JPH04335547A - Bonding device - Google Patents

Abstract

PURPOSE:To provide a bonding device for easily regulating a parallelism of a pressurizing surface and a placing surface. CONSTITUTION:A presser 2 has two bonding tools 12, 14 which have linear pressurizing surfaces 12a, 14a. The surfaces 12a, 14a of the tools 12, 14 are disposed in parallel, and adjusted at a predetermined interval. The entirety of the presser 2 is rotatable at 90 degrees. Parallelisms of the surfaces 12a, 14a and a placing surface 4a are regulated by regulating the inclining angles of the surfaces 12a, 14a of the tools 12, 14 in one-dimensional manner by parallelism regulating mechanisms 16, 16. The tools are deviated at 90 degrees, and pressed twice thereby to connect leads to pads.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus used, for example, in an inner lead bonding process for bonding electrodes of an IC chip and leads of a film carrier.

0002

[Prior art] TAB (Tape Automated
Bonding technology is one of the IC chip mounting technologies, and has features such as being able to form leads with a larger number of pins and a narrower pitch than other mounting technologies, and being able to perform high-speed automatic bonding with a face-up method. Because of this, it has received particular attention in recent years.

[0003] The inner lead bonding process is TAB.
This is the first stage of the packaging process, and connects the electrodes of the IC chip and the leads of the film carrier via bumps. Usually, a transfer bump method is used in which bumps are transferred to the lead tips of a film carrier in advance, and then the bumps and the electrodes of the IC chip are bonded by pressure and heat. This method has a simple bump-forming process and requires simple manufacturing equipment, so the mounting cost is lower than other methods.

FIG. 2 is a schematic diagram of a conventional bonding apparatus used in the inner lead bonding process. The bonding apparatus shown in FIG. 2 includes a bonding tool 112 that presses an IC chip 32, a mounting table 104 that places the IC chip 32, and a pressure surface 112a of the bonding tool 112 parallel to a mounting surface 104a of the mounting table 104. This includes a parallelism adjustment mechanism 116 for adjusting the parallelism, and a heating mechanism (not shown) for the bonding tool 112. The pressurizing surface 112a of the bonding tool 112 is formed into a substantially square planar shape.

[0005] Such a bonding apparatus uses a bonding tool 112 having a flat pressure surface 112a.
By pressing the film carrier and the IC chip 32 placed on the mounting table 104, a large number of leads 36 and electrodes 38 can be bonded all at once via the bumps 42, allowing for quick bonding work. It becomes possible.

[0006]

[Problems to be Solved by the Invention] By the way, in order to uniformly and accurately bond a large number of electrodes 38 and leads 36 arranged in a substantially square shape, it is necessary to press the pressure surface of the bonding tool 112 that presses them during bonding. 112a on the mounting table 104
It must abut parallel to the mounting surface 104a of the. Therefore, before work, the mounting surface 104a of the mounting table 104 and the pressure surface 11 of the bonding tool 112 are
It is necessary to adjust the parallelism with 2a. However, this work is extremely difficult as it requires adjusting the parallelism between the surfaces.Especially as the chip size increases, highly accurate parallelism is required, even if you are an expert. There was also the problem that adjustment work took time.

[0007]Furthermore, recently, it has become necessary to process many types of IC chips with different chip sizes using one bonding device. For this reason, each time the chip size changes, the bonding tool etc. must be replaced to accurately adjust the parallelism, which has caused a problem in that the work efficiency of conventional bonding apparatuses is extremely poor.

The present invention has been made based on the above-mentioned circumstances, and an object of the present invention is to provide a bonding device that can easily adjust the parallelism between a pressurizing surface and a mounting surface.

[0009]

[Means for Solving the Problems] A bonding device according to the present invention for achieving the above object is capable of bonding a terminal formed on a film, which is a pressed object, and an electrode of a semiconductor device by applying pressure on a mounting table. In a bonding apparatus, a pressing means has a pair of pressing surfaces formed linearly and parallel to each other, and each pressing surface of the pressing means is parallel to a mounting surface on which a pressed object of the mounting table is placed. The present invention is characterized in that it is provided with a parallelism adjustment means for adjusting the parallelism for each pressurizing surface.

[0010] It is also desirable to provide a parallel distance adjusting means for adjusting the distance between the pair of pressing surfaces of the pressing means. Further, it is desirable to provide a rotation means for shifting the relative positions of the pressing means and the pressed body by 90 degrees. Furthermore,
Two of the pressing means may be provided and the linear pressing surfaces may be arranged in a rectangular shape.

[0011]

[Operation] According to the present invention, the pressing surface of the pressing means is formed in a linear shape, so that when adjusting the parallelism between the pressing surface of the pressing means and the mounting surface of the mounting table, the parallelism can be adjusted. Since the inclination angle of each pressing surface of the pressing means can be adjusted in one direction (longitudinal direction) using the adjusting means, the parallelism between the pressing surface and the mounting surface can be maintained, compared to conventional devices that adjust the parallelism of the surfaces. Adjustments can be made easily and accurately.

[0012] Conventionally, when bonding objects to be pressed of different sizes, it was necessary to replace the pressing means, but in the present invention, a parallel spacing adjustment means that can adjust the distance between the two machined surfaces of the pressing means is provided. By providing this, it is possible to adjust the interval between pressing surfaces without replacing the pressing means. Furthermore, by providing the rotating means, even if the leads of the film and the electrodes of the semiconductor device, which are the object to be pressed, are formed on all four sides, the relative positions of the pressing means and the object to be pressed can be shifted by 90 degrees. By performing bonding twice, all the leads and electrodes formed on the four sides can be joined. Furthermore, two of the pressing means are provided,
In addition, by arranging the linear pressure surfaces in a rectangular shape, even if the leads of the film and the electrodes of the semiconductor device are formed on all four sides, all the leads and electrodes can be joined by one bonding. can do.

[0013]

[Embodiment] An embodiment of the present invention will be described below with reference to FIG. FIG. 1 is a schematic diagram of a bonding apparatus according to an embodiment of the present invention. In this embodiment, an inner lead bonding process in TAB technology is used, that is, a film carrier (consisting of a film 34 and a lead 36) in which a bump 42 is thermocompression bonded to the tip of a lead 36 and an IC.
The case where the chip 32 is bonded to the electrode 38 will be described.

The bonding apparatus shown in FIG. 1 includes a pressing device 2, a mounting table 4 on which an IC chip 32 is placed, and a mounting table 4.
It is constructed by comprising a pedestal 6 provided with a cradle 6. The pressing device 2 includes two bonding tools 12 and 14 having linear pressure surfaces 12a and 14a, pressure surfaces 12a and 14a of each bonding tool 12 and 14, and a mounting table 4.
Parallelism adjustment mechanism 16 that adjusts the parallelism with the mounting surface 4a of
, 16. The bonding tools 12 and 14 have built-in heaters (not shown) for heating their tips to approximately 500°C. two bonding tools 12,
The fourteen linear pressure surfaces 12a and 14a are arranged parallel to each other, and the distance between the bonding tools 12 and 14 can be freely adjusted by a parallel distance adjustment mechanism provided within the moving mechanism 50. Moreover, the pressing device 2 is configured to be rotatable by 90 degrees by a rotation mechanism provided within the moving mechanism 50. Note that the parallel spacing adjustment mechanism and rotation mechanism of the moving mechanism 50 are well-known techniques, so a detailed explanation thereof will be omitted.

An IC chip 32 is mounted on the mounting surface 4a of the mounting table 4.
A tape feeding mechanism (not shown) for horizontally moving the film carrier is provided above the mounting surface 4a. Further, a transfer mechanism (not shown) for transporting the IC chip 32 onto the mounting table 4 is provided around the mounting table 4 .

The IC chip 32 to be bonded has a substantially square shape, and electrodes 38 to be connected to the leads 36 are formed at the edges of the IC chip 32. Further, the bump 42 is on the lead 36 of the film carrier and is located on the electrode 3.
It is formed (or joined) at a position corresponding to 8.

Next, the procedure for mounting the IC chip 32 on the film carrier will be explained. Before actually performing the bonding work, as an adjustment work, the bonding tools 12, 1
4 and the mounting surface 4a of the mounting table 4 are adjusted. First, the IC to be bonded in advance
The distance between the bonding tools 12 and 14 is adjusted according to the size of the chip 32 by the parallel distance adjustment mechanism of the moving mechanism 50. Then, a pressure film for testing is placed on the mounting surface 4a of the mounting table 4, the pressure film is pressed with the bonding tools 12 and 14, and a spot where there is partial contact is found from the state of the color of the pressure film, and bonding is performed. Tool 12,
Adjust the tilt angle of 14. Since the pressure surfaces of the bonding tools 12 and 14 used in this embodiment are linear, this adjustment can be performed by moving the pressure surfaces 12a and 14a one-dimensionally. Further, even when the bonding tools 12 and 14 are rotated by 90 degrees by the moving mechanism 50, the parallelism between the pressure surfaces 12a and 14a and the mounting surface 4a is adjusted in the same way.

Electrode 38 of IC chip 32 and film 34
In order to bond the IC chip 32 to the leads 36 formed on the
4, and the film 34 is conveyed between the bonding tools 12, 14 and the IC chip 32 by a tape feeding mechanism. Thereafter, the heated bonding tools 12 and 14 are simultaneously lowered to press a pair of opposing sides of the film 34 and the IC chip 32, thereby bonding the electrodes 38 and leads 36 of the IC chip 32 via the bumps 42. Join. Then, the pressing device 2 is rotated 90 degrees by the moving mechanism 50, and the bonding tool 12 is rotated by 90 degrees.
, 14 press another set of opposing sides of the same film 34 and IC chip 32. In this way, a large number of leads 36 and ICs provided in one frame of the film 34 can be formed by pressing twice.
The operation of joining the chip 32 to the electrode 38 is completed. In the above example, a case has been described in which the two bonding tools 12 and 14 press simultaneously, but the two bonding tools 12 and 14 may be configured to press the IC chip 32 and the film 34 separately.

When one IC chip 32 is bonded, the next frame of the film 34 is transported by the tape feeding mechanism directly below the bonding tools 12, 14, and another IC chip 32 is transferred to the mounting table by the transporting means. 4 carried above. Then, the same steps as above are repeated.

In the bonding apparatus of this embodiment, since the bonding tools having two linear pressure surfaces are provided in parallel, it is not possible to bond all four sides of each frame of the film at once. , parallelism can be easily adjusted. In other words, the parallelism adjustment between the pressure surface of the bonding tool and the mounting surface of the mounting table is
Since the pressure surface of the bonding tool is linear, adjustment can be made by substantially moving the inclination angle of the pressure surface of the bonding tool one-dimensionally. Therefore, compared to conventional bonding apparatuses, parallelism adjustment is easier even when the adjustment is performed by a person other than an expert, and the adjustment time can also be shortened. Furthermore, since the adjustment is one-dimensional, it is possible to perform adjustment with high precision. Therefore, the bonding apparatus of this embodiment is also suitable for bonding large chips.

Furthermore, since the bonding apparatus of this embodiment is provided with a parallel spacing adjustment mechanism in the bonding tool moving mechanism 50, there is no need to replace the bonding tool when bonding IC chips of different chip sizes. All you have to do is change the distance between the two bonding tools. Therefore, even if the parallelism adjustment is to be performed again, it can be done easily, and work efficiency can be improved.

[0022] In the above embodiment, the case where the pressing device is configured to be rotatable has been explained, but the present invention is not limited to this, and the mounting table or the cradle may be configured to be rotatable. good.

Further, in the above embodiment, a case was explained in which two bonding tools were provided in parallel, but the present invention is not limited to this, and two pressing devices are provided to form a linear pressing surface. The bonding tools having the following shapes may be arranged in a rectangular shape. In this case as well, by providing an independent parallelism adjustment mechanism for each bonding tool,
Since the parallelism can be adjusted one-dimensionally, the adjustment work becomes easy, and each lead and electrode can be bonded all at once. In this case, there is no need to provide a rotation mechanism for the pressing device.

[0024]

As explained above, according to the present invention, by providing the pressing means having a linear pressing surface, the parallelism between the pressing surface of the pressing means and the mounting surface of the mounting table can be adjusted individually. Since it is only necessary to adjust the inclination angle of the pressing surface of the pressing means in one direction, it is possible to provide a bonding device that can easily adjust the parallelism and shorten the adjustment time compared to conventional devices.

[Brief explanation of drawings]

FIG. 1 is a schematic configuration diagram of a bonding apparatus that is an embodiment of the present invention.

FIG. 2 is a schematic configuration diagram of a conventional bonding apparatus.

[Explanation of symbols]

2 Pressing device 4 Placing table 4a Placing surface 6 Receiving tables 12, 14 Bonding tools 12a, 14b
Pressure surface 16 Parallelism adjustment mechanism 32 IC chip 34 Film 36 Lead 38 Electrode 42 Bump 50 Movement mechanism

Claims (4)

[Claims] Claim 1: In a bonding device that presses and bonds a terminal formed on a film, which is a pressed object, and an electrode of a semiconductor device on a mounting table, a pair of pressing surfaces formed linearly and parallel to each other is used. and a parallelism adjusting means for adjusting the parallelism between each pressing surface of the pressing means and the mounting surface on which the pressed object of the mounting table is placed for each pressing surface. bonding equipment. 2. The bonding apparatus according to claim 1, further comprising parallel distance adjusting means for adjusting the distance between the pair of pressing surfaces of said pressing means. 3. The bonding apparatus according to claim 1, further comprising rotation means for shifting the relative positions of the pressing means and the pressed body by 90 degrees. 4. The bonding apparatus according to claim 1, wherein two of the pressing means are provided and the linear pressing surfaces are arranged in a rectangular shape.