JPH043405B2 - - Google Patents
Info
- Publication number
- JPH043405B2 JPH043405B2 JP20883683A JP20883683A JPH043405B2 JP H043405 B2 JPH043405 B2 JP H043405B2 JP 20883683 A JP20883683 A JP 20883683A JP 20883683 A JP20883683 A JP 20883683A JP H043405 B2 JPH043405 B2 JP H043405B2
- Authority
- JP
- Japan
- Prior art keywords
- manufactured
- epoxy resin
- resin composition
- thermosetting resin
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003822 epoxy resin Substances 0.000 claims description 19
- 229920000647 polyepoxide Polymers 0.000 claims description 19
- 229920001187 thermosetting polymer Polymers 0.000 claims description 17
- 150000001875 compounds Chemical class 0.000 claims description 15
- 239000011342 resin composition Substances 0.000 claims description 15
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 11
- 239000003054 catalyst Substances 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 10
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 6
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 4
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- -1 (trade name) Chemical compound 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- LLPKQRMDOFYSGZ-UHFFFAOYSA-N 2-methyl-4-methylimidazole Natural products CC1=CN=C(C)N1 LLPKQRMDOFYSGZ-UHFFFAOYSA-N 0.000 description 2
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical class N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 235000010233 benzoic acid Nutrition 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- GGSUCNLOZRCGPQ-UHFFFAOYSA-N diethylaniline Chemical compound CCN(CC)C1=CC=CC=C1 GGSUCNLOZRCGPQ-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical class OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- SESYNEDUKZDRJL-UHFFFAOYSA-N 3-(2-methylimidazol-1-yl)propanenitrile Chemical class CC1=NC=CN1CCC#N SESYNEDUKZDRJL-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- 229920003319 Araldite® Polymers 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical class N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PASDCCFISLVPSO-UHFFFAOYSA-N benzoyl chloride Chemical compound ClC(=O)C1=CC=CC=C1 PASDCCFISLVPSO-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 1
- 238000006114 decarboxylation reaction Methods 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000007033 dehydrochlorination reaction Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Chemical class C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- DGTNSSLYPYDJGL-UHFFFAOYSA-N phenyl isocyanate Chemical compound O=C=NC1=CC=CC=C1 DGTNSSLYPYDJGL-UHFFFAOYSA-N 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
本発明は熱硬化性樹脂組成物に関する。
エポキシ樹脂が特定のポリアミド樹脂によつて
熱硬化することはL.I.Komarovaらの論文、ジヤ
ーナル・オブ・ポリマー・サイエンス、ポリマ
ー・レターズ・エデイシヨン（Journal of
Polymer Science、Polymer Letters Edition）
14(3)、179（1976）に記載されている。
本発明者らはポリアミド樹脂に比べてエポキシ
樹脂との相溶性にすぐれたモノアミド化合物が実
用的な硬化条件下でエポキシ樹脂を硬化させるこ
とを見出した。すなわち本発明はエポキシ樹脂
（）、式（）で示されるモノアミド化合物
（）及び必要に応じて硬化触媒（）を含有し、
（）／（）を当量比で0.01〜1.0としてなる熱
硬化性樹脂組成物に関する。
（但し、式中R1及びR2は水素原子又は炭素数１
〜17のアルキル基を表わす。）
本発明に使用されるエポキシ樹脂にはとくに制
限はない。例えばアラルダイトGY250、260、
280、CY221、230、CT200（以上チバガイギー社
製、商品名）、エピコート815、828、1001、1004、
1007（以上シエル化学社製、商品名）アデカレジ
ンEp−4100、4900、4340（以上旭電化社製、商品
名）、エピクロン840、850、855、857、860、1050
以上大日本インキ化学社製、商品名）、プリエボ
ーPEB−10、PE−10、PE−100（以上大日本色材
工業社製、商品名）、AER330R、331R、334R、
337R（以上旭化成社製、商品名）等のビスフエノ
ール型エポキシ樹脂ECN1235、1273、1280、
EPN1138（以上チバガイギー社製、商品名）、
ESCN−220（住友化学社製、商品名）、Ｎ−730、
Ｎ−770、Ｎ−660、Ｎ−670（以上大日本インキ化
学社製、商品名）、PE2010、PE2020（以上大日本
色材工業社製、商品名）、EOCN−102、103、104
（以上日本化薬社製、商品名）等のノボラツク型
エポキシ樹脂、CY175、177、179（以上チバガイ
ギー社製、商品名）、ERL−4206、4221（以上
UCC社製、商品名）等の環状脂肪族型エポキシ
樹脂、CY350、XB2615（以上チバガイギー社製、
商品名）、TEPIC（日産化学社製、商品名）等の
ヘテロサイクリツク型エポキシ樹脂、YDB−
340、YDB−715（以上東都化成社製、商品名）、
アラルダイト8011（チバガイギー社製、商品名）、
ESB−340、ESB−400、ESB−500（以上住友化
学社製、商品名）等のブロム化エポキシ樹脂など
が用いられる。
経済性を考慮するとビスフエノールＡ型エポキ
シ樹脂が好ましい。
本発明に使用される上記の式（）で示される
モノアミド化合物は既に公知の合成法で得られ
る。例えば式（）においてR1、R2がＨである
モノアミド化合物は安息香酸クロライドとアニリ
ンとの脱塩酸反応、安息香酸とアニリンとの脱水
反応、安息香酸とフエニルイソシアネートとの脱
炭酸反応などによつて得られる。
材料の汎用性を考慮すると式（）のR1及び
R2が水素原子のモノアミド化合物又はR1がｔ−
ブチル基、R2が水素原子のモノアミド化合物が
好ましい。硬化物の耐熱性を考慮するとR1及び
R2が水素原子のモノアミド化合物が特に好まし
い。
エポキシ樹脂（）及び上記のモノアミド化合
物（）の使用割合は、（）／（）が当量比
で0.01〜1.0の範囲で用いられる。この値が0.01未
満ではエポキシ樹脂の硬化が不十分となり、1.0
を越えると好ましくない未反応のモノアミド化合
物が多量に残存し易くなり、かつ２官能性のエポ
キシ樹脂の場合には硬化が不十分となる。好まし
くは0.1〜0.6の範囲とされる。
必要に応じて用いられる硬化触媒としては、例
えばトリメチルアミン、トリエチルアミン、トリ
エチレンジアミン、Ｎ，Ｎ−ジエチルアニリン、
Ｎ，Ｎ−ジメチルアニリン、トリス（ジメチルア
ミノメチル）フエノール、Ｎ−メチルモルホリ
ン、Ｎ−メチルモルホリン、１，８−ジアザービ
シクロ（５，４，０）ウンデセン−７（又はこの
有機酸塩）等の三級アミン類、セチルトリメチル
アンモニウムブロマイド、ドデシルトリメチルア
ンモニウムアイオダイト、ベンジルジメチルテト
ラデシルアンモニウムアセテート等の第四級アン
モニウム塩、さらに２−メチルイミダゾール、２
−エチルイミダゾール、２−メチル−４−メチル
イミダゾール、１−シアノエチル−２−メチルイ
ミダゾール、１−シアノエチル−２−フエニルイ
ミダゾール、２−フエニル−４−メチル−５−ヒ
ドロキシメチルイミダゾール、２−フエニル−
４，５−ジヒドロキシメチルイミダゾール、１−
アジン−２−メチルイミダゾール等のイミダゾー
ル化合物などが用いられる。この使用量はエポキ
シ樹脂に対して0.1〜10重量％、好ましくは0.5〜
５重量％の範囲で用いられる。とくに、三級アミ
ン類及びイミダゾール化合物が好ましい。
本発明になる熱硬化性樹脂組成物は、実用的な
硬化条件下例えば150℃で３〜10時間、200℃で１
〜５時間で十分に硬化反応が進行し、有用な硬化
物となる。
本発明になる熱硬化性樹脂組成物は必要に応じ
て、充てん剤、ガラス繊維、炭素繊維等の強化材
などを含んでもよい。
充てん剤としては、例えば溶融石英粉末、ヒユ
ーズレツクスRD−８（以上、龍森社製商品名）、
ガラス繊維としては、例えばFESS−005、FESS
−010、FESS−015（以上、富士フアイバーグラ
ス社製商品名）、炭素繊維としては、例えば
T300、T500（以上、東レ社商品名）を0.1mm〜１
mm程度に切断したものなどが使用される。
本発明になる熱硬化性樹脂組成物は、シート、
積層材料、モールド品、接着剤、複合材料、封止
材料、注型材料、粉体塗料などの広範囲な用途に
適用することができる。
以下、本発明を比較例、実施例で具体的に説明
する。
実施例 １〜３
ビスフエノールＡ型エポキシ樹脂エピコート
828（シエル化学社製、商品名）、下式のモノアミ
ド化合物（以下、ｔ−BAAと略す）及び硬化触
媒として2PZ−CN（四国化成社製、１−シアノエ
チル−２−フエニルイミダゾール）を表１の配合
で調製して熱硬化性樹脂組成物を得た。
この熱硬化性樹脂組成物を200℃で４時間、加
熱して得た硬化物の有無をアセトンに対する溶解
性で調べた結果を表１に合わせて示した。アセト
ンに対する溶解性については、微粉末化した硬化
物をアセトンに浸漬し、煮沸２時間後に硬化物が
完全に溶解した場合をゲル化せず、硬化物がほと
んど溶解しない場合をゲル化と判定した。
The present invention relates to thermosetting resin compositions. The thermosetting of epoxy resins by certain polyamide resins has been shown in the paper by LI Komarova et al., Journal of Polymer Science, Polymer Letters Edition.
Polymer Science, Polymer Letters Edition)
14(3), 179 (1976). The present inventors have discovered that a monoamide compound, which has better compatibility with an epoxy resin than a polyamide resin, cures the epoxy resin under practical curing conditions. That is, the present invention contains an epoxy resin (), a monoamide compound () represented by the formula (), and if necessary a curing catalyst (),
The present invention relates to a thermosetting resin composition having an equivalent ratio of ( )/( ) of 0.01 to 1.0. (However, in the formula, R 1 and R 2 are hydrogen atoms or have 1 carbon number
~17 alkyl group. ) There are no particular limitations on the epoxy resin used in the present invention. For example, Araldite GY250, 260,
280, CY221, 230, CT200 (manufactured by Ciba Geigy, product name), Epicote 815, 828, 1001, 1004,
1007 (manufactured by Ciel Chemical Co., Ltd., trade name) Adekal Resin Ep-4100, 4900, 4340 (manufactured by Asahi Denka Co., Ltd., trade name), Epicron 840, 850, 855, 857, 860, 1050
(manufactured by Dainippon Ink Chemical Co., Ltd., product name), Priebo PEB-10, PE-10, PE-100 (manufactured by Dainippon Shikizai Co., Ltd., product name), AER330R, 331R, 334R,
Bisphenol type epoxy resin ECN1235, 1273, 1280, such as 337R (manufactured by Asahi Kasei Co., Ltd., product name), etc.
EPN1138 (manufactured by Ciba Geigy, product name),
ESCN-220 (manufactured by Sumitomo Chemical Co., Ltd., product name), N-730,
N-770, N-660, N-670 (manufactured by Dainippon Ink Chemical Co., Ltd., trade name), PE2010, PE2020 (manufactured by Dainippon Shikizai Kogyo Co., Ltd., trade name), EOCN-102, 103, 104
Novolac type epoxy resins such as (manufactured by Nippon Kayaku Co., Ltd., trade name), CY175, 177, 179 (manufactured by Ciba Geigy Co., Ltd., trade names), ERL-4206, 4221 (and above)
Cycloaliphatic epoxy resins such as UCC (trade name), CY350, XB2615 (manufactured by Ciba Geigy,
Heterocyclic epoxy resins such as (trade name), TEPIC (manufactured by Nissan Chemical Co., Ltd., trade name), YDB-
340, YDB-715 (manufactured by Toto Kasei Co., Ltd., product name),
Araldite 8011 (manufactured by Ciba Geigy, product name),
Brominated epoxy resins such as ESB-340, ESB-400, and ESB-500 (product names manufactured by Sumitomo Chemical Co., Ltd.) are used. Considering economic efficiency, bisphenol A type epoxy resin is preferred. The monoamide compound represented by the above formula () used in the present invention can be obtained by a known synthesis method. For example, a monoamide compound in which R 1 and R 2 are H in formula () can be used in the dehydrochlorination reaction between benzoic acid chloride and aniline, the dehydration reaction between benzoic acid and aniline, the decarboxylation reaction between benzoic acid and phenyl isocyanate, etc. You can get it by twisting it. Considering the versatility of the material, R 1 and
Monoamide compound where R 2 is a hydrogen atom or R 1 is t-
Monoamide compounds in which a butyl group and R 2 are hydrogen atoms are preferred. Considering the heat resistance of the cured product, R 1 and
Particularly preferred are monoamide compounds in which R 2 is a hydrogen atom. The ratio of the epoxy resin () and the above-mentioned monoamide compound () used is such that ()/() is an equivalent ratio of 0.01 to 1.0. If this value is less than 0.01, the curing of the epoxy resin will be insufficient;
If it exceeds this amount, a large amount of undesirable unreacted monoamide compound tends to remain, and in the case of a bifunctional epoxy resin, curing becomes insufficient. Preferably it is in the range of 0.1 to 0.6. Examples of curing catalysts used as necessary include trimethylamine, triethylamine, triethylenediamine, N,N-diethylaniline,
N,N-dimethylaniline, tris(dimethylaminomethyl)phenol, N-methylmorpholine, N-methylmorpholine, 1,8-diazabicyclo(5,4,0)undecene-7 (or its organic acid salt), etc. Tertiary amines of
-ethylimidazole, 2-methyl-4-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-
4,5-dihydroxymethylimidazole, 1-
Imidazole compounds such as azine-2-methylimidazole are used. The amount used is 0.1 to 10% by weight, preferably 0.5 to 10% by weight based on the epoxy resin.
It is used in a range of 5% by weight. Particularly preferred are tertiary amines and imidazole compounds. The thermosetting resin composition of the present invention can be cured under practical curing conditions, for example, at 150°C for 3 to 10 hours and at 200°C for 1 hour.
The curing reaction progresses sufficiently in ~5 hours, resulting in a useful cured product. The thermosetting resin composition of the present invention may contain fillers, reinforcing materials such as glass fibers, carbon fibers, etc., as necessary. Examples of the filler include fused quartz powder, Fuzurex RD-8 (trade name manufactured by Ryumori Co., Ltd.),
Examples of glass fiber include FESS-005, FESS
-010, FESS-015 (the above are product names manufactured by Fuji Fiberglass Co., Ltd.), carbon fibers include, for example
T300, T500 (all Toray product names) from 0.1mm to 1
Cut into pieces of about mm size are used. The thermosetting resin composition of the present invention includes a sheet,
It can be applied to a wide range of applications such as laminated materials, molded products, adhesives, composite materials, sealing materials, casting materials, and powder coatings. The present invention will be specifically explained below using comparative examples and examples. Examples 1 to 3 Bisphenol A type epoxy resin Epicoat
828 (manufactured by Ciel Kagaku Co., Ltd., trade name), a monoamide compound of the following formula (hereinafter abbreviated as t-BAA), and 2PZ-CN (manufactured by Shikoku Kasei Co., Ltd., 1-cyanoethyl-2-phenylimidazole) as a curing catalyst. A thermosetting resin composition was obtained by preparing the composition of Example 1. The presence or absence of a cured product obtained by heating this thermosetting resin composition at 200° C. for 4 hours was examined by solubility in acetone, and the results are shown in Table 1. Regarding solubility in acetone, a finely powdered cured product was immersed in acetone, and when the cured product completely dissolved after 2 hours of boiling, it was determined that it did not gel, and when the cured product hardly dissolved, it was determined that it had gelled. .
【表】
実施例 ４〜５
ビスフエノールＡ型エポキシ樹脂エピコート
828、下式のモノアミド化合物（以下、BAと略
す）及び硬化触媒として2PZ−CNを表２の配合
で調製して熱硬化性樹脂組成物を得た。
この熱硬化性樹脂組成物を200℃で３時間、加
熱して得た硬化物のゲル化の有無をアセトンに対
する溶解性で調べた結果を表２に合わせて示し
た。[Table] Examples 4-5 Bisphenol A type epoxy resin Epicoat
828, a monoamide compound of the following formula (hereinafter abbreviated as BA), and 2PZ-CN as a curing catalyst were prepared in the proportions shown in Table 2 to obtain a thermosetting resin composition. The thermosetting resin composition was heated at 200° C. for 3 hours, and the presence or absence of gelation of the cured product was examined by solubility in acetone. The results are shown in Table 2.
【表】
比較例 １〜３
ビスフエノールＡ型エポキシ樹脂エピコート
828、モノアミド化合物ｔ−BAA又はBA及び硬
化触媒として2PZ−CNを表３の配合で調製して
熱硬化性樹脂組成物を得た。この熱硬化性樹脂組
成物を200℃で４時間、加熱して得た硬化物のゲ
ル化の有無をアセトンに対する溶解性で調べた結
果を表３に合わせて示した。[Table] Comparative Examples 1 to 3 Bisphenol A type epoxy resin Epicoat
828, a monoamide compound t-BAA or BA, and 2PZ-CN as a curing catalyst were prepared according to the formulations shown in Table 3 to obtain a thermosetting resin composition. This thermosetting resin composition was heated at 200° C. for 4 hours, and the presence or absence of gelation of the cured product was examined by solubility in acetone. The results are shown in Table 3.
【表】
以上の結果から本発明になる熱硬化性樹脂組成
物は、比較例では達成できない熱硬化性を示して
おり、実用的な硬化条件下で有用なゲル化物が得
られることが示される。[Table] The above results indicate that the thermosetting resin composition of the present invention exhibits thermosetting properties that cannot be achieved in the comparative examples, and that a useful gelled product can be obtained under practical curing conditions. .
Claims (1)
ノアミド化合物（）及び必要に応じて硬化触媒
（）を含有し、（）／（）を当量比で0.01〜
1.0としてなる熱硬化性樹脂組成物。 （但し、式中R1及びR2は水素原子又は炭素数１
〜17のアルキル基を表わす。） ２ エポキシ樹脂（）がビスフエノールＡ型エ
ポキシ樹脂である特許請求の範囲第１項記載の熱
硬化性樹脂組成物。 ３ 式（）で示されるモノアミド化合物が式
（）のR1及びR2が水素原子であるモノアミド化
合物である特許請求の範囲第１項又は第２項記載
の熱硬化性樹脂組成物。[Claims] 1. Contains an epoxy resin (), a monoamide compound () represented by the formula (), and optionally a curing catalyst (), with an equivalent ratio of ()/() from 0.01 to
Thermosetting resin composition as 1.0. (However, in the formula, R 1 and R 2 are hydrogen atoms or have 1 carbon number
~17 alkyl group. 2. The thermosetting resin composition according to claim 1, wherein the epoxy resin () is a bisphenol A type epoxy resin. 3. The thermosetting resin composition according to claim 1 or 2, wherein the monoamide compound represented by formula () is a monoamide compound in which R 1 and R 2 of formula () are hydrogen atoms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20883683A JPS60101112A (en) | 1983-11-07 | 1983-11-07 | Thermosetting resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20883683A JPS60101112A (en) | 1983-11-07 | 1983-11-07 | Thermosetting resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60101112A JPS60101112A (en) | 1985-06-05 |
| JPH043405B2 true JPH043405B2 (en) | 1992-01-23 |
Family
ID=16562907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20883683A Granted JPS60101112A (en) | 1983-11-07 | 1983-11-07 | Thermosetting resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60101112A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2600236B2 (en) * | 1987-12-29 | 1997-04-16 | ソニー株式会社 | Sampling frequency conversion circuit |
| JP2016050260A (en) * | 2014-08-29 | 2016-04-11 | Jsr株式会社 | Curable composition, cured film, semiconductor element, display element, and latent base catalyst |
-
1983
- 1983-11-07 JP JP20883683A patent/JPS60101112A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60101112A (en) | 1985-06-05 |
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