化水素 ３０ｇ／ｕ
光沢添加剤 １．０ｇ／Ｊ２
（アミン系添加剤十
アルコール系異面活性剤）
Ｈ２Ｏ，安定剤 ０． ５ｇ／Ｉｔ
（アミン系キレート化剤）
温度 ３５℃
時間 １．０分
エツチング深さ（銅箔減少目標） ２μｍすなわち、
圧延すじを完全に除去し、かつ表面かぶり等を除去する
ために２．０μｍのエツチング深さ（３５μｍ−３３μ
ｍ厚まで）とした。Sulfuric acid 150g/u Hydrogen peroxide 30g/u Gloss additive 1.0g/J2 (amine additive, 10-alcohol surfactant) H2O, stabilizer 0. 5g/It (Amine chelating agent) Temperature: 35°C Time: 1.0 minutes Etching depth (copper foil reduction target) 2 μm, i.e.
Etching depth of 2.0μm (35μm-33μm) to completely remove rolling streaks and remove surface fog etc.
up to m thickness).
この銅箔の他の片面を平均粗さ０．４μｍまで交流電解
法により粗化して、これをＴＡＢ用テープキャリアの試
作に用いた。The other side of this copper foil was roughened to an average roughness of 0.4 μm by alternating current electrolysis, and this was used to make a prototype of a TAB tape carrier.
比較のために、前記の研磨処理をしない銅箔を用いて同
時に試作をおこなった。For comparison, a prototype was also made using copper foil that was not subjected to the polishing process described above.
ＴＡＢ用テープキャリアは下記の仕様で試作した。A prototype TAB tape carrier was manufactured with the following specifications.
絶縁フィルム：ポリイミドフィルム
０、 ０７５ｍｍｘ３５ｍｍ
接着剤：エポキシ系
ビン数：２００ピン
インナーリードピッチ：１００μｍ
（パターン幅５０μｍ１パターン間幅５０μｍ）
ＴＡＢ用テープキャリアの評価は次に示す外観について
実施した。Insulating film: Polyimide film 0.075 mm x 35 mm Adhesive: Epoxy Number of bottles: 200 pins Inner lead pitch: 100 μm (Pattern width: 50 μm, Width between each pattern: 50 μm) The TAB tape carrier was evaluated for the following appearance.
外観：実施例、比較例とも２００ピンＴＡＢを５００個
試作し、２００ピンＴＡＢ１個について１ピンでもパタ
ーンショートがあればパターンショート発生１個とした
。Appearance: In both Examples and Comparative Examples, 500 200-pin TABs were prototyped, and if there was a pattern short in even one pin for each 200-pin TAB, it was considered as one occurrence of pattern short.
ここでパターンショートとは、第３図に示すようなパタ
ーンつながり５である。 第４図に示すような銅箔２の
粗化面（第４図で見て下面）の銅が接着剤４に食いこむ
ことによる根のこりショート（銅のこり）６は、パター
ンショート５と異るので区別しカウントしていない。Here, the pattern short is a pattern connection 5 as shown in FIG. The root stiff short (copper stiff) 6 caused by the copper on the roughened surface of the copper foil 2 (lower surface as seen in FIG. 4) biting into the adhesive 4 as shown in FIG. 4 is different from the pattern short 5. Therefore, they are not counted separately.
評価結果を表１に示した。The evaluation results are shown in Table 1.
パターンショートは本発明により著しく低下した。 実
施例１ではホトレジストインキにネガタイプを使ったた
め、ホトレジストインキ上に銅粉が付着した場合はその
部分に光が当らないので現像時その部分はホトレジスト
が残り、パターンショートの原因となる。 これに対
しホトレジストインキにポジタイプを使った場合には逆
なので、銅粉の付着した部分はピンホールとなる。Pattern shorts were significantly reduced by the present invention. In Example 1, a negative type photoresist ink was used, so if copper powder adhered to the photoresist ink, light would not hit that area, so photoresist would remain in that area during development, causing a pattern short. On the other hand, when positive type photoresist ink is used, the opposite is true, and the areas where the copper powder is attached become pinholes.
表 １
〈発明の効果〉
本発明は以上説明したように構成されているので、本発
明のＴＡＢ用テープキャリアはパターンショートの発生
が少い。Table 1 <Effects of the Invention> Since the present invention is constructed as described above, the TAB tape carrier of the present invention has fewer pattern shorts.
また、銅箔表面の研磨処理は、粗化処理の前段でインラ
インで行うことかできるので、コストアップを回避でき
る。Moreover, since the polishing treatment of the surface of the copper foil can be performed in-line before the roughening treatment, an increase in cost can be avoided.
第１図は、ＴＡＢ用テープキャリアの平面図である。
第２図は、第１図におけるパターン部分の断面図である
。
第３図は、パターンショートを説明するための斜視図で
ある。
第４図は、根のこりショートを説明するための斜視図で
ある。
符号の説明
１・・・ＴＡＢ用テープキャリア、
２・・・銅箔、
３・・・絶縁フィルム、
３ａ・・・デバイスホール、
３ｂ・・・パイロットホール、
４・・・接着剤、
５・・・パターンショート部（パターンつなかり ）
、
６・・・根のこり（銅のこり）ショート郡代
理
人FIG. 1 is a plan view of a TAB tape carrier. FIG. 2 is a sectional view of the pattern portion in FIG. 1. FIG. 3 is a perspective view for explaining pattern short. FIG. 4 is a perspective view for explaining root stiffness short circuit. Explanation of symbols 1...Tape carrier for TAB, 2...Copper foil, 3...Insulating film, 3a...Device hole, 3b...Pilot hole, 4...Adhesive, 5...・Pattern short section (pattern connection)
, 6...Copper Root Agent, Short County Agent
Claims (2)
ープキャリアにおいて、前記圧延銅箔の前記絶縁フィル
ムに接触しない側の表面が湿式処理方法にて研磨処理を
施したものであることを特徴とするＴＡＢ用テープキャ
リア。(1) In a TAB tape carrier comprising a rolled copper foil and an insulating film, the surface of the rolled copper foil on the side not in contact with the insulating film is polished using a wet processing method. Features of TAB tape carrier.
的研磨方法である請求項１記載のＴＡＢ用テープキャリ
ア。(2) The TAB tape carrier according to claim 1, wherein the wet processing method is a chemical and/or mechanical polishing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2140314A JP2527076B2 (en) | 1990-05-30 | 1990-05-30 | Tape carrier for TAB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2140314A JP2527076B2 (en) | 1990-05-30 | 1990-05-30 | Tape carrier for TAB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0433351A true JPH0433351A (en) | 1992-02-04 |
| JP2527076B2 JP2527076B2 (en) | 1996-08-21 |
Family
ID=15265924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2140314A Expired - Lifetime JP2527076B2 (en) | 1990-05-30 | 1990-05-30 | Tape carrier for TAB |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2527076B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009125040A (en) * | 2007-11-27 | 2009-06-11 | Panasonic Electric Works Co Ltd | Plant house |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52124865A (en) * | 1976-04-13 | 1977-10-20 | Sharp Corp | Semiconductor device |
| JPS62200796A (en) * | 1986-02-27 | 1987-09-04 | イビデン株式会社 | Manufacture of extra-thin copper laminated board |
| JPS6426175A (en) * | 1986-12-26 | 1989-01-27 | Toshiba Corp | Test data preparing system for logic integrated circuit |
| JPH0282546A (en) * | 1988-09-19 | 1990-03-23 | Sharp Corp | Film carrier substrate |
-
1990
- 1990-05-30 JP JP2140314A patent/JP2527076B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52124865A (en) * | 1976-04-13 | 1977-10-20 | Sharp Corp | Semiconductor device |
| JPS62200796A (en) * | 1986-02-27 | 1987-09-04 | イビデン株式会社 | Manufacture of extra-thin copper laminated board |
| JPS6426175A (en) * | 1986-12-26 | 1989-01-27 | Toshiba Corp | Test data preparing system for logic integrated circuit |
| JPH0282546A (en) * | 1988-09-19 | 1990-03-23 | Sharp Corp | Film carrier substrate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009125040A (en) * | 2007-11-27 | 2009-06-11 | Panasonic Electric Works Co Ltd | Plant house |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2527076B2 (en) | 1996-08-21 |
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