JPH0433880B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Purpose of the Invention [Industrial Application Field] The present invention provides a method for full-face plating of a short, plate-shaped object to be plated, and a plating device for full-face plating that is directly used to carry out the above method. This article relates to an object holding drum, a full surface plating device, and an auxiliary processing device for full surface plating (hereinafter referred to as "auxiliary processing").
refers to pre-treatment or post-treatment for plating in the narrow sense when plating the entire surface of the object to be plated, and refers to auxiliary treatments such as washing with water, degreasing, pickling, etc.)

[Conventional technology]

Full-face plating of short plate-like objects, such as short IC lead frames (before molding)
When fully plating nickel, solder, or other metals on plate-shaped electronic parts (including the latter), the following methods are conventionally used for full-face plating.

() First, there is the rucking method that is commonly used. This is a rack (jig) with a hook part.
In this method, one or more objects to be plated are suspended in contact with a cathode and subjected to electrolytic treatment in a plating solution (for example, "Practical Plating Manual" by Rihei Tomono, published by Ohm Publishing, Vol. (See pages 57 to 78, especially page 72).

() In addition, the applicant previously proposed the
-There is one described in Publication No. 14079. this is,
An object holding part with a concave groove that can be engaged with an object to be plated horizontally is placed horizontally in the plating chamber through a support bowl on a circulation moving mechanism that moves along the upper side of the plating chamber. A large number of them are arranged in parallel to form a shape.

() Furthermore, there is something described in the specification and drawings of Japanese Patent Application No. 52-330431, which was also developed by the applicant. This is done by arranging the object to be plated and the anode parallel to each other, and providing a shielding plate between them with an opening for the anode, so that when the center of the object to be plated comes to the position of the opening, It was designed to stop it.

[Problems to be Solved by the Invention] The above-mentioned conventional entire surface plating means had the following problems.

First, in the above-mentioned latching method (), due to the so-called edge phenomenon, the closer to the sides of the object to be plated, the thicker the plate was likely to be, resulting in variations in the plated film thickness. Therefore, it is not an appropriate method when the object to be plated is an IC lead frame or a printed circuit board, which requires particularly high precision plating.

In addition, it is necessary to change the size of the rack, the position and shape of the cathode, etc. depending on the length and width of the object to be plated, which requires the time and effort of preparing and replacing a dedicated rack and cathode, and mass production. It was inappropriate.

Furthermore, since the rack moves throughout the process, a large amount of each processing solution is carried in and out of each plating treatment tank and the pre- and post-auxiliary treatment tanks, and the equipment becomes large due to the rack being moved up and down.

Next, in the above-mentioned Japanese Patent Publication No. 63-14079, the object to be plated is, for example, a general-purpose size.
With IC lead plates, you can create any pattern without having to replace the rack itself or the position/shape of the cathode.
You can fully plate items of your size. Furthermore, since a large number of objects to be plated are successively moved through the processing tank, mass productivity is excellent.

However, this does not mean that the anodes are located at equal intervals with respect to each part of the object to be plated, so that the thickness of the plating film on each part of the object to be plated still differs.

In addition, since the object holding section moves throughout the process, a large amount of processing solution is carried in and taken out of each processing tank, and it is necessary to leave a distance of at least a certain dimension between the jigs installed in parallel. Because of this necessity, the device has no choice but to become larger.

Furthermore, the specifications and drawings of Japanese Patent Application No. 62-330431 mentioned in () above can make the thickness of the plating film uniform on each part of the object to be plated, and can hold the object to be plated regardless of its length, width, etc. It can be put into a jig, making it easy to automate full-surface plating.

However, since the object to be plated is moved in the longitudinal direction, each treatment tank becomes long.
In particular, in order to carry out mass production, if a large number of objects to be plated are to be moved quickly, it is necessary to make each treatment tank longer, and the problem remains that the equipment becomes larger.

The present invention aims to solve various problems that the conventional means for fully plating a plate-shaped object has. That is, the purpose of the present invention is to make the plating film thickness uniform on each part of the object to be plated, thereby achieving high precision in plating, making it possible to perform plating on the entire surface in large quantities, and greatly improving productivity. A full surface plating method for plate-shaped objects that reduces the amount of processing liquid taken out and brought in, improves economic efficiency and plating quality, and makes the equipment smaller and easier to install, and the method described above. The object of the present invention is to provide a holding drum for holding an object to be plated for full surface plating, a full surface plating device, and an auxiliary processing device for full surface plating that can be used directly in the actual plating.

Structure of the Invention [Means for Solving the Problems] The first aspect of the present invention is a method for plating the entire surface of a plate-like object to be plated. The object to be plated 7 is held in each of the object holding parts 1 between a plurality of equally spaced partition plates 10 on the outer periphery of the object holding drum 2 which rotates intermittently around a horizontal axis in the plating processing tank 1.
1 and each object to be plated 7 held by each holding section 11.
When the holding drum 2 rotates and comes closer to the lower half, the anode 3 is brought into contact with the endless cathode 4 that moves along the outer periphery of the partition plate 3, and the anode 3 is parallel to the center line a of the holding drum 2. After the time required for plating has elapsed, the holding drum 2
The objects 7 to be plated in the holding part 11 that have come upwards due to the rotation are sequentially carried into the auxiliary processing tank 13 after being carried out for subsequent processing, and on the other hand, the endless cathode 4 is subjected to the plating processing. Tank 1
After being taken out and passed through the stripping solution in the stripping tank 5, it is circulated to the plating tank 1.

The second aspect of the present invention is a drum for holding an object to be plated for full surface plating, which is directly used in carrying out the above-mentioned full surface plating method, and is horizontally cylindrical and has a length that is approximately the same as the longest planned plate-shaped object 7. A large number of liquid passage holes 9 are formed in the entire peripheral wall 8, and a partition plate 10 parallel to the center line a is provided on the outer periphery of the peripheral wall 8.
A large number of partition plates 10 are arranged upright at equal intervals in the circumferential direction, and 11 are formed between each partition plate 10 in the object holding section.

The third aspect of the present invention is a full-surface plating device that is directly used in carrying out the above-mentioned full-surface plating method. A cathode 4 is provided outside the plating treatment tank 1.
A loading/unloading mechanism 6 for the stripping tank 5 and the object to be plated 7
The object holding drum 2 has a horizontal cylindrical shape with approximately the same length as the expected longest plate-like object 7, and has a large number of liquid passage holes 9 all over its peripheral wall 8. At the same time, a large number of partition plates 10 parallel to the center line a are erected on the outer periphery of the peripheral wall 8 at equal intervals in the circumferential direction.
1, the anode 3 is provided parallel to the center line a of the holding drum 2, and the cathode 4 is endless and comes into contact with the object to be plated 7 in the holding part 11 near the lower half of the holding drum 2. If possible, along the outer periphery of the partition plate 10 near the lower half of the holding drum 2, and once the plating tank 1
It is provided in a circulating manner that it exits from the stripping tank 5 and passes through the stripping tank 5.

The fourth aspect of the present invention is an auxiliary processing device for full surface plating that is directly used in carrying out the above-mentioned full surface plating method, and includes an auxiliary processing tank 1 before or after the plating processing tank 1.
3 includes an object holding drum 2 that rotates intermittently around a horizontal axis, and a liquid spouting pipe 19 for processing liquid.
and a frame 14 to prevent the object to be plated from falling off. A large number of liquid passage holes 9 are formed throughout the peripheral wall 8, and a center line a is formed on the outer periphery of the peripheral wall 8.
A large number of parallel partition plates 10 are arranged upright at equal intervals in the circumferential direction, and the space between each partition plate 10 is formed as an object holding section 11. The falling-off prevention frame 14 is installed horizontally in parallel with the center line a of the holding drum 2 near the bottom, and is provided so as to surround the outer periphery of the partition plate 10 in the lower half of the holding drum 2.

In the above configuration, each of the object holding drums 2 in the plating tank 1 and in the front or rear auxiliary processing tank 13 has at least a lower half portion in each of the processing tanks 1,
13 and rotated intermittently.

The speed of the intermittent rotation of the holding drum 2 is preferably set so that one rotation of the holding drum 2 usually satisfies the time required for each process.

Further, by changing the height of the portion of the holding drum 2 immersed in the processing liquid, the processing time in the plating processing tank 1 and the front or rear auxiliary processing tank 13 may be adjusted.

The anode 3 of the plating tank 1 is installed horizontally in parallel with the center line a of the holding drum 2, using a cylindrical anode case 15 made of a mesh material containing a chip-shaped anode material. Bye. However, the present invention is not limited to this, and the plate-shaped anode 3 is held on the holding drum 2.
The anode may be stretched over the inner peripheral surface, or a narrow plate-shaped anode 3 may be installed inside each partition plate 10.

[Effect]

A First, a method for plating the entire surface of a plate-shaped object to be plated according to the present invention, and the operation of the object holding drum for full surface plating and the entire surface plating device will be described.

() The plate-shaped object to be plated 7 that has undergone the previous auxiliary treatment in the previous auxiliary treatment tank 13 is transferred to the external portion of the object-to-be-plated holding drum 2 installed horizontally in the plating treatment tank 1.
The object to be plated is carried into each of the holding parts 11 between the partition plates 10, which are arranged in a large number at regular intervals.

In the carrying-in process, since the holding drum 2 rotates intermittently, when each holding part 11 sequentially comes to the position corresponding to the carrying-in/unloading mechanism 6 and stops, the plated material is removed by the carrying-in/unloading mechanism 6. The objects 7 may be carried into the holding section 11 one after another.

() At least the lower half of the holding drum 2 is immersed in the plating solution in the plating tank 1, and the cathode 4 moves along the outer circumference of the partition plate 10 near the lower half of the holding drum 2. There is. Therefore, each of the many holding parts 1 on the outer circumference of the holding drum 2
Each object to be plated 7 in the holding drum 2 comes into contact with the cathode 4 when it comes closer to the lower part due to the rotation of the holding drum 2.

Therefore, the plate-shaped object 7 in each holding part 11 is removed from the cathode 4 during one rotation of the drum 2.
The entire surface is plated with, for example, nickel, solder, or other metal using the anode 3 provided parallel to the center line a of the holding drum 2.

() In the above-mentioned plating process, since the anode 3 is provided parallel to the center line a of the holding drum 2, it is possible to
The distance between the anode 3 and the anode 3 is approximately equal, so that the plating film on the object 7 to be plated is uniformly formed.

Since the endless cathode 4 is provided along the outer periphery of the partition plate 10 near the lower half of the holding drum 2, the object 7 to be plated on the holding part 11 near the lower part of the holding drum 2 is placed on the outside by the cathode 4. It is supported from above and does not fall out of the holding part 11.

() While the above-mentioned plating process is being performed, the object to be plated 7 is being carried in and out of another holding section 11 that has been moved upward by the rotation of the holding drum 2.

It should be noted that if the anode 3 is provided both at the lower part of the holding drum 2 and at the opposite position outside the holding drum 2 with the cathode 4 in between, a more uniform plating film will be formed. Furthermore, if the plating liquid jetting pipe 12 is provided near the lower part of the holding drum 2 even if the anode 3 is located only at one location,
Since the plating liquid passes through the liquid passage hole 9 of the peripheral wall 8, is well stirred, and hits the object 7 to be plated, a good plating process is performed.

() When the object holding drum 2 rotates once and the required time for plating processing has elapsed, the holding part 1
1 comes near the top. The object to be plated 7 in the holding section 11 is carried out by the loading/unloading mechanism 6 and carried into each holding section 11 of a similar object holding drum 2 in the auxiliary processing tank 13 later. In this carrying-out/carrying-in, each holding part 11 sequentially moves toward the upper side as the holding drum 2 rotates, so that all of the objects 7 to be plated in each holding part 11 are carried out/carried-in in sequence.

Auxiliary treatment tank 1 after the plate-shaped object 7 to be plated
3, the holding drum 2 does not move, and only the object 7 to be plated moves.
Therefore, it is almost impossible for Metsuki liquid to be taken out or brought in.

() After the endless cathode 4 moves along the outer periphery of the partition plate 10 near the lower half of the object holding drum 2, it exits the plating tank 1 and passes through the external stripping tank 5. Therefore, the plating attached to the cathode 4 in the plating tank 1 is peeled off and removed, and then returned to the plating tank 1 again.

If the cathode 4 is made of a thin metal wire belt or two or more wire ropes arranged in parallel, the plating solution or stripping solution will hardly be taken out or brought in. moreover,
If the stripping solution in the stripping tank 5 is made of at least one type of plating solution component, there will be no problem with the plating solution or stripping solution brought in or taken out due to the circulation of the cathode 4, and the cathode 4 will be removed after electrolytic stripping. There is no need to wash with water.

() Holding drum 2 in the plating treatment tank 1 above
is approximately the same length as the expected maximum length of the plate-shaped object 7, so the holding drum 2
The length of the device can be short, the amount of plating solution can be reduced, and the entire device can be made smaller.

B Next, the method for plating the entire surface of a plate-shaped object to be plated according to the present invention, the operation of the object holding drum for full surface plating and the auxiliary device for full surface plating will be described.

() Transport the plate-shaped object 7 that has not undergone the previous auxiliary treatment to the previous auxiliary treatment tank 13, and transport the plate-shaped object 7 that has undergone the plating treatment into the subsequent auxiliary treatment tank 13. Bring it in.

In the auxiliary treatment tank 13 before or after the above,
Since an object holding drum 2 similar to the holding drum 2 in the plating processing tank 1 is installed horizontally, the object 7 to be plated is transferred to the holding drum 2.
A large number of partition plates 10 are installed at equal intervals on the outer periphery.
The objects to be plated are carried into the respective holding parts 11 between them.

In the carrying-in process, the holding drum 2 rotates intermittently as in the case of the plating process, so when each holding part 11 comes to the position corresponding to the carrying-in/unloading mechanism 6 and stops, the carrying-in/unloading The objects 7 to be plated may be sequentially carried into the holding section 11 by the carrying-out mechanism 6.

() The holding drum 2 is connected to the plating treatment tank 1.
Similar to the holding drum 2 inside, at least the lower half is immersed in the front or rear processing liquid inside the auxiliary processing tank 1 and rotates intermittently. Further, a processing liquid jetting pipe 19 is horizontally installed near the lower part of the holding drum 2 in parallel with the center line a thereof, and the front or rear processing liquid is jetted out.

Therefore, the fresh processing liquid ejected from the spouting pipe 19 is applied to each of the objects 7 to be plated in the holding portion 11 that have moved toward the lower half of the holding drum 2 as the holding drum 2 rotates. The liquid flows out from the liquid passage hole 9 and hits, and pre- or post-auxiliary processing is performed.

In the above-mentioned pre- or post-auxiliary processing, a liquid ejection pipe 12 for the processing liquid is provided in the holding drum 2 in parallel with its center line a, and the ejected processing liquid is passed through a large number of liquid channels on the peripheral wall 8 of the holding drum 2. Hole 9
is passed through and stirred well. Therefore,
The objects 7 to be plated in each holding section 11 are subjected to pre- or post-auxiliary processing evenly and efficiently.

() The above-mentioned pre- and post-auxiliary treatments are also performed during one rotation of the holding drum 1 in the auxiliary treatment tank 13, as in the case of the treatment in the plating treatment tank 1. This auxiliary processing time can also be adjusted by changing the depth at which the holding drum 2 is immersed in the processing liquid.

() When the holding part 11 comes closer to the lower half due to the rotation of the holding drum 2, the object 7 to be plated is attached to the partition plate 10 of the lower half of the holding drum 2 when the fall prevention frame 14
Since it is provided so as to surround the outer periphery, it will not fall off from the holding part 11.

() When the time required for the previous or subsequent auxiliary processing has elapsed and the holding drum 2 rotates once and the holding part 11 comes upward, the object 7 to be plated in the holding part 11 is carried out by the carry-in/take-out mechanism 6. Then, it is carried into the holding portion 11 of the holding drum 2 of the next plating processing tank 1 or the next auxiliary processing tank 13.

Even when the object to be plated 7 is moved, only the object to be plated 7 is moved and the holding drum 2 is not moved, so that there is almost no taking out or bringing in of the processing liquid between the processing tanks 13 and 1.

() Also in this auxiliary processing device for full surface plating, the holding drum 2 has approximately the same length as the longest object to be plated 7, and each processing tank 1
3 has a width that allows it to be immersed. Therefore, the amount of processing liquid in each auxiliary processing tank 13 may be small, and the entire apparatus is also miniaturized.

〔Example〕

FIG. 1 shows a full surface plating device, FIG. 2 shows an auxiliary processing device for full surface plating, and FIGS. 3 and 4 show an object holding drum for full surface plating.

In the above-mentioned full surface plating device or auxiliary processing device for full surface plating, the same drum 2 for holding the object to be plated can be used, which is rotatably installed horizontally in each of the processing tanks 1 and 13.

That is, it has a horizontally cylindrical shape with approximately the same length as the expected longest plate-shaped object 7 to be plated, and is rotatably provided around a horizontal axis. A large number of plating liquid passage holes 9 are formed throughout the peripheral wall 8 of the holding drum 2, and a large number of partition plates 10 parallel to the center line a are erected on the outer periphery of the peripheral wall 8 at equal intervals in the circumferential direction. , the space between each of the partition plates 10 is used as an object holding section 11.

The partition plate 10 of the drum 2 is shown in FIG.
All the partition plates 10 may be arranged at equal intervals as shown in FIG. 2, but as shown in FIGS.
A large number of sets may be connected to adjacent ones by connecting portions 20 and provided at equal intervals around the outer circumference of the drum 2. In addition, in order to improve the contact of the processing liquid to the object to be plated 7 in the holding part 11, each partition plate 10 is also provided with a liquid passage hole 1.
It is better to form 6.

As shown in FIGS. 1 and 4, the anode 3 in the entire surface plating device uses a chip-shaped anode material housed in a cylindrical anode case 15 made of mesh material. It is horizontally installed near the bottom inside the holding drum 2. In order to further improve the plating efficiency, an anode 3 is also horizontally placed outside the holding drum 2 at a position opposite to the cathode 4 in FIGS. 1 and 7.

However, the anode 3 is not limited to this, especially in the case of electrolytic degreasing or plating treatment where an insoluble anode can be used.
As shown in FIGS. 8 and 9, a plate-shaped anode 3 is stretched over the inner peripheral surface of the holding drum 2, and as shown in FIGS.
As shown in the figure, a narrow plate-shaped anode 3 is attached to each partition plate 10.
It is desirable to have it inside. In these cases, in order to increase the plating efficiency,
As shown in FIG. 1, it is preferable to horizontally install a plating liquid jetting pipe 12 near the lower part of the holding drum 2.

As shown in FIG. 1, the cathode 4 in the entire surface plating apparatus is endless and circulates between the plating tank 1 and the stripping tank 5. The cathode 4 is connected to a first
As shown in Figures 4, 7 to 11,
It is movably provided along the outer periphery of the partition plate 10 near the lower half of the object holding drum 2.

In addition, the cathode 4 is made of a thin metal wire as shown in FIG. 4 in order to minimize the amount of plating solution and stripping solution taken out and brought in when circulating between the plating tank 1 and the stripping tank 5. It is best to use two or more wide belts or wire ropes arranged in parallel.

In addition, the stripping solution in the stripping tank 5 in the full-surface plating device is used to prevent the plating solution and stripping solution from being carried in and out due to the circulation of the cathode 4, and to eliminate the need for washing the cathode 4 with water after electrolytic stripping. Alternatively, it is preferable to use plating liquid components without brighteners and the like.

When carrying in and out the object to be plated in the full surface plating device or the auxiliary processing device for full surface plating, the object to be plated 7 is carried out from inside the holding part 11 of the holding drum 2 of the previous processing tank 1, 13, and at the same time it is transferred to the next one. treatment tank 1
It is preferable to carry it into the holding portion 11 of the holding drum 2 of No. 3,1.

To do this, the loading/unloading mechanism 6 is moved horizontally by a fixed width by pushing or pulling the object 7 in the holding part 11 of each holding drum 2 from the side, as shown in FIG. 6A. It is better to have a structure. However, the present invention is not limited thereto, and may be movable up and down so that the object 7 to be plated can be carried in and out of the holding section 11 from above.

Fall prevention frame 14 in auxiliary processing equipment for full surface plating
As shown in FIG. 12, two or more narrow belts or ropes may be arranged in parallel to form a semicircular arc shape.

In the full surface plating device or the auxiliary processing device for full surface plating, the mechanism for intermittently rotating each holding drum 2 is a ring-shaped mechanism located near the outer periphery of both sides of each holding drum 2, as shown in FIGS. 1, 2, 4, etc. A gear 18 is provided,
This may be made rotatable by meshing with the drive side gear 17.

Since the plating processing time in the plating processing tank 1 is longer than the auxiliary processing time in the preceding or subsequent auxiliary processing tank 13, sufficient plating processing may not be possible during one rotation of the holding drum 2. In such a case, as shown in FIG.
After the plating process is performed by rotating one rotation, the plating process is performed one more rotation using the holding drum 2 of the adjacent plating process tank 1.

The present invention is not limited to the above-mentioned full surface plating, but can also be applied to continuous processing steps such as pickling, anodic oxidation, and formation of chemical conversion films in other metal surface treatment fields.

Effects of the Invention The method of fully plating a plate-shaped object according to the present invention, the object holding drum for full surface plating, the full surface plating device, and the auxiliary processing device for full surface plating that are directly used to carry out the above method Ba,
The effects are exhibited as follows.

(a) The plating film thickness of the entire surface of the plate-shaped object to be plated becomes uniform, and high precision plating can be achieved.

That is, unlike the conventional racking method, the present invention uses a horizontally cylindrical drum to hold the material to be plated. A large number of partition plates are installed upright, and a plate-shaped object to be plated is carried into and held in the object holding section between each partition plate, and the entire surface is plated and auxiliary processing before or after is performed.

In particular, in the plating process in a plating tank, the plate-shaped object to be plated is plated between an anode provided parallel to the center line of the holding drum. Therefore, the distance between the object to be plated in each holding part and the anode is almost constant in each part in the longitudinal direction.
The plating can be applied evenly, and the plating film thickness can be made uniform.

Therefore, it is especially suitable as a means for full-surface plating of IC lead frames and plate-shaped electronic components that require particularly high-precision plating.

(b) Full surface plating processing and pre- or post-auxiliary processing can be performed on a large number of plate-shaped objects to be plated at once, and productivity of full surface plating can be greatly improved.

That is, unlike the conventional racking method and others, the present invention uses a plating object holding drum in which a large number of object holding parts are formed on the outer periphery at equal intervals in the circumferential direction as described above. A plate-shaped object to be plated is carried into the processing section, and the entire surface is plated while being rotated in a processing solution.

Therefore, a large number of objects to be plated can be processed simultaneously with one object holding drum in the plating tank or the auxiliary processing tank. In addition, the holding section, which has moved closer to the upper half due to the rotation of the drum, can carry out the processed object to be plated and the unprocessed object to be removed at the same time. Even while the object is being plated, the object to be plated in the holding section near the lower half is undergoing full-surface plating and pre- or post-auxiliary processing.

Therefore, the productivity of plating the entire surface of a plate-shaped object to be plated can be greatly improved.

(c) It is possible to reduce the amount of each treatment solution taken out and brought into the plating treatment tank and auxiliary treatment tank, thereby improving the quality and economic efficiency of plating.

That is, unlike conventional racking methods and other methods, in the present invention, only the object to be plated is moved between the plating processing tank or the auxiliary processing tank, and the object to be plated is held in place corresponding to a conventional racking or transport jig. The drum does not move between each treatment tank.

Therefore, there is almost no need to take out or bring in the chemical treatment liquid in each treatment tank, which improves the quality of plating and improves economic efficiency.

(d) The entire surface plating device can be downsized and the device can be easily installed.

That is, in the present invention, unlike conventional racking methods and others, the object-holding drum having a plurality of object-holding portions need only be approximately the same length as the longest dimension of the object to be plated. Moreover, only the plate-shaped objects to be plated are moved between the processing tanks, and there is no need to move the holding drum.

Therefore, although a large number of objects to be plated can be processed simultaneously, each processing tank only needs to have a size that allows the holding drum to be immersed, and the processing tank can be made extremely compact. Furthermore, since there is no need to move the holding drum, the loading/unloading mechanism can also be downsized.

Therefore, the entire plating device can be significantly downsized, and the installation area is also reduced, making installation easier.

(e) In the present invention, the cathode is passed through the stripping tank as an endless cathode, but if the stripping solution is made of at least one type of plating solution component, the stripping solution having the same quality as the plating solution will not change in quality. death,
On the other hand, there is no problem in bringing the stripping solution into the plating tank.

Therefore, from this point of view as well, the quality of the entire surface plating is improved and it is also economical.

[Brief explanation of drawings]

The figures show an embodiment of the method for plating the entire surface of a plate-shaped object according to the present invention, in which FIG. 1 is a longitudinal sectional side view of the entire surface plating device, FIG. 2 is a longitudinal sectional side view of the auxiliary processing device for entire surface plating, and FIG. is an enlarged side view of the upper half of the object holding drum, FIG. 4 is a longitudinal sectional front view of the holding drum, FIG. 5 is a vertical sectional perspective view of the holding drum with the annular gear omitted, and FIG. FIG. 6B is a schematic front view showing the main parts of the processing steps of the present entire surface plating method. FIG. 6B is a schematic front view when the plating process is performed in two steps. FIG.
Figure 8 is a side view of the main part when the anode is installed outside the holding drum, and Figure 9 is a side view of the main part when the anode is installed on the inner peripheral surface of the holding drum using a full-surface plating device. Side view of main parts when jet pipe is added, No. 10
The figure is a side view of the main part when an anode is installed horizontally in each partition plate using a full-surface plating device, Fig. 11 is a side view of the main part of the example in which a liquid jet pipe is added to the one in Fig. 10, and Fig. 12 The figure is a side view of the main part of the auxiliary processing device for full surface plating, Figure 13 is a side view of the upper half of another embodiment of the object holding drum to be plated, and Figure 14 is a part of the part shown in Figure 13. An enlarged side view is shown. Drawing code, 1...Plating processing tank, 2...Plating object holding drum, 3...Anode, 4...Cathode, 5...
Peeling tank, 6... Loading/unloading mechanism, 7... Plate-shaped object to be plated, 8... Peripheral wall, 9... Liquid passage hole, 10... Partition plate, 11... Holder for plated object, 12... Liquid ejection pipe, 13...Auxiliary treatment tank, 14...Falling prevention frame, 15...Anode case, 16...Liquid passage hole, 17
... Drive side gear, 18 ... Annular gear, 19 ... Liquid jet pipe, a ... Center line.

Claims (1)

[Claims] 1. A plurality of plate-shaped objects 7 that have undergone previous auxiliary treatment in a previous auxiliary treatment tank 13 are held by rotating intermittently around a horizontal axis in the plating treatment tank 1. The objects to be plated 7 are sequentially carried into the respective holding parts 11 between the plurality of equally spaced partition plates 10 on the outer periphery of the drum 2, and the objects to be plated 7 held by the respective holding parts 11 are
When the holding drum 2 rotates and comes closer to the lower half, the endless cathode 4 moving along the outer circumference of the partition plate 3 is brought into contact with the anode 3 parallel to the center line a of the holding drum 2. The object to be plated 7 in the holding part 11 has been moved upward by the rotation of the holding drum 2 after the required time for the plating process has elapsed.
are sequentially carried into the auxiliary treatment tank 13 after being carried out for subsequent auxiliary treatment, and on the other hand, the endless cathode 4 is once taken out from the plating treatment tank 1 and placed in the stripping solution of the stripping tank 5. A method for fully plating a plate-shaped object to be plated, characterized in that the object is allowed to pass through and then circulated to a plating treatment tank 1. 2. In the entire surface plating method of a plate-shaped object according to claim 1, a large number of plate-shaped objects 7 to be subjected to pre- or post-auxiliary treatment are placed in a pre- or post-auxiliary treatment tank 13,
A large number of equally spaced partition plates 10 on the outer periphery of the object holding drum 2, which is the same as the drum 2 of the plating treatment tank 1.
Each object to be plated 7 held in each holding section 11 is sequentially carried into each holding section 11 between the two.
When the holding drum 2 rotates and comes closer to the lower half, auxiliary processing is performed using a processing liquid that is ejected from a liquid ejection pipe 19 provided inside the holding drum 2 in parallel to its center line a. After the time required for the auxiliary treatment has elapsed, the objects 7 to be plated in the holding section 11 that have moved upward due to the rotation of the holding drum 2 are sequentially carried out and transferred to the next plating processing tank 1.
Alternatively, a method of plating the entire surface in which the material is transported to the auxiliary treatment tank 13 later. 3 It has a horizontally cylindrical shape and has a width that is approximately the same length as the longest planed plate-shaped object 7 to be plated, and has a large number of liquid passage holes 9 formed throughout the peripheral wall 8, and a central hole 9 on the outer periphery of the peripheral wall 8. A large number of partition plates 10 parallel to the line a are erected at equal intervals in the circumferential direction, and each partition plate 10
A drum for holding an object to be plated for full surface plating, characterized in that a gap is formed in the object holding part 11. 4 Inside the plating tank 1, a drum 2 for holding an object to be plated which rotates intermittently around a horizontal axis, an anode 3 and a cathode 4 are provided. The object holding drum 2 has a horizontal cylindrical shape with approximately the same length as the longest plate-like object 7 to be plated, and the entire circumferential wall 8 has a loading/unloading mechanism 6. A large number of liquid passage holes 9 are formed, and a large number of partition plates 10 parallel to the center line a are erected on the outer periphery of the peripheral wall 8 at equal intervals in the circumferential direction.
An object holding section 11 is formed between each partition plate 10, the anode 3 is provided parallel to the center line a of the holding drum 2, and the cathode 4 is endless and located near the lower half of the holding drum 2. A circulating movement type that is placed along the outer periphery of the partition plate 10 near the lower half of the holding drum 2 so as to be able to contact the object to be plated 7 in the holding part 11, and that once exits the plating tank 1 and passes through the peeling tank 5. A full-surface plating device characterized by being installed in. 5. In the entire surface plating device according to claim 4,
As the anode 3, a cylindrical anode case 1 made of mesh material
A full surface plating device that houses a chip-shaped anode material in the inside of the drum 5 and horizontally installed near the bottom of the object holding drum 2. 6. In the entire surface plating device according to claim 4,
This is a full surface plating device in which a plate-shaped anode 3 is stretched over the inner peripheral surface of an object holding drum 2 as an anode 3. 7. In the entire surface plating device according to claim 4,
As the anode 3, a narrow plate-shaped anode 3 is connected to each partition plate 10.
Full-scale plating device installed inside. 8 Auxiliary treatment tank 1 before or after plating treatment tank 1
3 is provided with an object holding drum 2 that rotates intermittently around a horizontal axis, a liquid jetting pipe 19 for processing liquid, and a frame 14 for preventing falling of objects to be plated. 2 has a horizontally cylindrical shape with approximately the same length as the longest planned plate-like object 7, and has a large number of liquid passage holes 9 formed throughout its peripheral wall 8, and has a center line a and a A large number of parallel partition plates 10 are arranged upright at equal intervals in the circumferential direction, and the space between each partition plate 10 is formed as an object holding section 11. The drop-off prevention frame 14 is provided so as to surround the outer periphery of the partition plate 10 in the lower half of the holding drum 2. Auxiliary processing equipment for full surface plating.