JPH04334568A - Bond application device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention relates to a bond coating device.
In this system, a dispenser applies a trial coat of bond to a trial coating table, and this is observed with a camera to determine whether the amount of bond applied is appropriate.

0002

2. Description of the Related Art As a means for applying a bond for adhering electronic components to a substrate, it is known to apply the bond to a predetermined coordinate position on the substrate while moving a dispenser using a moving table.

0003

However, the amount of bond applied by a dispenser tends to vary over time. For example, when the coating operation is restarted after stopping the operation of the apparatus for a long time, the amount of bond applied tends to be excessive at the beginning of the restart, especially in the first shot. Further, while applying the bond for a long time, the amount of bond stored inside the dispenser gradually decreases, but as the amount of bond applied decreases, the hydraulic pressure also decreases, and the amount applied gradually decreases. If the amount of bond applied varies in this way, electronic components will have poor adhesion.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a bond coating apparatus equipped with means for monitoring the amount of bond applied.

[0005]

[Means for Solving the Problem] To this end, the present invention provides a substrate positioning section, a dispenser that is driven by a moving table to apply bond to the substrate, and a dispenser that is driven by a moving table to apply bond to the substrate, and a A bond coating device is constituted by a trial coating table which is arranged to test bond at multiple points using the dispenser, and a camera which is driven by a moving table to observe the bond applied on the trial coating table. .

[0006]

[Operation] In the above structure, a suitable amount of bond is applied to the trial application table, and this is observed with a camera to judge whether the amount of bond applied is too much or too little. For example, if the amount of bond applied is too large, trial application is repeated until the amount of bond applied becomes appropriate, and if the amount of bond applied is too small, the dispenser is refilled with bond.

[0007]

Embodiments Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of a bond coating device. 1
is a substrate, which is clamped and positioned by positioning members 2 and 3. 7 is a conveyor for conveying substrates. One positioning member 2 is supported by a fixed bracket 4. Further, the other positioning member 3 is supported by a movable bracket 9. This movable bracket 9 adjusts the distance between the positioning members 2 and 3 according to the width of the substrate 1 by a moving means consisting of a ball screw 5 and a motor 6.

Reference numeral 10 denotes a bond coating means, which includes an XY table 11 as a moving table, and this XY table 1.
It consists of a dispenser 12 and a camera 13 held at 1. Bond is stored in the dispenser 12, and by applying gas pressure through the tube 14,
Bond B from the nozzle 12a at the lower end of the dispenser 12
is applied onto the substrate 1.

Reference numeral 8 denotes a trial application table for bond B, which is disposed on the side of the positioning member 2 on the fixed side and parallel to the positioning member 2 (see also FIG. 2). In this embodiment, the table 8 has a long plate shape and is integrally attached to the bracket 4.

In the above configuration, before applying bond B to the substrate 1, the XY table 11 is driven, and the dispenser 12 applies the bond B to the table 8 on a trial basis.
The applied bond B is observed with a camera 13 to determine whether the applied amount is appropriate.

As described above, when the coating operation is restarted after the installation operation has been stopped for a long time, the amount of bond applied tends to be excessive at the beginning of the restart, especially in the first shot. Therefore, in such a case, the bond B is trial coated on the table 8, and the bond B is observed with the camera 13 to determine whether the coating amount is appropriate or not. This trial application and observation using the camera 13 are repeated until the amount of bond B applied becomes appropriate. Then, when the amount of bond B applied becomes appropriate, bond application to the substrate 1 is started. In addition,
A computer (not shown) that controls the dispenser 12 and camera 13 determines whether the amount of bond applied is appropriate.

Furthermore, while applying the bond for a long time, the amount of the bond B stored inside the dispenser 12 gradually decreases, but as the amount of bond B decreases,
The liquid pressure also decreases, and the amount applied gradually decreases. Therefore, during bond application to the substrate 1, the dispenser 12 is brought onto the table 8 at appropriate times, the bond B is applied onto the table 8, and the bond B is observed with the camera 13 to monitor whether the amount of application is appropriate. If the amount of bond B applied is too small, the gas pressure applied to the inside of the dispenser 12 is increased via the tube 14, or the dispenser 12 is replenished with bond B.

As explained above, according to the present apparatus, the amount of bond applied is appropriately monitored before or during bond application to the substrate 1, and if the amount of applied bond is too large or too small,
The application amount can be adjusted by taking measures such as adjusting the gas pressure applied to the inside of the dispenser 12. Further, as shown in FIG. 3, by trial-coating the bond B on the table 8, the operator can visually check the change in the bond coating amount over time.

In the above embodiment, the table 8 is provided on the side of the positioning member 2 on the fixed side, but the point is that the table 8 is provided near the substrate 1 positioned on the positioning members 2 and 3. The movement strokes of the dispenser 12 and camera 13 up to 8 may be shortened to improve work efficiency.

[0016]

As explained above, the present invention has a substrate positioning section, a dispenser driven by a moving table to apply bond to the substrate, and a dispenser disposed near the substrate positioned at the positioning section. The bond coating device is composed of a trial coating table for trial coating multiple points of bond by the dispenser, and a camera driven by a moving table to observe the bond trial coated on the trial coating table. Bond can be applied to the substrate while monitoring the appropriateness of the amount of bond applied.

[Brief explanation of drawings]

[Fig. 1] A perspective view of a bond coating device according to the present invention.

[Figure 2]
Side view of essential parts of the bond coating device according to the present invention

FIG. 3 is a plan view of a trial coating table according to the present invention.

[Explanation of symbols]

1 Board 2 Positioning part 3 Positioning part 8 Trial application table 10 Bond application means 11. Moving table 12 Dispenser 13. Camera

Claims (1)

[Claims] 1. A positioning unit for a substrate; a dispenser driven by a moving table to apply a bond to the substrate;
A trial application table is disposed near the substrate positioned in the positioning section, and the dispenser is used to test apply multiple points of bond, and the test application table is driven by a moving table to observe the trial application of the bond on the trial application table. A bond coating device characterized by comprising a camera.