JPH04341005A - Surface acoustic wave element using diamond film - Google Patents
Surface acoustic wave element using diamond filmInfo
- Publication number
- JPH04341005A JPH04341005A JP14068491A JP14068491A JPH04341005A JP H04341005 A JPH04341005 A JP H04341005A JP 14068491 A JP14068491 A JP 14068491A JP 14068491 A JP14068491 A JP 14068491A JP H04341005 A JPH04341005 A JP H04341005A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- diamond
- acoustic wave
- surface acoustic
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 42
- 239000010432 diamond Substances 0.000 title claims abstract description 22
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 24
- 238000007740 vapor deposition Methods 0.000 claims abstract description 7
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 abstract description 24
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052799 carbon Inorganic materials 0.000 abstract description 4
- 229910003327 LiNbO3 Inorganic materials 0.000 abstract description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011521 glass Substances 0.000 abstract description 2
- 229910052739 hydrogen Inorganic materials 0.000 abstract description 2
- 239000001257 hydrogen Substances 0.000 abstract description 2
- 239000012535 impurity Substances 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 33
- 239000013078 crystal Substances 0.000 description 13
- 230000000704 physical effect Effects 0.000 description 9
- 239000010409 thin film Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 229910012463 LiTaO3 Inorganic materials 0.000 description 1
- 229910020294 Pb(Zr,Ti)O3 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052950 sphalerite Inorganic materials 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、高周波フィルタ等に用
いられる表面弾性波素子に関し、特に圧電体層の形成等
に有利なダイヤモンド状層を用いた表面弾性波素子及び
その製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface acoustic wave element used in high frequency filters and the like, and more particularly to a surface acoustic wave element using a diamond-like layer, which is advantageous for forming a piezoelectric layer, and a method for manufacturing the same.
【0002】0002
【従来の技術及び発明が解決しようとする課題】表面弾
性波素子は固体表面を伝搬する弾性波を応用した素子で
あり、従来、LiNbO3 のような圧電性が高く且つ
音波吸収損失が少ない結晶基板上に簾状電極を形成する
ことにより製造されていた。このような表面弾性波素子
において伝搬される周波数は表面波の波長及び音速に依
存するため、これらを改善してGHzの高周波数に対応
させることが考えられる。そして、表面波の波長は簾状
電極の電極の配列のピッチにより決まり、これを細かく
する程、表面波の高周波化を図ることができる。しかし
ながら、エッチング技術等の微細加工技術に限界がある
ため、電極の配列のピッチの微細化による高周波化は現
状では困難である。一方、音速は基板材料で決まるため
、音速が10000m/sを超えるサファイヤやダイヤ
モンド状層を圧電体膜と組み合わせて使用することによ
って、高周波化を図る技術が近年開発されている。[Prior Art and Problems to be Solved by the Invention] A surface acoustic wave device is a device that applies elastic waves propagating on a solid surface, and conventionally, a surface acoustic wave device uses a crystal substrate such as LiNbO3 that has high piezoelectricity and low sound wave absorption loss. It was manufactured by forming a blind electrode on top. Since the frequency propagated in such a surface acoustic wave element depends on the wavelength and sound speed of the surface wave, it is conceivable to improve these to correspond to a high frequency of GHz. The wavelength of the surface wave is determined by the pitch of the arrangement of the electrodes of the blind electrode, and the finer the pitch, the higher the frequency of the surface wave can be achieved. However, due to limitations in microfabrication techniques such as etching techniques, it is currently difficult to increase the frequency by making the pitch of the electrode arrangement finer. On the other hand, since the speed of sound is determined by the substrate material, technology has been developed in recent years to increase the frequency by using a sapphire or diamond-like layer with a sound speed of over 10,000 m/s in combination with a piezoelectric film.
【0003】昭和62年7月16日に出願された特開昭
64−20714号は、基板上にダイヤモンド薄膜、イ
ンタデジタルトランスデューサー及び圧電体膜とを組み
合わせて備えた表面波装置を開示している。この出願に
おいて、ダイヤモンド薄膜は、スパッタリング、真空蒸
着、イオンプレーティング、CVD等の方法で形成され
ることが記載されている。[0003] JP-A-64-20714, filed on July 16, 1988, discloses a surface acoustic wave device equipped with a combination of a diamond thin film, an interdigital transducer, and a piezoelectric film on a substrate. There is. This application describes that the diamond thin film is formed by methods such as sputtering, vacuum evaporation, ion plating, and CVD.
【0004】昭和62年9月3日に出願された特開昭6
2−220937号は、単結晶または多結晶ダイヤモン
ド層と圧電体層と電極層とを有する表面弾性波素子を開
示しており、同一出願人により昭和62年10月16日
に出願された特開平1−103310号は、ダイヤモン
ド状炭素膜層と圧電体層と電極層とを有する表面弾性波
素子を開示している。しかしながら、かかるダイヤモン
ド状炭素膜層の物性及び作成条件は何ら特定されていな
い。[0004] Japanese Unexamined Patent Publication No. 1983, filed on September 3, 1986
No. 2-220937 discloses a surface acoustic wave device having a single-crystal or polycrystalline diamond layer, a piezoelectric layer, and an electrode layer. No. 1-103310 discloses a surface acoustic wave device having a diamond-like carbon film layer, a piezoelectric layer and an electrode layer. However, the physical properties and production conditions of such a diamond-like carbon film layer have not been specified at all.
【0005】昭和63年3月15日に出願された特開昭
1−233819号及び昭和63年9月1日に出願され
た特開昭2−20910号には、単結晶半導体基板上に
、ダイヤモンド結晶薄膜及び窒化アルミニウム薄膜を順
次形成した三層複合構造弾性表面波素子が開示されてお
り、同一出願人により昭和63年11月18日に出願さ
れた特開昭2−137413号には、誘電体薄膜及び圧
電体薄膜が形成されたダイヤモンド単結晶を基板に埋め
込んだ弾性表面波デバイスの製造方法が記載されている
。これらの出願はいずれも単結晶等の結晶体ダイヤモン
ドを対象としている。[0005] Japanese Patent Application Laid-Open No. 1-233819 filed on March 15, 1988 and Japanese Patent Application Laid-open No. 2-20910 filed on September 1, 1988 disclose that on a single crystal semiconductor substrate, A surface acoustic wave device with a three-layer composite structure in which a diamond crystal thin film and an aluminum nitride thin film are successively formed is disclosed in JP-A-2-137413 filed by the same applicant on November 18, 1988. A method for manufacturing a surface acoustic wave device is described in which a diamond single crystal on which a dielectric thin film and a piezoelectric thin film are formed is embedded in a substrate. These applications all target crystalline diamonds such as single crystals.
【0006】また、平成1年3月14日に特許出願され
た特開平2−239715号には、ダイヤモンド基板上
に圧電体薄膜が形成された弾性表面波基板が開示されて
おり、ダイヤモンドとして人工及び天然ダイヤモンドを
対象としているが、製法や物性の詳細は何ら記載されて
いない。[0006] Furthermore, Japanese Patent Application Laid-open No. 2-239715, filed on March 14, 1999, discloses a surface acoustic wave substrate in which a piezoelectric thin film is formed on a diamond substrate, and artificial diamond is used as a surface acoustic wave substrate. and natural diamonds, but there are no details of manufacturing methods or physical properties.
【0007】上記の従来技術において、単結晶または多
結晶ダイヤモンドを用いる弾性表面波素子は、ダイヤモ
ンド膜の平滑度が低いため、圧電体層の結晶成長が容易
でなく、ダイヤモンド層上に形成された圧電体層の表面
平滑度や結合強度にも問題があった。[0007] In the above-mentioned prior art, surface acoustic wave devices using single-crystal or polycrystalline diamond do not have easy crystal growth of the piezoelectric layer due to the low smoothness of the diamond film. There were also problems with the surface smoothness and bond strength of the piezoelectric layer.
【0008】一方、非晶質ダイヤモンドであるダイヤモ
ンド状層は、その製造条件等によって、屈折率、硬度、
密度等の物性が異なる種々のものが得られ、表面弾性波
素子の周波数特性や製造容易性はダイヤモンド状層の物
性に著しく依存する。例えば、特願平2−83221号
には、ダイヤモンド状層は主に4種類のものに分類でき
ることが記載されている。On the other hand, the diamond-like layer, which is amorphous diamond, varies in refractive index, hardness, and
A variety of surface acoustic wave devices with different physical properties such as density can be obtained, and the frequency characteristics and ease of manufacture of surface acoustic wave devices are significantly dependent on the physical properties of the diamond-like layer. For example, Japanese Patent Application No. 2-83221 describes that diamond-like layers can be mainly classified into four types.
【0009】しかしながら、上記の従来技術のうちダイ
ヤモンド状層を用いた特開平1−103310号は、そ
の物性及び製造条件は何等記載されておらず、ダイヤモ
ンド状層は特定できない。出願人の調査及び研究によれ
ば単にダイヤモンド状層を用いただけでは良好な特性を
有する表面弾性波素子は得られない。特に、所定のビッ
カース硬度等の物性値を有するダイヤモンド状層でなけ
れば、圧電体膜の結晶成長及び後処理等が困難であり、
良好な素子を得ることができないことがわかった。However, among the above-mentioned conventional techniques, JP-A-1-103310, which uses a diamond-like layer, does not describe its physical properties or manufacturing conditions, and the diamond-like layer cannot be specified. According to the applicant's investigation and research, it is not possible to obtain a surface acoustic wave device with good characteristics simply by using a diamond-like layer. In particular, crystal growth and post-processing of the piezoelectric film are difficult unless the layer has a diamond-like layer having a certain physical property value such as Vickers hardness.
It was found that a good element could not be obtained.
【0010】そこで本発明の目的は、圧電体膜の形成、
後処理が容易であり且つ素子の平滑度が高く、それによ
って良好な表面弾性波素子機能をもたらす、ダイヤモン
ド状層を用いた表面弾性波素子及びその製造方法を提供
することを目的とする。Therefore, an object of the present invention is to form a piezoelectric film,
It is an object of the present invention to provide a surface acoustic wave device using a diamond-like layer and a method for manufacturing the same, which is easy to post-process and has high smoothness of the device, thereby providing good surface acoustic wave device functionality.
【0011】[0011]
【課題を解決するための手段】本発明者は、異なる物性
値を有する種々のダイヤモンド状層を用いて表面弾性波
素子を作製し、その特性及び製造容易性等を鋭意検討し
たところ、所定のビッカース硬度、密度等を有するダイ
ヤモンド状層を用いた場合だけ、表面弾性波素子の製造
に好適であり且つ良好な特性を有する表面弾性波素子を
得ることがきることを見出し、本発明を完成するに至っ
た。[Means for Solving the Problems] The present inventor fabricated surface acoustic wave devices using various diamond-like layers having different physical property values, and after intensively studying their characteristics and ease of manufacture, the inventors found that The present inventors have discovered that a surface acoustic wave device suitable for manufacturing a surface acoustic wave device and having good characteristics can be obtained only when a diamond-like layer having Vickers hardness, density, etc. is used, and the present invention has been completed. reached.
【0012】すなわち本発明は、ダイヤモンド状層と、
圧電体層と、電極層とを含む表面弾性波素子であって、
ダイヤモンド状層のビッカース硬度が6500〜900
0kg/mm2であることを特徴とする表面弾性波素子
を提供するものである。That is, the present invention provides a diamond-like layer;
A surface acoustic wave element including a piezoelectric layer and an electrode layer,
The Vickers hardness of the diamond-like layer is 6500-900
The present invention provides a surface acoustic wave element characterized in that the surface acoustic wave element is 0 kg/mm2.
【0013】本発明に用いるダイヤモンド状層とは、炭
素主成分とし、微量不純物として水素等を含む非晶質構
造の薄膜である。かかるダイヤモンド状層は単結晶及び
他結晶のダイヤモンド結晶体に比べて、膜の強度が十分
高く取扱いが容易であり、基板への密着性も十分である
。さらに、膜の平滑度が高いため圧電膜のC軸配向性が
改善される。また、ダイヤモンド状層は屈折率が高いた
め膜が緻密であり、これも圧電体のC軸配向性に有利と
なる。[0013] The diamond-like layer used in the present invention is a thin film with an amorphous structure mainly composed of carbon and containing a trace amount of impurity such as hydrogen. Such a diamond-like layer has sufficiently high film strength and is easy to handle, and has sufficient adhesion to the substrate, as compared to single-crystal and other-crystalline diamond crystal bodies. Furthermore, since the film has high smoothness, the C-axis orientation of the piezoelectric film is improved. Further, since the diamond-like layer has a high refractive index, the film is dense, which is also advantageous for the C-axis orientation of the piezoelectric material.
【0014】本発明に従えば、ダイヤモンド状層のビッ
カース硬度が6500〜9000kg/mm2の範囲に
ある必要がある。ここにビッカース硬度を制限したのは
、硬度はダイヤモンド状層の耐熱性に強く依存しており
、この範囲にあるダイヤモンド状層は十分な耐熱性を有
するからである。これによりダイヤモンド状層は圧電体
膜を真空成膜する際に必要な基板温度に十分に耐えるこ
とができ、さらに成膜した圧電体膜の後処理を可能にし
て圧電体膜の結晶性を向上することができる。特にこの
後処理には500℃ほどの高温が要求される。ビッカー
ス硬度が上記範囲内にないと、ダイヤモンド状層上に形
成した圧電体層、例えば、ZnO2 層のC軸配向性は
低くなる。According to the present invention, the Vickers hardness of the diamond-like layer must be in the range of 6,500 to 9,000 kg/mm 2 . The reason why the Vickers hardness is limited here is that the hardness strongly depends on the heat resistance of the diamond-like layer, and a diamond-like layer within this range has sufficient heat resistance. As a result, the diamond-like layer can sufficiently withstand the substrate temperature required when depositing the piezoelectric film in vacuum, and also enables post-processing of the deposited piezoelectric film to improve the crystallinity of the piezoelectric film. can do. In particular, this post-treatment requires a high temperature of about 500°C. If the Vickers hardness is not within the above range, the C-axis orientation of the piezoelectric layer, such as a ZnO2 layer, formed on the diamond-like layer will be low.
【0015】また、ダイヤモンド状層の密度が、2.3
5〜2.41の範囲にあることが好ましく、屈折率が3
.45〜3.50にあることが好ましい。密度及び屈折
率が上記範囲内にあることにより、一層平滑な膜であり
密度が高く、屈折率が高いことは膜が緻密であることで
あり、その上に形成される圧電体膜の平滑度及びダイヤ
モンド状層との結合性も向上し、圧電体膜のC軸配向し
易くなる。さらに、この範囲の物性値を有することでダ
イヤモンド状層が緻密になり、圧電体膜の結晶成長が容
易になるというということが非常に重要である。[0015] Furthermore, the density of the diamond-like layer is 2.3
It is preferable that the refractive index is in the range of 5 to 2.41, and the refractive index is 3.
.. It is preferably between 45 and 3.50. If the density and refractive index are within the above range, the film will be smoother and the density will be higher.Higher refractive index means that the film is denser, and the smoothness of the piezoelectric film formed on it will be higher. The bondability with the diamond-like layer also improves, and the C-axis orientation of the piezoelectric film becomes easier. Furthermore, it is very important that having physical property values in this range makes the diamond-like layer dense and facilitates crystal growth of the piezoelectric film.
【0016】本発明に用いるダイヤモンド状層は、種々
の方法で形成できるが、特に、平滑度の高いダイヤモン
ド状層が得られるという理由でイオン化蒸着法が好まし
い。膜厚は特に制限されないが1〜20μm程度が良好
である。また、上記ビッカース硬度、密度、屈折率との
間には、相関関係があることが中山らにより見出されて
おり(特願平2−144480)、かかる関係を用いる
ことにより容易に上記物性値の範囲内のダイヤモンド状
層を製造することができる。[0016] The diamond-like layer used in the present invention can be formed by various methods, but the ionization vapor deposition method is particularly preferred because it yields a diamond-like layer with high smoothness. Although the film thickness is not particularly limited, it is preferably about 1 to 20 μm. Furthermore, Nakayama et al. have found that there is a correlation between the Vickers hardness, density, and refractive index (Japanese Patent Application No. 144480/1999), and by using this relationship, the physical property values can be easily determined. Diamond-like layers within the range of .
【0017】上記のようなダイヤモンド状層は、一般に
、基板上に形成する。基板材料は特に制限されず、ガラ
ス、アルミナ等を用いることができる。A diamond-like layer as described above is generally formed on a substrate. The substrate material is not particularly limited, and glass, alumina, etc. can be used.
【0018】本発明に用いる圧電体膜は、ZnO、Al
N,ZnS,LiNbO3 、Pb(Zr,Ti)O3
、LiTaO3 、SiO2 、Ta2 O5 等を
用いることが出来るが特にそれらに制限されない。Al
NはZnOよりも音速を向上出来るため有利である。こ
れらの圧電材料は、スパッタリング、真空蒸着、CVD
等の種々の方法により形成できる。これらの圧電体膜は
一般にはダイヤモンド状層上に形成されるが、成膜時の
基板温度を高くし、さらに成膜後に圧電体の配向性を向
上するために追加の熱処理を施すのが好ましい。特に本
発明の所定のビッカース硬度を有するダイヤモンド状層
は良好な耐熱性を有するのでかかる後処理に好適である
。The piezoelectric film used in the present invention is made of ZnO, Al
N, ZnS, LiNbO3, Pb(Zr,Ti)O3
, LiTaO3, SiO2, Ta2O5, etc., but are not particularly limited thereto. Al
N is advantageous because it can improve the sound velocity more than ZnO. These piezoelectric materials can be produced by sputtering, vacuum deposition, CVD
It can be formed by various methods such as. These piezoelectric films are generally formed on a diamond-like layer, but it is preferable to raise the substrate temperature during film formation and to perform additional heat treatment after film formation to improve the orientation of the piezoelectric material. . In particular, the diamond-like layer of the present invention having a predetermined Vickers hardness has good heat resistance and is therefore suitable for such post-treatment.
【0019】本発明に用いる電極層は、アルミニウム、
金等の金属が用いられる。電極層の形成は、フォトリソ
グラフィーが好適である。電極層の形成位置は、特に限
定されず、圧電体層上、ダイヤモンド状層上のいずれで
もかまわない。また、対抗電極の位置も上記のように特
に制限されない。The electrode layer used in the present invention is made of aluminum,
Metals such as gold are used. Photolithography is suitable for forming the electrode layer. The position where the electrode layer is formed is not particularly limited, and may be either on the piezoelectric layer or the diamond-like layer. Furthermore, the position of the counter electrode is not particularly limited as described above.
【0020】さらに本発明は、ダイヤモンド状層と、圧
電体層と、電極層とを含む表面弾性波素子を製造する方
法であって、ビッカース硬度が6500〜9000kg
/mm2のダイヤモンド膜をイオン化蒸着法により形成
することを特徴とする表面弾性波素子の製造方法をも提
供するものである。圧電体層、電極層は、それぞれ上記
のような方法で製造することができ、各層の形成順序は
特に制限されない。Further, the present invention provides a method for manufacturing a surface acoustic wave device including a diamond-like layer, a piezoelectric layer, and an electrode layer, the surface acoustic wave device having a Vickers hardness of 6500 to 9000 kg.
The present invention also provides a method for manufacturing a surface acoustic wave device, characterized in that a diamond film of /mm2 is formed by an ionized vapor deposition method. The piezoelectric layer and the electrode layer can be manufactured by the methods described above, and the order in which the layers are formed is not particularly limited.
【0021】以下に本発明の実施例を示すが、本発明は
それらに制限されるものではない。Examples of the present invention are shown below, but the present invention is not limited thereto.
【0022】[0022]
ダイヤモンド状層の形成
イオン化蒸着法により、特開平第1−234396号、
同第1−234397号、同2−196095号等に記
載されたイオン化蒸着装置を用いて、シリコンウェハー
基板上にダイヤモンド状層を形成させた。形成条件は以
下の通りである。Formation of a diamond-like layer by ionization vapor deposition method
A diamond-like layer was formed on a silicon wafer substrate using the ionization vapor deposition apparatus described in Japanese Patent No. 1-234397 and Japanese Patent No. 2-196095. The formation conditions are as follows.
【0023】メタンガスを導入しガス圧を0.1Tor
rとして熱陰極フィラメントに放電を起こさせた。磁束
密度400ガウス、基体電圧Va=−300V、基体温
度200℃とした。またフィラメントには電流If=2
5Aを流した。フィラメントはコイル状としその幅3m
m、その回りを取り囲む電極36との隙間を8mmとし
た。
グリッドは5mm/分の速度で振動させた。なお、ビッ
カース硬度は電流値を変えることで調整できる。[0023] Methane gas is introduced and the gas pressure is set to 0.1 Torr.
A discharge was caused in the hot cathode filament as r. The magnetic flux density was 400 Gauss, the substrate voltage Va=-300V, and the substrate temperature was 200°C. Also, the filament has a current If=2
5A was flowed. The filament is coiled and its width is 3m.
m, and the gap between it and the surrounding electrode 36 was 8 mm. The grid was vibrated at a speed of 5 mm/min. Note that Vickers hardness can be adjusted by changing the current value.
【0024】また、同様の基板上にRFプラズマCVD
法及びマイクロ波プズマCVD法によりダイヤモンド状
層を同一基板上に形成した。結果を第1表に示す。[0024] Furthermore, RF plasma CVD was performed on the same substrate.
A diamond-like layer was formed on the same substrate by a method and a microwave plasma CVD method. The results are shown in Table 1.
【0025】[0025]
【表1】
同表より、本発明の6500から9000kg/mm2
のビッカース硬度を有するダイヤモンド膜は500℃
以上の耐熱温度を有しており、その上に形成する成膜基
板温度を温度を上昇させることができること並びに成膜
した圧電体層の加熱処理に絶え得ることがわかる。また
、形成されたダイヤモンド状層の平滑度を同表に示した
。平滑度はDEKTAK IIA(ULVAC社)に
より測定した。イオン化蒸着法により形成したダイヤモ
ンド状層は良好な平滑度を有することがわかる。[Table 1] From the same table, 6500 to 9000 kg/mm2 of the present invention
A diamond film with a Vickers hardness of 500℃
It can be seen that it has the above-mentioned allowable temperature limit, and that it is possible to raise the temperature of the substrate on which a film is formed, and that the heat treatment of the formed piezoelectric layer can be stopped. Further, the smoothness of the formed diamond-like layer is shown in the same table. The smoothness was measured using DEKTAK IIA (ULVAC). It can be seen that the diamond-like layer formed by the ionized vapor deposition method has good smoothness.
【0026】屈折率及び密度の測定
屈折率はエリプソメーターにより測定した。密度はMg
O上に作成した膜を塩酸で剥離し測定した。Measurement of refractive index and density The refractive index was measured using an ellipsometer. Density is Mg
The film formed on O was peeled off with hydrochloric acid and measured.
【0027】圧電体層の成膜
スパッタ法によりAlN膜を上記のダイヤモンド状層上
に形成した。成膜温度を第1表中に示す。成膜条件はガ
ス圧2.2×10−3Torr、スパッタ用RF電源2
00W、Ar/N2 のガス比1/1、成膜の膜厚2.
4μmとした。
(1) 付着力等の測定
SEBASTIAN装置を用いて測定した。
(2) AlNの熱処理
熱処理炉へ入れ熱処理する。
(3) 熱処理前後のAlN層の配向性AlNのX線回
折を測定する。(002)面の角度に固定しそのロッキ
ングカーブを測定する。その標準偏差σよりC軸配向性
が評価できる。An AlN film was formed on the above diamond-like layer by a piezoelectric layer forming sputtering method. The film forming temperatures are shown in Table 1. The film forming conditions were gas pressure 2.2 x 10-3 Torr and sputtering RF power supply 2.
00W, Ar/N2 gas ratio 1/1, film thickness 2.
It was set to 4 μm. (1) Measurement of adhesion force, etc. Measured using a SEBASTIAN device. (2) Heat treatment of AlN Place in a heat treatment furnace for heat treatment. (3) Measure the X-ray diffraction of oriented AlN in the AlN layer before and after heat treatment. The angle of the (002) plane is fixed and its rocking curve is measured. The C-axis orientation can be evaluated from the standard deviation σ.
【0028】電極の形成
Alを蒸着して電極を作成する。こうして得られた本発
明の表面弾性波素子の断面図を第2図に示す。図中、1
は基板、2はダイヤモンド状層、3は圧電体層、4は電
極を示す。本発明の表面弾性波素子の構造は図の構造に
限定されず、本発明の範囲内で、当業者ならば、電極の
位置、や対抗電極の有無等の任意に選択でき、それらは
本発明の範囲に包含される。Formation of electrodes Electrodes are formed by vapor depositing Al. A cross-sectional view of the surface acoustic wave device of the present invention thus obtained is shown in FIG. In the figure, 1
2 represents a substrate, 2 represents a diamond-like layer, 3 represents a piezoelectric layer, and 4 represents an electrode. The structure of the surface acoustic wave device of the present invention is not limited to the structure shown in the figure, and within the scope of the present invention, those skilled in the art can arbitrarily select the positions of the electrodes, the presence or absence of counter electrodes, etc. Included within the scope of.
【0029】[0029]
【発明の効果】本発明の方法によれば、圧電体層の結晶
配向性を十分に向上することができ、ダイヤモンド層と
圧電体層の結合性も良好であり、さらに平滑な圧電体層
を形成することができる。この方法により得られた本発
明の表面弾性波素子は、機械的強度、音速等において高
性能、高品位の表面弾性波素子であるため、高周波フィ
ルタ等の用途に好適である。[Effects of the Invention] According to the method of the present invention, the crystal orientation of the piezoelectric layer can be sufficiently improved, the bond between the diamond layer and the piezoelectric layer is also good, and a smooth piezoelectric layer can be obtained. can be formed. The surface acoustic wave device of the present invention obtained by this method is a surface acoustic wave device with high performance and high quality in terms of mechanical strength, sound velocity, etc., and is therefore suitable for applications such as high frequency filters.
【図1】 基板上に形成したダイヤモンド状膜のビッ
カース硬度と耐熱温度の関係を示す図である。FIG. 1 is a diagram showing the relationship between Vickers hardness and allowable temperature limit of a diamond-like film formed on a substrate.
【図2】 本発明の一具体例である表面弾性波素子構
造を示す図である。FIG. 2 is a diagram showing a surface acoustic wave device structure that is a specific example of the present invention.
1 基板、 2 ダイヤモンド状層、 3 圧電体層、 4 電極、 1 Substrate, 2 Diamond-like layer, 3 piezoelectric layer, 4 electrode,
Claims (4)
極層とを含む表面弾性波素子であって、ダイヤモンド状
層のビッカース硬度が6500〜9000kg/mm2
であることを特徴とする表面弾性波素子。1. A surface acoustic wave device comprising a diamond-like layer, a piezoelectric layer, and an electrode layer, wherein the diamond-like layer has a Vickers hardness of 6500 to 9000 kg/mm2.
A surface acoustic wave device characterized by:
極層とを含む表面弾性波素子であって、ダイヤモンド状
層の屈折率が2.35〜2.41であり且つ密度が3.
45〜3.50であることを特徴とする表面弾性波素子
。2. A surface acoustic wave device comprising a diamond-like layer, a piezoelectric layer, and an electrode layer, wherein the diamond-like layer has a refractive index of 2.35 to 2.41 and a density of 3.
45 to 3.50.
極層とを含む表面弾性波素子を製造する方法であって、
ダイヤモンド膜をビッカース硬度が6500〜9000
kg/mm2になるように形成することを特徴とする表
面弾性波素子の製造方法。3. A method for manufacturing a surface acoustic wave device comprising a diamond-like layer, a piezoelectric layer, and an electrode layer, the method comprising:
Vickers hardness of diamond film is 6500-9000
A method for manufacturing a surface acoustic wave element, characterized in that the surface acoustic wave element is formed so as to have a weight of 1 kg/mm2.
法により形成される請求項1〜3のいずれか一項の表面
弾性波素子。4. The surface acoustic wave device according to claim 1, wherein the diamond-like layer is formed by an ionized vapor deposition method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03140684A JP3110491B2 (en) | 1991-05-17 | 1991-05-17 | Surface acoustic wave device using diamond-like film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03140684A JP3110491B2 (en) | 1991-05-17 | 1991-05-17 | Surface acoustic wave device using diamond-like film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04341005A true JPH04341005A (en) | 1992-11-27 |
| JP3110491B2 JP3110491B2 (en) | 2000-11-20 |
Family
ID=15274353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03140684A Expired - Fee Related JP3110491B2 (en) | 1991-05-17 | 1991-05-17 | Surface acoustic wave device using diamond-like film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3110491B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5838090A (en) * | 1995-02-09 | 1998-11-17 | Sumitomo Electric Industries, Ltd. | Surface acoustic wave device |
| KR20020007212A (en) * | 2000-07-19 | 2002-01-26 | 무라타 야스타카 | Thin film, method for manufacturing thin film, and electronic component |
| KR100858600B1 (en) * | 2001-10-05 | 2008-09-17 | 스미토모덴키고교가부시키가이샤 | Diamond substrate for surface acoustic wave device and surface acoustic wave device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8038616B2 (en) | 2003-05-30 | 2011-10-18 | Surf Technology As | Acoustic imaging by nonlinear low frequency manipulation of high frequency scattering and propagation properties |
-
1991
- 1991-05-17 JP JP03140684A patent/JP3110491B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5838090A (en) * | 1995-02-09 | 1998-11-17 | Sumitomo Electric Industries, Ltd. | Surface acoustic wave device |
| KR20020007212A (en) * | 2000-07-19 | 2002-01-26 | 무라타 야스타카 | Thin film, method for manufacturing thin film, and electronic component |
| US6931701B2 (en) | 2000-07-19 | 2005-08-23 | Murata Manufacturing Co., Ltd. | Method for manufacturing a thin film |
| KR100858600B1 (en) * | 2001-10-05 | 2008-09-17 | 스미토모덴키고교가부시키가이샤 | Diamond substrate for surface acoustic wave device and surface acoustic wave device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3110491B2 (en) | 2000-11-20 |
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