JPH0433846A - Release foil for manufacturing laminated plate and manufacture of laminated plate utilizing the release foil - Google Patents

Abstract

PURPOSE:To render the laminated plate surface for an additive process wiring board smooth, and improve the heat resistance, insulating property of solder, and the adhesion of an adhesive agent by the use of release foil wherein thermosetting resin with the addition of a mold release agent is applied and then cured on one surface of metallic foil. CONSTITUTION:On metallic foil 1, thermosetting resin 2 with the addition of a mold releasing agent is laid thereon, resulting in a double layered formation. The constitution in which release foil is put on the both sides of a prepreg layer 3 by placing the metallic foil l on the outside thereof is held by two stainless mirror plates 4, and then heat-pressed for forming a laminated plate by removing the release foil. For such thermosetting resin, epoxy resin, polyimide resin, phenol resin, and the like can be utilized, however, epoxy resin is most suitable therefor. As metallic foil used in release foil, aluminum foil is desirable in view of its function and cheap cost. For the mold releasing agent to be applied to thermosetting resin, silicon resin and fluoroplastic are preferable.

Description

[Detailed Description of the Invention] [Industrial Field of Application] The present invention provides an active method 1! ! 0 Regarding manufacturing method of #l type foil for manufacturing laminate for LE wire board and laminate used on the release foil [Prior art] ゛Conventionally, printed wiring used for industrial equipment, electronic parts, and electrical equipment The board is a laminate board made by impregnating a fiber base material with a thermosetting resin and drying it to a semi-hardened state. Several sheets of prepreg are sandwiched between molding metal plates and heated and pressurized.

A copper trace is formed on the surface using an additive method or an ettender method.

Because it is easy to form holes with small a, lj, and light diameter holes in the additive printed wiring board, it is passed through the KA density printed wiring board. Among them, EBOKI/M resin laminates are widely used because of their excellent insulation, moisture resistance, and workability. Since there is a problem that the prepreg adheres to the molding metal plate during hot-pressure molding, an m-type film is generally used for this laminate.

[Problem to be solved by the invention]

In the conventional method using this release film. Since no mold release agent is used, it has excellent adhesion with adhesives, high heat resistance under hand pressure, and excellent heat resistance. However, as a result of the mold release film being softened and deformed by the heat and pressure of modification, unevenness appears on the surface of the °C laminate, making it impossible to obtain excellent smoothness at °C. For this reason, the process of contacting the laminate for seven days, resist printing, and copper plating resulted in poor precision in the process of forming the copper circuit, making it difficult to create high-density wiring. In addition, the surface of the printed wiring board that has been soiled will have large irregularities.

Unexploded F3J3 is a laminated foil and release foil for manufacturing laminated boards to smooth the surface of horizontal laminated boards for additive method wiring boards and improve solder heat resistance, insulation properties, and adhesive layer density. The purpose is to provide all the convenient methods of mounting.

〔assignment? Means to solve]

J: Note 0) Purpose? To solve this problem, the present invention is a release foil made by coating and curing one side of a thermosetting resin HI4 to which a release tip is added.

Furthermore, in the present invention, several sheets of prepreg ka are impregnated into a semi-hardened state by impregnating an LLT fiber base material with a thermosetting resin and dried, and the above-mentioned release foil is applied on both sides, and the metal foil surface is placed on the outside. This is a method of sandwiching the molded material between two molding metal plates (stainless steel plates) and applying heat and pressure.

As shown in Figure 1 of #Ii type recessed foil above, gold #i recessed type K1
1I! The thermosetting resin 2 to which all the molding agents were added forms 21 layers. This lI! As shown in FIG. 2, the mold foil t is sandwiched between two #1 stainless steel end plates 4 which are stacked on both sides of the prepreg layer 3 with the metal foil 1 on the outside, heated and pressed, and the mold release foil i
There will be 4 boards stacked except for the above.

After fully applying adhesive to one side or the adhesive side of the laminate made by Doi's method, resist molding is performed and steel plating is applied to form a circuit sound, but the surface of the laminate made by the uninvented method is very smooth. Therefore, highly accurate circuits can be formed.

Thermosetting resins are epoxy resins and polyimide resins.

Although phenol resin etc. can be used, epoxy resin is most suitable.

Aluminum recesses are suitable for the gold S recesses used in 1lIlI type fabrics, both from the point of view of function and from the viewpoint of low cost.In addition, silicone resins and fluororesins are preferable as the Ill type agent added to the thermosetting resin.

[Effect]

Since the mold release foil of the present invention is cured by adding a mold release agent to the thermosetting resin, the mold release agent is a prepreg fiber that is restrained within the three-dimensional molecular structure of the thermosetting resin. I [l
I fat is used in the process of forming laminates.

It melts and hardens to form a solid phase mixed with laN.

Does the above-mentioned restrained mold release agent expand while being subjected to the phase-changing prepreg layer and high temperature and pressure? There is no transition required ○ In addition, the hardened thermosetting resin surface of the mold release box is molded smoothly,
This surface VcL allows the laminate 1liii] to be made smooth.

However, after forming the laminate, the mold foil can be peeled off from the laminate by the action of the mold release agent, and the surface of the laminate becomes smooth. When the adhesive is applied to the resulting laminated layer (gL) where the release agent diffuses and does not seep into the laminated plate, the adhesion is good and the influence of the m-type agent is small. Furthermore, the solder heat resistance of the laminate was good, and this result can be considered as evidence that the release agent in the #lI type foil did not diffuse into the laminate.

〔Example〕

(Example 1) Resin 1 in which 75% of solution type KS 707 (trade name of Shin-Etsu Silicone Co., Ltd.) was added as a molding agent to epoxy resin and cured by heating at °C.
A release foil was made with a double layer of aluminum foil having a baseness of 5 μm and a thickness of 40 μm.

Using this mold release method, an epoxy resin laminate was made by the method of Ippon@mei, and an adhesive-coated laminate was also obtained.

(Mei M1PIJ2) Is it the same as the practicality 1 as an Ill-type agent in Ebuki 7sl fat? llI type w type upper 3 with the same structure as 111. Adhesive-coated laminate f2 was obtained in the same manner as in Example 1 except for warping.○ (Conventional Example 1) Polypropylene film (biaxially stretched 2 film 40 μm)
A laminate coated with an adhesive was obtained using the same epoxy resin as in Example 1 as a Wrllll type film.

(Conventional Example 2) A 1W type agent 1R solution WKS707 was applied to the springboard, and the same epoxy resin as in Example 1 was used to obtain an entire adhesive-coated laminate.

(Trial K) The surface roughness was determined by the method of JIS BO601. The measurements were made on the adhesive-coated surface of the conventional 9IJ.

Regarding solder heat resistance, an additive method wiring board was prepared using adhesive-coated laminates obtained by each of the above methods, and a test piece of 2511 fl square meters was made from a part of the board.

This test piece was floated on solder at 260° C. and the time required for it to swell was measured. Table 1 shows the test results.

Table 1 [Effects of the Invention] According to the method of the present invention, as shown in the results of the examples in Table 1, the laminate surface is very smooth, has good adhesive N, and has excellent solder resistance! Therefore, it was found that the adhesive for additive method wiring boards has good properties and the surface structure of 15 laminates is good.

On the other hand, it is impossible to obtain a flat surface with the type III film method of Conventional Example 1, and it is impossible to obtain a smooth surface with the silicone resin @ mold agent method of Conventional Example 2. However, it is possible to use silicone resin Q-rich FC, which has poor adhesive adhesion and poor soldering heat resistance.

[Brief explanation of drawings]

Claims (2)

[Claims] 1. A release foil for manufacturing laminates, in which a thermosetting resin containing a release agent is applied to one side of metal foil to form a double layer, which is then heated and cured. 2. A plurality of sheets of prepreg made by impregnating and drying a thermosetting resin into a fiber base material are stacked together, and a release foil for producing a laminate according to claim 1 is stacked on both sides of the prepreg, with the metal foil facing outward. A method for producing a laminate, which comprises sandwiching the structure between molding metal plates and heating and pressurizing the structure.