JPH0431040B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION A. Purpose of the Invention (a) Industrial Field of Application The present invention is directed to the use of solder, tin, silver, etc. for plate-like objects such as IC lead frames and printed circuit boards, and objects to be plated such as rod-like objects.・Related to equipment for fully plating copper and other metals.

b. Prior art For objects to be plated such as plate-like objects and rod-like objects as mentioned above,
Conventionally, a racking method has been generally used as a device for applying full surface plating. This is, for example, "Metsukimanial" (written by Rihei Tomono, published by Ohmsha Co., Ltd.).
As described on pages 57 to 78 of "October 25, 1978," a rack (jig) with a hook part.
In this method, a plate-shaped or rod-shaped object to be plated is hung and hung in contact with the cathode part, and electrolytically treated in a plating solution. In addition, especially when plating the entire interior of an IC lead frame, plating the exterior after resin molding, or plating the entire surface of a printed circuit board with copper, it is easy to process a large number of sheets by hooking them into one for mass production. Common.

c. Problems to be Solved by the Invention When the entire surface of an object to be plated, such as a plate-like object or a rod-like object, is plated using a plating device using the above-mentioned conventional rasping method, the following problems occur.

During transportation, the processing liquid adheres to both the object to be plated and the rack and moves. As a result, the processing liquid has to be frequently pumped out and brought in between adjacent processing tanks, which is uneconomical, deteriorates the quality of the plating, and lengthens the processing time.

It is necessary to change the size of the rack, the position and shape of the cathode contact, etc. depending on the length and width of the object to be plated, and it takes time and effort to prepare and replace a special rack or contact. In addition, it is difficult to easily and automatically stack a large number of IC lead frames and printed circuit boards, and the structure of the processing tank makes it difficult to exchange and stir the liquid, which requires a low current density, making it impossible or difficult to increase the plating speed.

The present invention aims to solve the problems of the conventional full surface plating apparatus described above. That is, an object of the present invention is to provide a full-surface plating device that eliminates the need to pump out and carry in processing liquid, eliminates the need for a dedicated rack, automates the holding of objects to be plated using a jig, and enables high-speed plating processing. be.

B. Structure of the Invention (a) Means for Solving Problems The entire surface plating device according to the present invention includes a contact stripping tank 3 provided almost vertically below the plating tank 2, and the plating tank 2 has an endless conveyor. The means 4 is provided so that it can be returned downward near the front of the plating tank 2 after being conveyed horizontally, and two frames are provided on the outer periphery of the conveying means 4 so as to be able to hold the object 1 to be plated in a horizontally long vertical shape. Holding jig 5 with narrower spacing near the top and bottom when looking at the mold member from the conveyance direction
A large number of anodes 1 are provided in a continuous manner, and anodes 1 are placed on both sides of the upper holding jig 5 that is being transported.
1 are arranged in parallel, and an endless cathode contact 7 that contacts the object to be plated 1 is movable together with the holding jig 5 on the outer periphery of the conveying means 4, and is moved from the holding jig 5 near the front of the plating tank 2. The contact stripping tank 3 is provided with an electrolytic stripping solution containing plating liquid components, and the cathode contacts 7 that have come out of the plating tank 2 are placed in the contact stripping tank 3. After passing through the plating tank 3, the plating tank 2 returns to the plating tank 2 again.

The above configuration will be explained in more detail.

The positional relationship between the plating tank 2 and the contact stripping tank 3 is as follows.
As shown in the drawings and FIG. 2, the contact stripping tank 3 may be provided almost vertically below the plating tank 2.

The conveyance means 4 is, for example, a roller chain type endless type, and a conveyance path 8 that moves horizontally is formed by wheels 12, 12 provided at the front and rear of the plating tank 2 and rotating on a horizontal axis.

The holding jig 5 for the object to be plated 1 has two frame-shaped members that can hold the object to be plated 1 in a horizontally long vertical shape.
The gap between both members is narrower toward the upper and lower portions when viewed from the conveying direction, and these are continuously provided around the outer periphery of the conveying means 4. Further, although anodes 11, 11 are arranged in parallel on both sides of the conveying portion 6 on the upper side of the holding jig 5, the arrangement thereof does not necessarily have to be as shown in the illustrated example.

The cathode contact 7 is, for example, chain-type endless, and is movable together into the conveying part 6 above the holding jig 5, and when the conveying means 4 and the holding jig 5 are returned at a position near the front of the plating tank 2. For example, as shown in the illustrated example, it is advanced further forward, separated from the holding jig 5, and guided out of the plating tank 2 through the front wall 13.

Further, the contact stripping tank 3 is provided almost vertically below the plating tank 2 as described above, and in the contact stripping tank 3, a plating solution or a plating solution component excluding brighteners, etc. is used as an electrolytic stripping solution. Add stripping liquid.

Then, the endless cathode contact 7 that has come out of the plating tank 2 from the front wall 13 of the plating tank 2 as described above passes through the liquid of the contact stripping tank 3 via the rolls 17, 17, and then passes through the liquid on the rear wall. 14 and return to the plating tank 2 again.

In the figure, 9, 9 are anode openings, 10, 1
0 is a shielding plate, but like the anodes 11 and 11 described above, it is not necessarily necessary to have the structure as in the illustrated example. Reference numerals 15 and 15 indicate liquid drain plates, and reference numerals 16 and 16 indicate circulation pipes for stirring the plating liquid.

b. Effect The operating state of the present invention is as follows.

The electrodes in the plating tank 2 containing the plating solution are energized, and the conveying means 4 for the objects 1 to be plated is driven, and short objects 1 to be plated are sequentially fed at equal intervals. They are held in a horizontally elongated vertical shape at equal intervals on endless cathode contacts 7 that move together with the holding jig 5 in a conveyance section 6 located above a holding jig 5 provided on the outer periphery of the conveyance means 4 .

By the movement of the conveyance means 4, the object 1 to be plated in the conveyance section 6 above the holding jig 5 is directed in the liquid of the plating tank 2 from the rear to the front while contacting the endless cathode contact 7 that moves together. and move on the conveyance path 8.
Therefore, during this movement, a plating film is formed on the object 1 to be plated.

During the above operating state, the cathode contact 7 of the present entire surface plating device is made endless and is separated from the transport means 4 and the holding jig 5 that have moved together when the transport means 4 returns near the front of the plating tank 2. Thereafter, it moves out of the plating tank 2 and into the contact stripping tank 3. Then, with the electrolytic stripping solution in the stripping tank 3,
The plating electrodeposited on the cathode contact 7 is peeled off, and the cathode contact 7 then circulates again into the plating tank 2.

In this case, in the present invention, it is only the cathode contact 7 that comes out of the plating tank 2, passes through the contact stripping tank 3, and circulates; It is movement. Therefore, the amount of Metsuki liquid taken out and brought in is extremely small. Further, the stripping solution in the contact stripping tank 3 in the present invention is a plating solution or an electrolytic stripping solution containing a plating solution as a component. Therefore, even if the plating solution adheres to the cathode contact 7 and is brought into the stripping tank 3, the electrolytic stripping solution, which is the same as the plating solution, will not change in quality. Conversely, even if the stripping liquid is brought into the plating tank 2, no problem will arise. Furthermore, it is no longer necessary to wash the cathode contact 7 with water after electrolytic stripping.

C. Effects of the Invention As is clear from the above, the entire surface plating device of the present invention has the following effects.

a. When moving between the plating tank and the contact/jig stripping tank, the amount of plating liquid taken out or brought in can be minimized.

That is, in the conventional racking method, the processing liquid adheres to both the object to be plated and the rack and moves.
As a result, the processing solution is often pumped out and brought in between adjacent processing tanks, which is uneconomical, deteriorates the quality of the plating, and lengthens the processing time.

In contrast, in the present invention, only the cathode contact is moved from the plating tank to the next stripping tank, and the conveyance means and the jig are moved within the plating tank. Therefore, the amount of Metsuki liquid taken out and brought in can be extremely reduced.

Furthermore, in the present invention, a plating solution or an electrolytic stripping solution containing a plating solution as a component is used as the stripping solution in the contact stripping tank. Therefore, even if the plating solution adheres to the cathode contact and is carried into the next stripping tank, the electrolytic stripping solution, which is the same as the plating solution, will not change in quality.

Therefore, the quality of the mesh can be improved,
Processing time can be shortened, economical efficiency can be improved, and there is no need to wash the cathode contact with water after electrolytic stripping.

b. Depending on the length, width, and other shapes of the object to be plated, there is no need to change the size of the rack, the position, shape, etc. of the cathode contact, and high-speed plating processing can be performed.

In other words, in the conventional racking method, it takes time and effort to prepare special racks and contacts according to the length and width of the object to be plated, and to replace them depending on the object to be plated, resulting in poor workability. . Furthermore, due to the structure of the plating tank, it was difficult to stir the liquid at high speed, resulting in a low current density.

In contrast, in the present invention, the object to be plated can be thrown into the moving holding jig and automatically engaged and held, regardless of the length, width, etc. of the object to be plated. In addition, since the inside of the plating tank can be stirred as a whole parallel to the longitudinal direction (transportation direction) of the objects to be plated, high-speed stirring and high current density are possible, and high-speed plating can be achieved. It is.

[Brief explanation of drawings]

The figures show an embodiment of the present invention, in which Fig. 1 is a longitudinal sectional front view of the main parts of the present entire surface plating device, Fig. 2 is a cross-sectional view taken from the side shown in Fig. 1, and Fig. 3 is a state in which the object to be plated is conveyed. FIG. Drawing code, 1- object to be plated, 2- plating tank, 3
- Contact stripping tank, 4 - Conveying means, 5 - Holding jig, 6
-Conveyance part, 7-Cathode contact, 8-Conveyance path, 11-
anode.

Claims (1)

[Scope of Claims] 1. A contact stripping tank 3 is provided at a substantially vertical lower part of the plating tank 2, and an endless conveying means 4 is installed in the plating tank 2 in front of the plating tank 2 after being conveyed horizontally. It is provided so that it can be returned downwards near the conveying means 4, and two frame-shaped members are arranged with an interval between them at the upper and lower sides when viewed from the conveying direction so that the object 1 to be plated can be held in a horizontally long vertical shape on the outer periphery of the conveying means 4. Narrowed holding jig 5
A large number of anodes 1 are provided in a continuous manner, and anodes 1 are placed on both sides of the upper holding jig 5 that is being transported.
1 are arranged in parallel, and an endless cathode contact 7 that contacts the object to be plated 1 is movable together with the holding jig 5 on the outer periphery of the conveying means 4, and is moved from the holding jig 5 near the front of the plating tank 2. The contact stripping tank 3 is provided so as to come out of the plating tank 2, and an electrolytic stripping solution containing a plating solution component is put in the contact stripping tank 3, and the cathode contacts 7 that have come out of the plating tank 2 are stripped of the contacts. The entire surface plating device is installed so that it can circulate and move after passing through the tank 3 and returning to the plating tank 2 again.