JPH043422B2 - - Google Patents
Info
- Publication number
- JPH043422B2 JPH043422B2 JP11527483A JP11527483A JPH043422B2 JP H043422 B2 JPH043422 B2 JP H043422B2 JP 11527483 A JP11527483 A JP 11527483A JP 11527483 A JP11527483 A JP 11527483A JP H043422 B2 JPH043422 B2 JP H043422B2
- Authority
- JP
- Japan
- Prior art keywords
- pump
- mechanical booster
- vacuum
- water ring
- booster pump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32357—Generation remote from the workpiece, e.g. down-stream
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J2219/0894—Processes carried out in the presence of a plasma
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/19—Details relating to the geometry of the reactor
- B01J2219/194—Details relating to the geometry of the reactor round
- B01J2219/1941—Details relating to the geometry of the reactor round circular or disk-shaped
- B01J2219/1942—Details relating to the geometry of the reactor round circular or disk-shaped spherical
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/18—Vacuum control means
- H01J2237/182—Obtaining or maintaining desired pressure
- H01J2237/1825—Evacuating means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/336—Changing physical properties of treated surfaces
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Description
【発明の詳細な説明】
技術分野
本発明はプラズマ処理方法に関する。さらに詳
しく述べると、本発明は、例えばポリプロピレ
ン、ポリエチレン等の合成樹脂材料からなる製品
(被処理物)の表面を改質するためにその表面を
酸素プラズマで低温プラズマ処理する方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION TECHNICAL FIELD The present invention relates to a plasma processing method. More specifically, the present invention relates to a method of subjecting the surface of a product (object to be treated) made of a synthetic resin material such as polypropylene or polyethylene to a low-temperature plasma treatment with oxygen plasma in order to modify its surface.
従来技術
近年、自動車部品の材料が軽量でかつ意匠性に
優れた合成樹脂材料に移行しつつあることは周知
の通りである。ところが、比較的安価で容易に入
手可能なポリプロピレン、ポリエチレン等の合成
樹脂材料は、それらを例えば車両外板に使用した
場合、材料表面とその上に施される塗膜との密着
性が悪いので、不所望な層間剥離を発生すること
が屡々である。かかる問題を解消する1手段とし
て、塗装に先がけて樹脂材料の表面を改質して塗
膜の密着性を良好ならしめる技術、例えば、塗装
前に樹脂材料の表面をグロー放電、コロナ放電、
ラジオ波放電、マイクロ波放電等に曝してその材
料の表面を酸化(極性基の導入)するかもしくは
エツチング(いわゆるアンカー効果の向上)する
技術が知られている。このような技術はプラズマ
処理技術と呼ばれている。BACKGROUND OF THE INVENTION It is well known that in recent years, materials for automobile parts have been shifting to synthetic resin materials that are lightweight and have excellent design. However, when synthetic resin materials such as polypropylene and polyethylene, which are relatively inexpensive and easily available, are used for example on vehicle exterior panels, the adhesion between the surface of the material and the coating applied thereon is poor. , which often causes undesirable delamination. One way to solve this problem is to improve the adhesion of the coating film by modifying the surface of the resin material prior to painting. For example, the surface of the resin material may be treated with glow discharge, corona discharge,
There are known techniques for oxidizing (introducing polar groups) or etching (improving the so-called anchor effect) the surface of the material by exposing it to radio wave discharge, microwave discharge, etc. Such technology is called plasma processing technology.
ところで、樹脂部品をプラズマ処理する場合に
は、その部品の耐熱性を考慮して、処理容器内を
真空状態にして処理ガスをプラズマ化させる方
法、いわゆる低温プラズマ(あるいは低圧プラズ
マ)処理方法が主として用いられている。ここ
で、処理容器内を減圧、真空状態にしかつ処理中
にその真空を維持するため、先ず油回転ポンプで
粗引きし、引き続いてメカニカルブースターポン
プで真空引きし、そしてその真空圧を維持する手
法が一般的に用いられている。 By the way, when plasma-treating resin parts, taking into account the heat resistance of the parts, the main method is to create a vacuum inside the processing container and turn the processing gas into plasma, the so-called low-temperature plasma (or low-pressure plasma) processing method. It is used. Here, in order to reduce the pressure inside the processing container and maintain the vacuum during processing, we first perform rough evacuation using an oil rotary pump, then evacuate using a mechanical booster pump, and then maintain the vacuum pressure. is commonly used.
上記した油回転ポンプは、その偏心ローターの
回転により吸入、圧縮及び排気を繰り返して排気
していくタイプであるので、ローターの回転中に
高熱を発し、したがつて、油温を約80℃以下にコ
ントロールするための空冷又は水冷手段を装備し
ている。しかしながら、この油回転ポンプの圧縮
部分は、たとえ上記のような冷却手段があろうと
も、その冷却が極く一部分のみに限られるので、
約200〜300℃に高温になることが屡々である。ポ
ンプの圧縮部分がこのような高温状態にある時に
プラズマ処理用ガスである酸素ガスをポンプに流
したとすると、当然のことながらこのローター圧
縮部分で爆発がおこり、ケーシング側壁が本体よ
り外れ、ポンプそのものが損壊する。この問題を
回避するため、水封ポンプを用いて粗引きし、そ
の後でメカニカルブースターポンプを用いて真空
排気する手法が考えられる。が、この手法を用い
た場合、水封ポンプは油回転ポンプに比して所要
動力が大きくかつ排気能力が低い(すなわち、到
達真空圧が高い)ので、自ずと排気時間が長くな
り、特に自動車部品等の量産ラインでは生産戦略
に対応できないという新たな問題が発生する。 The above-mentioned oil rotary pump is a type that repeatedly suctions, compresses, and exhausts air by rotating its eccentric rotor, so it generates high heat while the rotor rotates, and therefore keeps the oil temperature below about 80℃. Equipped with air or water cooling means to control However, even if the compression part of this oil rotary pump has the above-mentioned cooling means, cooling is limited to only a very small part.
High temperatures of approximately 200-300°C are common. If oxygen gas, which is a plasma processing gas, were to flow into the pump while the compression part of the pump was in such a high temperature state, an explosion would naturally occur in the rotor compression part, causing the side wall of the casing to separate from the main body, and the pump to be damaged. itself is damaged. In order to avoid this problem, a method of rough evacuation using a water ring pump and then evacuation using a mechanical booster pump can be considered. However, when this method is used, water ring pumps require more power and have lower exhaust capacity than oil rotary pumps (in other words, the ultimate vacuum pressure is higher), so the exhaust time naturally becomes longer, especially for automobile parts. A new problem arises in that mass production lines such as these cannot respond to production strategies.
発明の目的
本発明の目的は、プラズマ処理用ガスとして酸
素ガス又は酸素ガスを含む混合ガスを用いた低温
プラズマ処理方法であつて、そのようなガスの排
気処理中にガス爆発の危険が全くなくかつ迅速に
排気を実施可能な改良されたプラズマ処理方法を
提供することにある。OBJECT OF THE INVENTION The object of the present invention is to provide a low-temperature plasma processing method using oxygen gas or a mixed gas containing oxygen gas as a plasma processing gas, which eliminates the risk of gas explosion during the exhaust treatment of such gas. Another object of the present invention is to provide an improved plasma processing method that allows rapid evacuation.
発明の構成
上記した目的は、本発明によれば、被処理物を
収容した処理容器内を真空にし、酸素ガス又は酸
素ガスを含む混合ガスによりその被処理物を低温
プラズマ処理する方法において、水封ポンプ、油
回転ポンプ及びメカニカルブースターポンプを組
み合わせて真空排気処理を行なうことによつて達
成することができる。Composition of the Invention According to the present invention, in a method of evacuating the inside of a processing container containing an object to be processed and subjecting the object to low-temperature plasma treatment using oxygen gas or a mixed gas containing oxygen gas, This can be achieved by performing vacuum evacuation processing using a combination of a sealed pump, an oil rotary pump, and a mechanical booster pump.
本発明の実施において、水封ポンプと油回転ポ
ンプにより大気圧から粗引きし、次にメカニカル
ブースターポンプによりその最大吸入圧力以下の
真空圧から0.01〜1Torrまで真空排気し、引き続
いて酸素ガス又は酸素ガスを含む混合ガスを供給
すると同時に油回転ポンプを停止させ、水封ポン
プ及びメカニカルブースターポンプにより排気処
理を行なうのが好ましい。 In carrying out the present invention, rough evacuation is performed from atmospheric pressure using a water ring pump and an oil rotary pump, then evacuation is performed from a vacuum pressure below the maximum suction pressure to 0.01 to 1 Torr using a mechanical booster pump, and then oxygen gas or oxygen It is preferable to stop the oil rotary pump at the same time as supplying the mixed gas containing gas, and to perform exhaust treatment using a water ring pump and a mechanical booster pump.
さらに、処理容器、メカニカルブースターポン
プ及び水封ポンプを直列に配置し、そして前記水
封ポンプを最後段にメカニカルブースターポンプ
の吐出口側に接続しかつ油回転ポンプ及び前記メ
カニカルブースターポンプを並列に配置して排気
処理を行なうのが好ましい。 Further, a processing container, a mechanical booster pump, and a water ring pump are arranged in series, and the water ring pump is connected to the discharge port side of the mechanical booster pump at the last stage, and an oil rotary pump and the mechanical booster pump are arranged in parallel. It is preferable to carry out exhaust treatment.
さらに加えて、処理容器及びメカニカルブース
ターポンプを直列に配置し、そして最後段のメカ
ニカルブースターポンプの吐出口側に水封ポンプ
及び油回転ポンプを並列に配置して排気処理を行
なうのが好ましい。 In addition, it is preferable to arrange the processing container and the mechanical booster pump in series, and to perform the exhaust treatment by disposing a water ring pump and an oil rotary pump in parallel on the discharge port side of the mechanical booster pump at the last stage.
実施例
次に、添付の図面を参照しながら本発明の実施
を説明する。EXAMPLES The implementation of the present invention will now be described with reference to the accompanying drawings.
最初に、比較のため、従来のプラズマ処理方法
を第1図で説明する。図中の1は円筒形処理容器
であり、ステンレス鋼(SUS304)製、そして内
容積5m3である。被処理(図示せず)は適当なハ
ンガー手段を介してこの容器1内に収容される。
処理容器1には、容器内を大気圧に戻すための真
空リーク弁6、そして真空圧を表示するとともに
リレー信号を出すための2点式ピラニ真空計14
が取り付けられている。 First, for comparison, a conventional plasma processing method will be explained with reference to FIG. 1 in the figure is a cylindrical processing container, made of stainless steel (SUS304), and has an internal volume of 5 m 3 . The object to be treated (not shown) is accommodated in this container 1 via suitable hanger means.
The processing container 1 includes a vacuum leak valve 6 for returning the inside of the container to atmospheric pressure, and a two-point Pirani vacuum gauge 14 for displaying the vacuum pressure and outputting a relay signal.
is installed.
処理容器1へのプラズマの導入のため、先ずマ
イクロ波発振機15で2450MHzのマイクロ波を発
生させアイソレータ、パワーモニター検出部及び
スリースタブチユーナー(いずれも図示せず)を
通した後、導波管16によつてプラズマ発生炉1
7に伝送する。一方、プラズマ処理用ガス(ここ
では酸素ガス)を圧縮封入したガスボンベ19を
用意し、そのバルブ20の開閉によつて、流量計
21の指示にもとづく適切量の酸素ガスを、ナイロ
ン製ガスチユーブ22を通してプラズマ発生管1
8に供給する。プラズマ発生炉17と直交するこ
のプラズマ発生管18でプラズマを発生させ、こ
のプラズマをテフロン(フルオロカーボン樹脂の
登録商標)製のコネクタであるフロロコネクタ及
びフランジ(いずれも図示せず)を経て処理容器
1内のシヤワー管35に送り、ここから被処理物
上に噴射する。 To introduce plasma into the processing container 1, first, a 2450 MHz microwave is generated by the microwave oscillator 15, passed through an isolator, a power monitor detection section, and a three-stub tuner (none of which are shown), and then passed through a waveguide. Plasma generation furnace 1 by 16
7. On the other hand, a gas cylinder 19 compressed and sealed with a plasma processing gas (oxygen gas here) is prepared, and by opening and closing a valve 20 of the gas cylinder 19, a flow meter is set.
21, an appropriate amount of oxygen gas is passed through the nylon gas tube 22 to the plasma generating tube 1.
Supply to 8. Plasma is generated in this plasma generation tube 18 that is perpendicular to the plasma generation furnace 17, and the plasma is transferred to the processing vessel 1 through a fluoro connector and a flange (both not shown), which are connectors made of Teflon (a registered trademark of fluorocarbon resin). The liquid is sent to the shower pipe 35 inside, from which it is sprayed onto the object to be treated.
なお、処理容器内1の真空排気処理のためのポ
ンプ構成は次の通りである:処理容器1の底部に
は、それと各真空ポンプとを接続するための排気
ダクト2が取り付けられている。ここで使用する
真空ポンプは、排気速度2000m3/hr、最大吸入圧
力10Torr及び到達圧力5×10-4Torrの能力を有
するメカニカルブースターポンプ(所要電力
7.5kW)3、そして排気速度600m3/hr、最大吸
入圧力100Torr及び到達圧力2Torrの能力を有す
るメカニカルブースターポンプ(所要電力
3.7kW)4である。これらの真空ポンプへと途上
に、主制御弁7、真空圧設定のための圧力制御弁
8、そして真空圧設定のためのものであつて手動
導操作可能な操作弁9が取り付けられている。図
中の10,11及び12は、それぞれ、バイパス
回路調整のための真空弁である。13は圧力検知
により信号を出す真空スイツチ、そして14は真
空圧を表示するとともにリレー信号を出す2点式
ピラニ真空計である。この従来のポンプ構成で
は、それぞれオイルミストトラツプ24及び31
を装備した油回転ポンプ23及び30(排気速度
400m3/hr及び到達圧力5×10-3Torrの能力を有
する)によつて容器内の粗引きをやるようにでき
ているので、酸素ガス流入に原因してこれらのポ
ンプのローター圧縮部分で爆発が発生する。 The pump configuration for evacuation of the inside of the processing container 1 is as follows: An exhaust duct 2 is attached to the bottom of the processing container 1 to connect it to each vacuum pump. The vacuum pump used here is a mechanical booster pump (required power
7.5kW) 3, and a mechanical booster pump capable of pumping speed 600m3 /hr, maximum suction pressure 100Torr and ultimate pressure 2Torr (power
3.7kW) 4. On the way to these vacuum pumps, a main control valve 7, a pressure control valve 8 for setting the vacuum pressure, and an operation valve 9 for setting the vacuum pressure that can be manually operated are installed. 10, 11 and 12 in the figure are vacuum valves for adjusting the bypass circuit, respectively. 13 is a vacuum switch that outputs a signal by detecting pressure, and 14 is a two-point Pirani vacuum gauge that displays the vacuum pressure and outputs a relay signal. This conventional pump configuration has oil mist traps 24 and 31, respectively.
Oil rotary pumps 23 and 30 equipped with
400 m 3 /hr and ultimate pressure of 5 × 10 -3 Torr), the rotor compression part of these pumps is designed to perform rough evacuation in the container due to the inflow of oxygen gas. An explosion occurs.
次いで、本発明のプラズマ処理方法を第2図で
説明する。第2図に図示のプラズマ処理装置は、
前記した第1図のプラズマ処理装置とは異なつ
て、排気速度600m3/hr及び到達圧力17Torr(水
温15℃で)の能力を有する水封ポンプ5(所要電
力30kW)、そして制御弁29を介して排気系に
接続したものであつてオイルミストトラツプ26
付の油回転ポンプ25(排気速度400m3/hr及び
到達圧力5×10-3Torrの能力を有する)(所要電
力11kW)をポンプ構成に有する。なお、第1図
及び第2図のプラズマ処理装置において、理解を
容易ならしめるため、同一の手段には同一の参照
番号を付した。 Next, the plasma processing method of the present invention will be explained with reference to FIG. The plasma processing apparatus shown in FIG.
Unlike the plasma processing apparatus shown in FIG . The oil mist trap 26 is connected to the exhaust system.
The pump configuration includes an oil rotary pump 25 (having a capacity of pumping speed of 400 m 3 /hr and ultimate pressure of 5 × 10 -3 Torr) (required power of 11 kW). In the plasma processing apparatuses shown in FIGS. 1 and 2, the same reference numerals are given to the same means for easy understanding.
処理容器1へのプラズマの導入は、先に第1図
において説明した通りであるので、ここでは重複
をさけて説明を省略する。本発明による真空排気
処理を第3図のタイムチヤートをあわせて参照し
ながら説明すると、次の通りである:先ず、処理
容器1の開閉扉(図示せず)を閉じ、さらに真空
リーク弁6を閉じ、その後で真空排気を開始す
る。主制御弁7及び制御弁8が開き、これと同時
に水封ポンプ5及び油回転ポンプ25が作動す
る。所定時間の経過後、真空弁12が閉じ、処理
容器1内を減圧し始める。真空スイツチ13が予
め設定した圧力100Torrを検知(第1圧力検知)
した後、それの発する信号によつてメカニカルブ
ースターポンプ4が作動を開始する。次いで、2
点式ピラニ真空計14が圧力100Torrを検知(第
2圧力検知)した後(この真空計では予め
100Torr及び0.01Torrに圧力を設定)、それの発
するリレー信号によつてメカニカルブースターポ
ンプ3が作動を開始し、真空弁11を閉じる。さ
らに、前記したピラニ真空計14が圧力
0.01Torrを検知(第3圧力検知)すると、真空
弁10と主制御弁7が閉じさらにこれらと同時に
制御弁29が閉じて油回転ポンプ25が停止す
る。この結果制御弁8の配管側のみに排気流が形
成される。この排気流はまた、真空弁10及び1
1ならびに制御弁29が閉じたことによつて、油
回転ポンプ側及びバイパス側へは流れず、よつ
て、ポンプ3、ポンプ4及びポンプ5を通る一連
の流れが形成される。また、前記したピラニ真空
計14が圧力0.01Torrを検知すると、それの発
する圧力信号によつて真空バルブ20が開き、ボ
ンベ19内の酸素ガスが流量計21により定量さ
れ、ガスチユーブ22、プラズマ発生管18を経
て処理容器1内へ送られる。容器内へ流れ込んだ
酸素ガスは、先の一連の排気流にそつて、ポンプ
3及び4内を通り、水封ポンプ5内では水に接触
しながら流れ、最後に大気中へ放出される。ここ
で、操作弁9の開度を予め調整しておくことによ
つて、所定のガス供給量下で所定のプラズマ処理
真空圧になるように予め設定することができる。 Since the introduction of plasma into the processing container 1 is as previously explained in FIG. 1, the explanation will be omitted here to avoid duplication. The vacuum evacuation process according to the present invention will be explained with reference to the time chart shown in FIG. Close it and then start evacuation. The main control valve 7 and the control valve 8 open, and at the same time, the water seal pump 5 and the oil rotary pump 25 operate. After a predetermined period of time has elapsed, the vacuum valve 12 closes and the pressure inside the processing container 1 begins to be reduced. Vacuum switch 13 detects the preset pressure of 100 Torr (first pressure detection)
After that, the mechanical booster pump 4 starts operating according to the signal it emits. Then 2
After the point type Pirani vacuum gauge 14 detects a pressure of 100 Torr (second pressure detection)
Pressures are set at 100 Torr and 0.01 Torr), and the mechanical booster pump 3 starts operating according to the relay signal issued by it, and the vacuum valve 11 is closed. Furthermore, the Pirani vacuum gauge 14 described above
When 0.01 Torr is detected (third pressure detection), the vacuum valve 10 and the main control valve 7 are closed, and at the same time, the control valve 29 is closed and the oil rotary pump 25 is stopped. As a result, an exhaust flow is formed only on the piping side of the control valve 8. This exhaust flow also flows through vacuum valves 10 and 1
1 and the control valve 29 are closed, the flow does not flow to the oil rotary pump side and the bypass side, and a series of flows passing through the pumps 3, 4, and 5 are thus formed. Furthermore, when the Pirani vacuum gauge 14 detects a pressure of 0.01 Torr, the vacuum valve 20 is opened by the pressure signal generated by the Pirani vacuum gauge 14, and the oxygen gas in the cylinder 19 is quantified by the flow meter 21. It is sent into the processing container 1 through 18. The oxygen gas that has flowed into the container passes through the pumps 3 and 4 along with the previous series of exhaust flows, flows in the water ring pump 5 while contacting water, and is finally released into the atmosphere. By adjusting the opening degree of the operation valve 9 in advance, it is possible to set the plasma processing vacuum pressure to a predetermined plasma processing vacuum pressure under a predetermined gas supply amount.
酸素ガスを供給し、所定の真空圧に設定後、マ
イクロ波を発振させ、酸素ガスをプラズマ化して
処理容器内の被処理物を表面処理する。プラズマ
処理の終了後、ポンプ内を真空状態で維持する間
に先ず圧力制御弁8を閉じ(第1停止)、所定時
間の後に全真空ポンプを停止させる(第2停止)。
ポンプの停止後、真空リーク弁6を開け、処理容
器1内を大気圧に戻して一連のプラズマ処理を完
了する。 After supplying oxygen gas and setting a predetermined vacuum pressure, microwaves are oscillated to turn the oxygen gas into plasma, thereby surface-treating the object to be processed in the processing container. After the plasma treatment is completed, the pressure control valve 8 is first closed while maintaining the inside of the pump in a vacuum state (first stop), and after a predetermined time, the entire vacuum pump is stopped (second stop).
After the pump is stopped, the vacuum leak valve 6 is opened and the inside of the processing container 1 is returned to atmospheric pressure to complete a series of plasma processing.
発明の効果
本発明によれば、水封ポンプ内を流れる水は、
排気能力維持のために常時冷却されているので、
ローターの回転により高温化される懸念がなく、
したがつて、酸素ガスを排気処理する際の爆発の
危険性を解消することができる。さらに、本発明
によれば、従来方法と較べて非常に短時間のうち
に排気処理を完了することができる。Effects of the Invention According to the present invention, the water flowing inside the water ring pump is
Because it is constantly cooled to maintain exhaust capacity,
There is no need to worry about high temperatures caused by the rotation of the rotor.
Therefore, the risk of explosion when exhausting oxygen gas can be eliminated. Furthermore, according to the present invention, exhaust treatment can be completed in a much shorter time than with conventional methods.
第1図は従来方法を実施するためのプラズマ処
理装置の一例を示した概略図、第2図は本発明方
法を実施するためのプラズマ処理装置の好ましい
一例を示した概略図、そして第3図は第2図の装
置を使用して本発明方法を実施する場合の真空排
気処理のタイムチヤートである。
図中、1は処理容器、2は排気ダクト、3及び
4はメカニカルブースターポンプ、5は水封ポン
プ、そして25は油回転ポンプである。
FIG. 1 is a schematic diagram showing an example of a plasma processing apparatus for carrying out the conventional method, FIG. 2 is a schematic diagram showing a preferred example of a plasma processing apparatus for carrying out the method of the present invention, and FIG. 2 is a time chart of evacuation processing when carrying out the method of the present invention using the apparatus shown in FIG. In the figure, 1 is a processing container, 2 is an exhaust duct, 3 and 4 are mechanical booster pumps, 5 is a water ring pump, and 25 is an oil rotary pump.
Claims (1)
酸素ガス又は酸素ガスを含む混合ガスによりその
被処理物を低温プラズマ処理する方法であつて、
水封ポンプ、油回転ポンプ及びメカニカルブース
ターポンプを組み合わせて真空排気処理を行なう
ことを特徴とするプラズマ処理方法。 2 水封ポンプと油回転ポンプにより大気圧から
粗引きし、次にメカニカルブースターポンプによ
りその最大吸入圧力以下の真空圧から0.01〜
1Torrまで真空排気し、引き続いて酸素ガス又は
酸素ガスを含む混合ガスを供給すると同時に油回
転ポンプを停止させ、水封ポンプ及びメカニカル
ブースターポンプにより排気処理を行なう、特許
請求の範囲第1項に記載のプラズマ処理方法。 3 処理容器、メカニカルブースターポンプ及び
水封ポンプを直列に配置し、そして前記水封ポン
プを最後段のメカニカルブースターポンプの吐出
口側に接続しかつ油回転ポンプ及び前記メカニカ
ルブースターポンプを並列に配置して排気処理を
行なう、特許請求の範囲第1項に記載のプラズマ
処理方法。 4 処理容器及びメカニカルブースターポンプを
直列に配置し、そして最後段のメカニカルブース
ターポンプの吐出口側に水封ポンプ及び油回転ポ
ンプを並列に配置して排気処理を行なう、特許請
求の範囲第1項に記載のプラズマ処理方法。[Claims] 1. Vacuuming the inside of the processing container containing the object to be processed,
A method of subjecting a workpiece to low-temperature plasma treatment using oxygen gas or a mixed gas containing oxygen gas, the method comprising:
A plasma processing method characterized by performing vacuum evacuation processing using a combination of a water ring pump, an oil rotary pump, and a mechanical booster pump. 2. Roughly pump from atmospheric pressure using a water ring pump and an oil rotary pump, and then from a vacuum pressure of 0.01 to less than the maximum suction pressure using a mechanical booster pump.
Claim 1, in which the vacuum is evacuated to 1 Torr, and then oxygen gas or a mixed gas containing oxygen gas is supplied, at the same time the oil rotary pump is stopped, and the evacuation process is performed using a water ring pump and a mechanical booster pump. plasma treatment method. 3. A processing container, a mechanical booster pump, and a water ring pump are arranged in series, and the water ring pump is connected to the discharge port side of the last mechanical booster pump, and the oil rotary pump and the mechanical booster pump are arranged in parallel. 2. The plasma processing method according to claim 1, wherein the plasma processing method is performed by performing exhaust processing. 4. The exhaust treatment is performed by arranging a processing container and a mechanical booster pump in series, and arranging a water ring pump and an oil rotary pump in parallel on the discharge port side of the mechanical booster pump at the last stage. The plasma treatment method described in .
Priority Applications (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11527483A JPS608049A (en) | 1983-06-28 | 1983-06-28 | Plasmic treatment |
| AU24671/84A AU549376B2 (en) | 1983-02-25 | 1984-02-16 | Plasma treatment |
| EP91115536A EP0461683B1 (en) | 1983-02-25 | 1984-02-23 | Method for plasma treatment of resin material |
| EP84101926A EP0120307B1 (en) | 1983-02-25 | 1984-02-23 | Apparatus and method for plasma treatment of resin material |
| DE3486317T DE3486317T2 (en) | 1983-02-25 | 1984-02-23 | Device and method for plasma treatment of synthetic resin. |
| DE3486470T DE3486470T2 (en) | 1983-02-25 | 1984-02-23 | Process for plasma treatment of plastic resin |
| US06/825,941 US4678644A (en) | 1983-02-25 | 1986-01-30 | Apparatus and method for plasma treatment of resin material |
| AU82239/87A AU8223987A (en) | 1983-02-25 | 1987-12-08 | Apparatus and method for plasma treatment of resin material |
| AU82240/87A AU603397B2 (en) | 1983-02-25 | 1987-12-08 | Apparatus and method for plasma treatment of resin material |
| AU82237/87A AU8223787A (en) | 1983-02-25 | 1987-12-08 | Apparatus and method for plasma treatment of resin material |
| AU82238/87A AU8223887A (en) | 1983-02-25 | 1987-12-08 | Apparatus and method for plasma treatment of resin material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11527483A JPS608049A (en) | 1983-06-28 | 1983-06-28 | Plasmic treatment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS608049A JPS608049A (en) | 1985-01-16 |
| JPH043422B2 true JPH043422B2 (en) | 1992-01-23 |
Family
ID=14658600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11527483A Granted JPS608049A (en) | 1983-02-25 | 1983-06-28 | Plasmic treatment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS608049A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106807184A (en) * | 2017-02-08 | 2017-06-09 | 成都凯圣捷科技有限公司 | Plasma deaerating type of cycles |
-
1983
- 1983-06-28 JP JP11527483A patent/JPS608049A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS608049A (en) | 1985-01-16 |
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