JPH04342256A - Photomask - Google Patents

Abstract

PURPOSE:To revent an adhesive from remaining on a substrate even at the time of peeling a frame supporting a pellicle from the substrate with respect to a photomask provided with the pellicle. CONSTITUTION:Chromium is vapor-deposited on the center part of a substrate 1 to form a circuit pattern 5, a surface frame 4 is directly stuck to the substrate in the periphery of the circuit pattern 5 by an adhesive 3. A pellicle 6 which covers the circuit pattern 5 and is supported by the surface frame 4 is provided on the surface frame 4. Even if the surface frame 4 is peeled with peeling liquid at the time of finding dust or the like in the pellicle 6 and the surface frame 4, the adhesive does not remain on the substrate because the chromium vapor- deposition film does not exist in the part, to which the frame is stuck, on the substrate.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photomask such as a reticle equipped with a pellicle.

0002

[Prior Art] In recent years, photomasks such as reticles have
Pellicles have come to be installed as a surface protection film to prevent foreign matter such as dust from adhering to the surface. FIG. 3 shows a planar configuration of a reticle equipped with a conventional pellicle. Further, FIG. 4 shows a cross-sectional configuration taken along the line IV-IV in FIG. 3. The reticle shown in FIGS. 3 and 4 includes a substrate 1 made of quartz glass or the like, a circuit pattern 5 formed in the center of the surface of the substrate 1, and a chromium-deposited film 2 formed around the circuit pattern 5. have. The circuit pattern 5 is formed by depositing chromium on the substrate 1, and the chromium deposited film 2
formed at the same time. A surface frame 4 is provided on the chromium vapor deposited film 2 so as to surround the circuit pattern 5, and is attached using an adhesive 3. The surface frame 4 supports a pellicle 6 to prevent foreign matter such as dust from adhering to the circuit pattern 5.

A back frame 14 is attached to the back side of the substrate 1 with an adhesive 13, and the back frame 14 supports a back pellicle 16 to prevent foreign matter such as dust from adhering to the back side of the board 1. .

In the reticle having the above configuration, when foreign matter such as dust is found inside the portion covered by the pellicle 6 and the surface frame 4, the surface frame 4 is coated with a stripping liquid to remove the foreign matter. The chromium vapor deposited film 2 on the substrate 1 is peeled off using a chromium vapor deposited film 2 on the substrate 1. Next, the substrate 1 is cleaned and dried, and then the surface frame 4 is again pasted onto the chromium-deposited film 2 using the adhesive 3.

[0005]

[Problems to be Solved by the Invention] However, in the above-mentioned conventional structure, when the chromium-deposited film 2 is visually inspected after the surface frame 4 is peeled off from the chromium-deposited film 2, the adhesive 3 often remains. This is due to the high adhesion of the adhesive 3 to the chromium vapor deposited film 2. In order to compare the adhesion of the adhesive 3 to the substrate 1 and the chromium-deposited film 2, a reticle in which the surface frame 4 was directly attached with the adhesive 3 on the substrate 1 made of quartz glass, and a reticle in which the surface frame 4 was directly attached with the adhesive 3 to the substrate 1 made of quartz glass were used. An adhesive 3 is applied on the chromium vapor deposited film 2 formed on the top.
Using a reticle to which the surface frame 4 was attached using a reticle, the time required to peel off the surface frame 4 from the substrate 1 using a stripping solution was measured. As a result, the peeling time for the surface frame 4 formed on the chromium vapor deposited film 2 was about 20 minutes, whereas the peeling time for the surface frame 4 formed directly on the substrate 1 was about 10 minutes. This result shows that the adhesive force between the adhesive 3 and the chromium-deposited film 2 is greater than the adhesive force between the adhesive 3 and the substrate 1.

If the adhesive 3 remains on the chromium-deposited film 2 as described above, this adhesive 3 will float and adhere to the surface frame 4 and the circuit pattern 5 inside the pellicle 6 during the semiconductor device manufacturing process. There are things to do. Adhesion of the adhesive 3 to the circuit pattern 5 causes defects such as bridges in the pattern formed using this reticle.

The present invention solves the above conventional problems, and provides a photomask equipped with a pellicle in which adhesive does not remain on the substrate even when the frame supporting the pellicle is peeled off from the substrate. The purpose is to

[0008]

[Means for Solving the Problems] In order to achieve the above object, in the photomask of the present invention, chromium is not vapor-deposited on parts other than the circuit pattern, and the frame is directly attached to the substrate.

Specifically, the solution taken by the present invention is a photomask for use in patterning in the manufacturing process of semiconductor devices, in which a circuit pattern formed in the center of a photomask substrate and a circuit pattern formed in the center of the photomask substrate are The device includes a frame adhered around the circuit pattern on the top with an adhesive, and a pellicle supported by the frame so as to cover the circuit pattern.

0010

[Operation] With the structure of the present invention, since no chromium vapor deposition film is formed on the parts other than the circuit pattern formed in the center of the board, the frame supporting the pellicle can be directly attached to the board with adhesive. It will be done. Therefore, even if the frame is peeled off from the substrate using a peeling liquid in order to remove foreign matter such as dust inside the portion covered by the pellicle and frame, no adhesive remains on the substrate.

[0011]

Embodiments Hereinafter, embodiments of the present invention will be explained based on the drawings. FIG. 1 shows a planar configuration of a reticle according to an embodiment of the photomask of the present invention. FIG. 2 shows a cross-sectional configuration taken along line II-II in FIG. 1. The reticle of this embodiment has a substrate 1 as a photomask substrate made of quartz glass or the like, and a circuit pattern 5 formed at the center of the surface of the substrate 1. The circuit pattern 5 is formed by vapor-depositing chromium. It is formed. An adhesive 3 is applied around the circuit pattern 5 on the board 1.
The front frame 4 is attached using a. Board 1
Since chromium is not deposited on the portion where the upper surface frame 4 is attached, the substrate 1 and the surface frame 4 are directly attached using the adhesive 3. The surface frame 4 is provided so as to surround the circuit pattern 5 on the substrate 1, and a pellicle 6 is provided on the surface frame 4 to prevent foreign matter such as dust from adhering to the circuit pattern 5.

A back frame 14 is also attached to the back side of the substrate 1 with an adhesive 13, and the back frame 14 supports a back pellicle 16 to prevent foreign matter such as dust from adhering to the back side of the board 1. .

In the reticle of this embodiment configured as described above, when foreign matter such as dust is found inside the portion covered by the pellicle 6 and the surface frame 4, the surface frame is removed to remove the foreign matter. 4 is peeled off from the substrate 1 using a peeling solution. At that time, the circuit pattern 5 on the board 1
No chromium-deposited film is formed on the other parts, and the adhesive 3 for attaching the front frame 4 is directly attached to the substrate 1, so the adhesive 3 is not left on the substrate 1. easily removed. Next, the substrate 1 from which the surface frame 4 has been peeled off is washed and dried, and then the surface frame 4 is stuck onto the substrate 1 again using the adhesive 3, and the pellicle 6 is provided on the surface frame 4.

Even when the surface frame 4 was peeled off and pasted in order to remove foreign matter, there was no dust caused by the residual adhesive 3. Moreover, no abnormality occurred in the pattern formed using the reticle in which the surface frame 4 was peeled off and pasted as described above.

[0015]

[Effects of the Invention] As explained above, according to the photomask according to the present invention, the frame supporting the pellicle is directly attached using an adhesive to the part of the substrate where the chromium-deposited film is not formed. Therefore, even if the frame is peeled off from the substrate using a peeling liquid to remove foreign matter such as dust inside the pellicle and the part covered by the frame, no adhesive will remain on the substrate. Therefore, if the photomask of the present invention is used, even if foreign matter adheres to the inside of the frame and pellicle, it can be easily removed, and the pattern formed using this photomask will have defects such as bridges. can be avoided from occurring.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a reticle according to an embodiment of a photomask of the present invention.

FIG. 2 is a sectional view taken along line II-II in FIG. 1;

FIG. 3 is a plan view of a conventional reticle equipped with a pellicle.

FIG. 4 is a sectional view taken along the line IV-IV in FIG. 3;

[Explanation of symbols]

1 Substrate (photomask substrate) 3 Adhesive 4 Surface frame 5 Circuit pattern 6. Pellicle

Claims (1)

[Claims] 1. A photomask for use in patterning in the manufacturing process of semiconductor devices, comprising a circuit pattern formed in the center of a photomask substrate and an adhesive around the circuit pattern on the photomask substrate. What is claimed is: 1. A photomask comprising: a frame adhered to a pellicle; and a pellicle supported by the frame so as to cover the circuit pattern.