JPH04335706A - Piezoelectric vibrator and piezoelectric oscillator and their manufacture - Google Patents

Abstract

PURPOSE:To realize small sized and especially ultra-thin piezoelectric vibrator and piezoelectric oscillator at a low cost by batch processing. CONSTITUTION:A lower case 2 is provided with a recessed part 4 in which an AT crystal oscillation piece 3 is accommodated. The lower case 2 having a notch part 8 fitted to an end part 6 of the AT crystal oscillator piece 3 at an inner wall of a circumferential wall 5 with respect to the recessed part 4, a crystal oscillation board 9 connecting the plural AT crystal oscillator pieces 3 to a lower case board 1 connecting to plural frames 14, and plural upper case boards 15 connecting to an upper cases 16 are overlapped and sealed. Semiconductor elements are mounted on the surface of the crystal vibrator on the crystal vibrator board.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric vibrator and piezoelectric oscillator manufactured by batch processing, and a manufacturing method.

0002

2. Description of the Related Art A crystal resonator as an example of a conventional piezoelectric resonator will be explained with reference to the cross-sectional view of FIG. Lead frame 4
A crystal oscillator piece 42 was mounted on a crystal oscillator 6, a lead frame 46 was sandwiched between upper and lower case members 43 and 44 made of ceramic or the like, and the crystal oscillator was sealed with a low melting point glass 45.

As an example of a conventional piezoelectric oscillator, an example of a resin-molded crystal oscillator will be explained with reference to FIG. A semiconductor element 53 containing at least an oscillation circuit is fixed onto the island 52 of the lead frame with a conductive adhesive or the like. Au wires 54 and the like are connected from electrodes on the semiconductor element 53 to lead terminals 55 of the lead frame. A cylinder-shaped AT crystal resonator 56 is fixed to a crystal resonator connection terminal 57 of the lead frame, and the semiconductor element 5
It is connected to the oscillation circuit section of No.3. After that, the lead terminal 55
A crystal oscillator is constructed by resin molding by a transfer molding method or the like, leaving the outer part of the crystal oscillator. In the above-described assembly of the crystal oscillator, a semiconductor element and a single crystal resonator are mounted on a lead frame, and the crystal resonator is manufactured in advance in a separate process.

0004

[Problems to be Solved by the Invention] However, since conventional piezoelectric vibrators are manufactured individually using lead frames, a large number of piezoelectric vibrators cannot be batch-processed at the same time.
It has the disadvantage of being expensive. In addition, since there is no positioning mechanism on the lead frame, it is difficult to align the lead frame, and if it is fixed in a misaligned position, the impact resistance may deteriorate.
This leads to deterioration of vibration characteristics, etc.

Furthermore, since a lead frame is used, an extra internal space is required, and only a piezoelectric vibrator with a large external shape can be obtained.

In addition, conventional piezoelectric oscillators are manufactured in a process that incorporates a semiconductor element and a separate piezoelectric vibrator that has been assembled in advance, which increases the price, and because they are arranged on a lead frame, they are expensive. , requires a plane area,
This method has the disadvantage that only a large piezoelectric oscillator can be obtained, and is definitely disadvantageous for surface mounting, which requires particularly high-density mounting.

The piezoelectric vibrator, piezoelectric oscillator, and manufacturing method of the present invention have been made to solve the above problems.
The purpose is to provide a small and thin piezoelectric vibrator with excellent shock resistance, in which the piezoelectric oscillation piece is aligned in a case, at low cost through batch processing, and to process the manufacturing process of the piezoelectric vibrator. As an extension of the above, it is an object of the present invention to provide a piezoelectric oscillator that can be manufactured directly through batch processing.

[0008]

[Means for Solving the Problems] The piezoelectric vibrator manufacturing method of the present invention is such that the total thickness of the frame of the lower case substrate and the frame of the piezoelectric oscillation piece substrate is equal to the thickness of the piezoelectric oscillation piece, the maximum of each substrate. A lower case substrate and a piezoelectric oscillation piece substrate are used in which the thickness of either or both of the frame of the lower case substrate and the piezoelectric oscillation piece substrate is reduced so that the thickness is less than the sum of the thicknesses. Features.

In the piezoelectric vibrator of the present invention, a T-shaped notch is provided in the circumferential wall of the lower case substrate to accommodate the end portion of the piezoelectric oscillation piece and the continuous portion of the piezoelectric oscillation piece substrate. It is characterized by

The method of manufacturing a piezoelectric oscillator according to the present invention is characterized in that a semiconductor element having at least an oscillation circuit is placed on the surface of a piezoelectric vibrator manufactured by batch processing using a frame.

[0011] In the piezoelectric oscillator of the present invention, the shape of the external electrode is such that it functions as both a piezoelectric vibrator and a piezoelectric oscillator, so that both are connected at the same time, and the pattern is trimmed when used as a piezoelectric oscillator. The electrodes of the piezoelectric oscillator are configured by the following.

The resin-molded piezoelectric vibrator of the present invention is characterized in that a surface-mounted piezoelectric vibrator is fixed to a lead frame and then resin-molded.

The resin-molded piezoelectric oscillator of the present invention is characterized in that a surface-mounted piezoelectric oscillator is fixed to a lead frame and molded with resin.

[0014] The piezoelectric oscillator of the present invention is characterized in that a semiconductor element having at least an oscillation circuit is mounted on an element mounting part provided between the external electrodes of the case in which the piezoelectric oscillation piece is built. .

[0015] In the piezoelectric vibrator manufacturing method of the present invention, in a piezoelectric oscillation piece substrate formed by connecting a plurality of piezoelectric oscillation pieces to a frame, piezoelectric oscillation pieces arranged next to each other in a row,
It is characterized by the use of piezoelectric oscillation piece substrates that are connected in opposite directions.

The piezoelectric vibrator of the present invention is characterized in that the shape of the notch of the lower case and the connecting part of the crystal oscillation piece substrate is discontinuous, such as a wedge shape or a circle.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the piezoelectric vibrator of the present invention will be explained using a rectangular AT type crystal vibrator as an example, with reference to the assembled perspective view of FIG. Reference numeral 1 denotes a lower case substrate on which a plurality of lower cases 2 are arranged at equal intervals, and is formed by photolithography of glass, ceramic, crystal, single crystal silicon, or the like. The lower case 2 is provided with a recess 4 for accommodating the AT type crystal oscillation piece 3, and the end portion 6 of the AT type crystal oscillation piece 3 and the AT type crystal oscillation piece 3 are placed in a circumferential wall 5 formed by digging out the recess 4. A T-shaped notch 8 is formed to fit and accommodate the connecting portion 7 .

A plurality of AT type crystal oscillation pieces 3 are formed on the crystal oscillation piece substrate 9 by photolithography. What is characteristic here is that the AT type crystal oscillator piece 3 is
As shown in FIG.
The AT is fixed at every other adjacent AT.
The group of type crystal oscillation pieces is fixed to another opposing plate 11 by a connecting portion 7. By cutting at the cutting portion 13 of the frame 12, the crystal oscillation piece substrates 9 each have one space. Then, the gap between the AT type crystal oscillator pieces 3 is
If the center spacing between the lower case substrate 1 and the lower case 2 is made equal, then when the lower case substrate 1 and the crystal oscillation piece substrates 9 with one space between them are superimposed, their plane positions will coincide. Further, by etching the frame 14 of the lower case substrate 1 to reduce its thickness, the AT type crystal oscillation piece 3 is incorporated into the lower case 2. Note that by digging the notch 8 and the frame 14 of the lower case board 1 by the same thickness as the crystal oscillation piece board 9, or by making the wall thickness thinner, the surface of the circumferential wall 5 and the AT type after assembly are formed. The surfaces of the crystal oscillation pieces 3 can be made to coincide with each other.

The upper case board 15 has a plurality of upper cases 16 arranged at the same pitch as the lower cases 2 arranged on the lower case board 1 to ensure a space for oscillating the AT type crystal oscillator piece 3. In order to do this, a recess 17 is formed and the same material as the lower case substrate 1 is processed by photolithography.

After overlapping the crystal oscillation piece substrate 9 and the upper case substrate 15 on the lower case substrate 1, they are sealed and fixed. In this state, the AT type crystal oscillation piece 3 is subjected to oscillation frequency adjustment using an excimer laser or the like, and then a characteristic test is performed.

Since the AT type crystal resonator is completed in this state, the A
A T-type crystal resonator is broken off and used as a single component.

Next, an embodiment of the piezoelectric oscillator according to the present invention will be described with reference to an assembled perspective view of FIG. 3, taking as an example a crystal oscillator using an AT type crystal resonator.

Reference numeral 18 denotes an AT type crystal resonator substrate before the AT type crystal resonator described above is separated from the frame. Here, a semiconductor element 19 having an oscillation circuit therein is fixed to the center of the lower case 2 side using an adhesive or the like. After that, conduction is established by wire bonding, gang bonding, etc., conductive connection is made with the AT type crystal oscillator piece and conductive connection with the external electrode, and the top of the semiconductor element 19 is sealed with resin dipping, etc., and the crystal oscillator is activated. Can be assembled. Thereafter, after performing a characteristic test on the frame, only non-defective products are broken off from the frame to complete the crystal oscillator. As is, a surface-mounted crystal oscillator is completed, but in order to protect the sealing part, in addition to the external electrode part,
A resin coating or the like may be applied. Furthermore, if a dip package or the like is required, the crystal oscillator 20 may be placed on a lead frame 21 as shown in FIG. 4, and then encapsulated in resin by a transfer molding method or the like.

Above, one embodiment of the piezoelectric vibrator and piezoelectric oscillator of the present invention has been explained using a crystal resonator and a crystal oscillator as an example, but below, supplementary explanation will be added in order to embody the present invention. .

First, in FIG. 1, the shape of the notch 8 is T-shaped, but the reason for this is that if, as shown in FIG.
If the end portion 26 of the AT-type crystal oscillation piece 23 is entirely exposed to the end face of the lower case 22, it will be difficult to seal the end portion 26 of the AT-type crystal oscillation piece 23 with the notch 28 of the lower case 22 during sealing. This is because the risk of leakage after sealing increases as a result of the increased sealing area at the end of the capacitor, but the structure shown in FIG. 5 may be adopted as long as the sealing is performed carefully.

In addition, in order to improve reliability during sealing, the shape of the notch 38 of the lower case 32 and the connecting part 37 of the AT type crystal oscillation piece 33 has been changed from a rectangular parallelepiped shape, as shown in FIG. When viewed from above, it has a wedge shape as shown in Figure 5(a),
It is preferable to combine the circular shapes shown in FIG. 5(b) to form a discontinuous type, and to improve the sealing performance by brazing or the like. Note that when sealing the lower case 32 and the AT type crystal oscillator piece 33, force is applied to each frame in the length direction of the AT type crystal oscillator piece so that the sealing portions are in closer contact with each other. It's good to stop.

[0027] If a metal such as Cr or gold is formed in advance on the sealing portion by vapor deposition, sputtering, etc., the surroundings of the filler etc. will be improved.

Heat resistance is required for the sealing material when it is used as a surface-mounted resonator, so filler materials such as lead and tin alloys with a high lead content, AuSu alloys, low melting point glass, etc. When a single crystal silicon or the like is used for the lower case 2, the AT type crystal oscillation piece 3 may be directly fixed using an anodic bonding method or the like.

Next, how to connect the excitation electrode of the AT type crystal oscillation piece 3 to the external electrode will be described.

The connecting portion 7 of the AT type crystal oscillator piece 3 is designed for sealing, but the notch 8 of the lower case 2
A fixed electrode 24 is formed at a portion that holds the end of the AT type crystal oscillation piece 3 . The electrode extending from the excitation electrode of the AT-type crystal oscillation piece 3 is arranged at a position facing the fixed electrode 24, and conduction is established at the same time when the AT-type crystal oscillation piece 3 is sealed in the lower case 2. A conductive filter material or the like is previously formed on the fixed electrode 24 so that it can be removed.

From the fixed electrode 24 to the external electrode on the outside of the lower case 2, depending on the material of the lower case 2, a through hole is used if glass is used, a through hole is used if ceramic is used, or a conductive material is used when using a green sheet. If the conductive layer, silicon substrate, or the like is mixed, the impurity is directly diffused to make it conductive, and the connection is made through the bottom surface of the lower case 2.

In the case of using a piezoelectric oscillator, the number of external electrodes is increased, two connecting portions connected to the excitation electrode are passed through, and connected to the semiconductor element 19 provided on the opposite side of the lower case 2. Connect the output terminal, plus/minus terminals, control terminal, etc. to external electrodes.

FIG. 3 shows the structure of the external electrode of the piezoelectric oscillator, and how to develop it starting from the external electrode of the piezoelectric vibrator will be explained.

[0034] On the lower case 2, metal is attached to the back surface by sputter deposition or the like, or external electrodes 2 are formed by lamination.
7 is formed, but when used as a piezoelectric vibrator,
A connection electrode 29 connected to the excitation electrode is connected to one of the external electrodes 27. Two external electrodes 27 are connected near the connection point 30 .

Next, after the piezoelectric vibrator is completed, if it is to be used as a piezoelectric oscillator, a measuring device is connected to the external electrode 27,
The semiconductor device 19 is checked in advance for poor characteristics such as oscillation frequency, and the semiconductor device 19 is fixed to the semiconductor device mounting portion 31 after removing the device with poor characteristics. At this time, if gang bonding is performed, it will be directly connected to the terminal connected to the peripheral external electrode 27. At this time, the connection electrode 29 connected to the excitation electrode is also connected at the same time. Thereafter, by trimming the connection electrode 29 connected to the external electrode 27 and the connection point 30 of the external electrode 27 using a laser or the like, a piezoelectric oscillator having four external electrodes 27 in this example can be easily obtained. Note that in order to prevent the height of the external electrode 27 after completion from being lower than the height of the semiconductor element mounting part 31, the height of the semiconductor element mounting part 31 is made lower than the height of the external electrode 27 in advance.
It is preferable to configure the resin to be injected after C is placed.

When using as a piezoelectric vibrator, there is a risk of short circuits if the electrodes near the IC mounting part are left exposed on the surface, so do not place the IC on the IC mounting part. It is better to inject resin or remove unnecessary parts by etching or the like.

In the above description of the piezoelectric vibrator manufacturing method, the lower case substrate, the crystal oscillation piece substrate, and the upper case substrate have been explained in batch form, but the present invention is not limited to this. For example, in the case of an AT crystal oscillator piece, it may be manufactured individually by machining, so in that case, the notch should not be T-shaped, but only the end of the AT crystal oscillator piece should be held. As a modification, only the AT crystal oscillation piece may be set in an individual operation, and the other processes may be batch processed. This is the same for any part of any other process, and may be an individual process for supplying individual parts as necessary. If individual parts are used, they can be manufactured using recent automated machinery such as robots without increasing the number of man-hours.

The embodiments of the piezoelectric vibrator and piezoelectric oscillator of the present invention have been described above using a crystal resonator as an example, but the crystal oscillation piece may be a rectangular AT crystal oscillation piece, a tuning fork type, or a circumferential one. Various types such as longitudinal vibration type with a shaped frame, contour vibration type such as GT, and surface acoustic wave type such as SAW resonator can be implemented, and the material is not limited to crystal. Ceramic, LiTaO3, LiNb
It is also possible to implement piezoelectric vibrators and piezoelectric oscillators using other materials such as O3.

As described above, it is possible to manufacture a plurality of piezoelectric vibrators and piezoelectric oscillators at the same time through batch processing, and the dimensions of the lower case and upper case are designed to maintain a slight clearance from the dimensions of the piezoelectric oscillator piece. Therefore, the thickness is minimal in both the length and width directions, and the thickness is 0.3 to 0.
A piezoelectric vibrator and piezoelectric oscillator with a diameter of about 5 mm that can be mounted on an IC card or the like can be obtained.

Although it is difficult to assemble a piezoelectric oscillator piece into a container with a small clearance while maintaining clearance in all directions, in the present application, a cutter that fits into the end of the piezoelectric oscillator piece is installed in the container. having a deficiency, and
In particular, regarding positioning in the thickness direction, when the lower case substrate, piezoelectric oscillation piece substrate, and even upper case substrate are joined together with each frame, the piezoelectric oscillation piece can be assembled while being held in the frame. This makes it possible to hold the piezoelectric oscillator pieces in parallel in the container, resulting in a piezoelectric vibrator and piezoelectric oscillator with excellent impact resistance.

[0041]

The piezoelectric vibrator, piezoelectric oscillator, and manufacturing method of the present invention described above have the following effects. (1) So that the total thickness of the frame of the lower case board and the frame of the piezoelectric oscillation piece board is less than the sum of the maximum thicknesses of each board by the thickness of the piezoelectric oscillation piece.
This method of manufacturing a piezoelectric vibrator is characterized by using a lower case substrate in which the thickness of either or both of the frame of the lower case substrate and the frame of the piezoelectric oscillation piece substrate is reduced, and the piezoelectric oscillation piece substrate. Even though it is a type that houses a piezoelectric oscillation piece inside, batch processing is possible, and a low-cost piezoelectric vibrator can be obtained. Furthermore, by matching the thickness of the frame, it becomes possible to house the piezoelectric oscillation pieces in parallel in the case, improving mechanical properties such as impact resistance. (2) It is a piezoelectric vibrator characterized in that a T-shaped notch is provided in the circumferential wall of the lower case of the lower case substrate, and the end of the piezoelectric oscillation piece and the connecting part of the piezoelectric oscillation piece substrate are accommodated. , as a result of the end of the piezoelectric oscillation piece being fitted into the notch in the lower case,
As a result of positioning being carried out between the case and the oscillating piece itself, positioning is easy and accurate and can be manufactured with a minimum clearance, resulting in a piezoelectric vibrator that is smaller and thinner.

[0042] Furthermore, it becomes possible to fit the connecting portions in the same way and seal them to the circumferential wall of the case, and the area of the sealing itself becomes smaller, so that the reliability of the sealing becomes higher. Also, (1)
When the piezoelectric oscillation piece is housed in the lower case with the configuration of
The height of the circumferential wall of the lower case and the connecting part of the piezoelectric oscillation piece is equal, eliminating airtight leakage when sealing the upper case, resulting in a piezoelectric vibrator with improved sealing reliability. . (3) Since the method for manufacturing a piezoelectric oscillator is characterized in that a semiconductor element having at least an oscillation circuit is placed on the surface of a piezoelectric vibrator manufactured by batch processing using a frame, after the piezoelectric vibrator process, A piezoelectric oscillator can be easily obtained by simply mounting a semiconductor element on a piezoelectric vibrator positioned on a frame. Furthermore, the form is a small and thin surface-mounted piezoelectric oscillator, which is the most suitable form for high-density mounting, which will increase in the future. Further, since a semiconductor element can be mounted on the surface of only a good quality piezoelectric vibrator, a piezoelectric oscillator can be obtained at low cost without reducing the yield of the piezoelectric oscillator. Similarly, since only a small number of parts and man-hours are used after the piezoelectric vibrator process, the cost of the process is also low. Furthermore, inspections and the like can be performed in batches, resulting in even lower costs. (4) The external electrode is configured to have a common shape so that it can function as both a piezoelectric vibrator and a piezoelectric oscillator, and when used as a piezoelectric oscillator, the pattern can be trimmed to form an electrode of the piezoelectric oscillator. Since the piezoelectric oscillator is characterized in that it is configured, it is possible to easily create a piezoelectric vibrator and a piezoelectric oscillator separately. (5) It is a resin-molded piezoelectric vibrator, which is characterized by fixing a surface-mount piezoelectric vibrator to a lead frame and applying resin molding, so it is a surface-mount type that has external electrodes on a flat surface on the lead frame. Since the piezoelectric vibrators are simply overlapped and resin molded, positioning during mounting is easy, and a resin molded piezoelectric vibrator having a highly reliable connection part can be obtained at low cost.

Furthermore, as a result of incorporating a piezoelectric vibrator having a small and thin external shape, the external dimensions of the resin molded piezoelectric vibrator can also be made smaller and thinner.

This means that the thickness of the vibrator of the present invention is 0.5 [
mm] or less, but the diameter of a cylinder type vibrator is usually 3 mm.
[mm], it will be understood how the resin-molded piezoelectric vibrator of the present invention can be made thinner.

[0045] When fixing a cylinder type vibrator to a lead frame, the leads of the same vibrator are fixed to the lead frame by welding, etc., but since an area for welding is required, a resin molded vibrator is used. However, the resin molded piezoelectric vibrator of the present invention has a larger external shape, and the need to use a jig to set up the round vibrator, which is difficult to align, increases man-hours and costs. It can be seen that the external size is small and the cost is low. (6) It is a resin molded piezoelectric oscillator, which is characterized by a surface-mounted piezoelectric oscillator fixed to a lead frame and molded with resin, so it is a surface-mounted piezoelectric oscillator that has external electrodes on a flat surface on the lead frame. Since resin molding is performed by simply overlapping the two, positioning during mounting is easy, and a resin molded piezoelectric oscillator having a highly reliable connection part can be obtained at low cost.

Furthermore, as a result of incorporating a piezoelectric oscillator with a small and thin external shape, the external dimensions of the resin molded piezoelectric oscillator can also be made smaller and thinner.

This means that the thickness of the vibrator of the present invention is 0.5 [
mm] or less, but the diameter of a cylinder type vibrator is usually 3 mm.
[mm], it will be understood how the resin mold type piezoelectric oscillator of the present invention can be made thinner.

[0048] When fixing a cylindrical resonator to a lead frame, the leads of the resonator are fixed to the lead frame by welding, etc., but since an area for welding is required, it is difficult to use a resin molded oscillator. The external shape is larger as shown in Figure 8, and the resonator is round and difficult to align.
Although setting using a jig or the like increases the number of man-hours and increases the cost, it can be seen that the resin molded piezoelectric oscillator of the present invention has a small external size and is low in cost.

In addition, in conventional piezoelectric oscillators, the semiconductor element and the piezoelectric vibrator are arranged offset on a plane, so the length direction is long, but this piezoelectric oscillator is longer than the surface-mounted piezoelectric vibrator. Since the piezoelectric oscillator of the same size is built-in, the lengthwise dimension is reduced to one-third or less of the conventional size, making it ultra-compact. (7) Since the piezoelectric oscillator is characterized in that at least an oscillation circuit is mounted on the element mounting portion provided between the external electrodes of the case in which the piezoelectric oscillation piece is built-in, the external electrode and the semiconductor element and The distance between the piezoelectric oscillation pieces becomes the shortest, and a piezoelectric oscillation piece that is resistant to noise can be obtained. Furthermore, for the same reason, the distributed capacitance added to the piezoelectric oscillator piece is minimized, so that a piezoelectric oscillator capable of oscillating up to extremely high frequencies can be obtained. Furthermore, since the output length is also the shortest, the noise emitted by the piezoelectric oscillator is also reduced, which has the effect of simplifying the noise countermeasures in the mounting device that are required as the frequency becomes higher.

Furthermore, since the semiconductor element is placed in the middle of the case, the size of the piezoelectric oscillator is the same as the size of the piezoelectric vibrator serving as the base, and the piezoelectric oscillator remains small and thin. (8) In a piezoelectric oscillation piece board formed by connecting a plurality of piezoelectric oscillation pieces to a frame, the piezoelectric oscillation pieces adjacent to each other in one row are
This method of manufacturing a piezoelectric vibrator is characterized by using piezoelectric oscillation piece substrates that are connected in opposite directions, so the number of piezoelectric oscillation piece substrates that are twice as many as the lower case substrate is used, and every other By adjusting the pitch to match the pitch of the lower case, it can be assembled as is, allowing batch processing, and one piezoelectric oscillation piece substrate essentially serves as two pieces. As a result, the production efficiency of the piezoelectric oscillation piece can be increased, and the cost of the piezoelectric oscillation piece can be halved, so that the cost of the piezoelectric vibrator of the present invention can be significantly reduced. (9) Since the piezoelectric vibrator is characterized in that the shape of the notch in the lower case and the connection part of the crystal oscillation piece substrate is discontinuous, such as wedge-shaped or circular, The connecting portions of the oscillation piece substrates can be more securely fitted and hermetically sealed. Further, since the sealing can be performed by applying force to the frame of the lower case substrate and the frame of the crystal oscillation piece substrate so that the sealing portions are brought into closer contact with each other, more reliable hermetic sealing can be achieved.

[Brief explanation of drawings]

FIG. 1 is an assembled perspective view of a rectangular AT crystal resonator as an embodiment of the piezoelectric resonator of the present invention.

FIG. 2 is a diagram showing a crystal oscillation piece substrate on which a plurality of AT crystal oscillation pieces are formed.

FIG. 3 is an assembled perspective view of a crystal oscillator using an AT type crystal resonator as an embodiment of the piezoelectric oscillator of the present invention.

FIG. 4 is a diagram showing an example of a resin-encapsulated crystal oscillator of the present invention.

FIG. 5 is a diagram showing an application example in which the ends of the AT crystal oscillator pieces are all exposed on the end surface of the lower case.

FIG. 6 is a diagram showing other shapes of the notch. (a) shows a wedge shape, and (b) shows a round shape.

FIG. 7 is a diagram showing a conventional piezoelectric vibrator.

FIG. 8 is a diagram showing a crystal oscillator as a conventional piezoelectric oscillator in which a semiconductor element and a separate cylindrical crystal resonator are fixed to a lead frame and molded with resin.

[Explanation of symbols]

1 Lower case board 2, 22, 32 Lower case 3, 23, 33 AT type crystal oscillator piece 4 Recessed part 5 Circumferential wall 6, 26 End 7, 37 Connection part 8, 28, 38 Notch part 9 Crystal oscillation piece substrate 10, 11 12, 14 frame 13 Cutting section 15 Upper case board 16 Upper case 17 Recess 18 AT type crystal resonator board 19, 53 Semiconductor element 20 Crystal oscillator 21, 46 Lead frame 24 Fixed electrode 27 External electrode 29 Connection electrode 30 Connection point 31 Semiconductor element mounting part 42 Crystal oscillation piece 43, 44 Case member 45 Low melting point glass 52 Island 54 Au wire 55 Lead terminal 56 Crystal resonator 57 Crystal resonator connection terminal

Claims (9)

[Claims] Claim 1: The lower case board is constructed such that the total thickness of the frame of the lower case board and the frame of the piezoelectric oscillation piece board is less than the sum of the maximum thicknesses of each board by the thickness of the piezoelectric oscillation piece. A method for manufacturing a piezoelectric vibrator, characterized in that a lower case substrate and a piezoelectric oscillation piece substrate are used in which the thickness of either or both of the frame of the case substrate and the frame of the piezoelectric oscillation piece substrate is reduced. 2. Piezoelectric vibration characterized in that a T-shaped notch is provided in the circumferential wall of the lower case of the lower case substrate to accommodate the end of the piezoelectric oscillation piece and the continuous part of the piezoelectric oscillation piece substrate. Child. 3. A method for manufacturing a piezoelectric oscillator, comprising placing a semiconductor element having at least an oscillation circuit on the surface of a piezoelectric vibrator manufactured by batch processing using a frame. 4. The shape of the external electrode is changed so that it functions as both a piezoelectric vibrator and a piezoelectric oscillator, by connecting both at the same time, and trimming the pattern when using it as a piezoelectric oscillator. A piezoelectric oscillator characterized by comprising: 5. A piezoelectric vibrator comprising a surface-mounted piezoelectric vibrator fixed to a lead frame and molded with resin. 6. A piezoelectric oscillator comprising a surface-mounted piezoelectric oscillator fixed to a lead frame and molded with resin. 7. A piezoelectric oscillator characterized in that a semiconductor element having at least an oscillation circuit is mounted on an element mounting part provided between external electrodes of a case in which a piezoelectric oscillation piece is built. 8. A piezoelectric oscillation piece substrate comprising a plurality of piezoelectric oscillation pieces connected to a frame, wherein the piezoelectric oscillation pieces arranged next to each other in a row are connected in opposite directions. A method of manufacturing a piezoelectric vibrator characterized by using a substrate. 9. A piezoelectric vibrator characterized in that the shape of the notch of the lower case and the connecting part of the crystal oscillation piece substrate is wedge-shaped, circular, or other discontinuous shape.