JPH04333600A - ニッケルイオン蓄積が減少されたニッケル電気メッキ処理 - Google Patents

ニッケルイオン蓄積が減少されたニッケル電気メッキ処理

Info

Publication number
JPH04333600A
JPH04333600A JP3301226A JP30122691A JPH04333600A JP H04333600 A JPH04333600 A JP H04333600A JP 3301226 A JP3301226 A JP 3301226A JP 30122691 A JP30122691 A JP 30122691A JP H04333600 A JPH04333600 A JP H04333600A
Authority
JP
Japan
Prior art keywords
anode
nickel
current
bath
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3301226A
Other languages
English (en)
Japanese (ja)
Inventor
Robert A Tremmel
ロバート・エー・トレンメル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone Inc
Enthone OMI Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Inc, Enthone OMI Inc filed Critical Enthone Inc
Publication of JPH04333600A publication Critical patent/JPH04333600A/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
JP3301226A 1990-10-22 1991-10-22 ニッケルイオン蓄積が減少されたニッケル電気メッキ処理 Pending JPH04333600A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US60886990A 1990-10-22 1990-10-22
US07/608,869 1990-10-22

Publications (1)

Publication Number Publication Date
JPH04333600A true JPH04333600A (ja) 1992-11-20

Family

ID=24438391

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3301226A Pending JPH04333600A (ja) 1990-10-22 1991-10-22 ニッケルイオン蓄積が減少されたニッケル電気メッキ処理

Country Status (8)

Country Link
JP (1) JPH04333600A (it)
CA (1) CA2053342A1 (it)
DE (1) DE4134656C2 (it)
ES (1) ES2034897B1 (it)
FR (1) FR2668173A1 (it)
GB (1) GB2249107A (it)
IT (1) IT1249854B (it)
SE (1) SE9103061L (it)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4229917C1 (en) * 1992-09-08 1993-07-15 Lpw-Anlagen Gmbh, 4040 Neuss, De Electrolytic bath for meter coating - has sec. anode contg. alkaline or ammonium soln. with acid added to electrolyte to compensate for pH rise

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4943876A (it) * 1972-09-01 1974-04-25
JPS558493A (en) * 1978-07-05 1980-01-22 Mazda Motor Corp Nickel recovery system of nickel plating apparatus
JPS56112500A (en) * 1980-02-09 1981-09-04 Ebara Yuujiraito Kk Method for electroplating

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2393516A (en) * 1943-08-19 1946-01-22 Indiana Steel & Wire Company Process for electroplating
US2504238A (en) * 1945-07-13 1950-04-18 Int Nickel Co Anode assembly
BE564995A (it) * 1957-02-20
DE1250712B (de) * 1963-05-22 1967-09-21 International Nickel Limited, London Galvanisches Nickelsulfamatbad und Verfahren zum Abscheiden von Nickeluberzugen
US3374154A (en) * 1965-07-12 1968-03-19 Int Nickel Co Electroforming and electrodeposition of stress-free nickel from the sulfamate bath
US3474011A (en) * 1967-08-03 1969-10-21 American Bank Note Co Electroplating method and apparatus
US4466865A (en) * 1982-01-11 1984-08-21 Omi International Corporation Trivalent chromium electroplating process
DE3347593A1 (de) * 1983-01-03 1984-07-05 Omi International Corp., Warren, Mich. Waessriger alkalischer cyanidfreier kupferelektrolyt und verfahren zur galvanischen abscheidung einer kornverfeinerten duktilen und haftfesten kupferschicht auf einem leitfaehigen substrat
US4469569A (en) * 1983-01-03 1984-09-04 Omi International Corporation Cyanide-free copper plating process
JPS63317698A (ja) * 1987-06-20 1988-12-26 Toyota Motor Corp 電気めっき液の金属イオン濃度と水素イオン濃度の制御装置
US4778572A (en) * 1987-09-08 1988-10-18 Eco-Tec Limited Process for electroplating metals
US4933051A (en) * 1989-07-24 1990-06-12 Omi International Corporation Cyanide-free copper plating process

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4943876A (it) * 1972-09-01 1974-04-25
JPS558493A (en) * 1978-07-05 1980-01-22 Mazda Motor Corp Nickel recovery system of nickel plating apparatus
JPS56112500A (en) * 1980-02-09 1981-09-04 Ebara Yuujiraito Kk Method for electroplating

Also Published As

Publication number Publication date
CA2053342A1 (en) 1992-04-23
IT1249854B (it) 1995-03-28
ITTO910789A0 (it) 1991-10-18
DE4134656C2 (de) 1994-02-03
ES2034897A1 (es) 1993-04-01
ITTO910789A1 (it) 1993-04-18
FR2668173A1 (fr) 1992-04-24
GB9122383D0 (en) 1991-12-04
SE9103061D0 (sv) 1991-10-21
DE4134656A1 (de) 1992-04-23
GB2249107A (en) 1992-04-29
SE9103061L (sv) 1992-04-23
ES2034897B1 (es) 1994-04-16

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