JPH0434734U - - Google Patents

Info

Publication number
JPH0434734U
JPH0434734U JP7580290U JP7580290U JPH0434734U JP H0434734 U JPH0434734 U JP H0434734U JP 7580290 U JP7580290 U JP 7580290U JP 7580290 U JP7580290 U JP 7580290U JP H0434734 U JPH0434734 U JP H0434734U
Authority
JP
Japan
Prior art keywords
hoop
lead frame
shaped lead
encapsulation
preheating section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7580290U
Other languages
Japanese (ja)
Other versions
JP2551100Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990075802U priority Critical patent/JP2551100Y2/en
Publication of JPH0434734U publication Critical patent/JPH0434734U/ja
Application granted granted Critical
Publication of JP2551100Y2 publication Critical patent/JP2551100Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の実施例１を示す正面図、第２
図は本考案の実施例２を示す平面図、第３図は従
来例を示す正面図である。 １……封入金型、１ａ……上型、１ｂ……下型
、２……搬送部、３……フープ状リードフレーム
、４ａ，４ｂ……位置決めピン、５ａ，５ｂ……
予備加熱部。 Figure 1 is a front view showing Embodiment 1 of the present invention, Figure 2 is a front view showing Example 1 of the present invention;
The figure is a plan view showing a second embodiment of the present invention, and FIG. 3 is a front view showing a conventional example. DESCRIPTION OF SYMBOLS 1...Inclusion mold, 1a...Upper die, 1b...Lower die, 2...Transportation section, 3...Hoop-shaped lead frame, 4a, 4b...Positioning pin, 5a, 5b...
Preheating section.

Claims (1)

【実用新案登録請求の範囲】 (1) 封入金型と、搬送部と、予備加熱部とを有
する半導体素子封入装置であつて、 封入金型は、フープ状リードフレーム上に搭載
した半導体素子を樹脂封止させるものであり、 搬送部は、フープ状リードフレームを封入金型
に搬送させるものであり、 予備加熱部は、封入金型に搬送されるフープ状
リードフレームを予備加熱させるものであること
を特徴とする半導体素子封入装置。 (2) 前記予備加熱部は、フープ状リードフレー
ムの搬送路に沿う前後位置で該フープ状リードフ
レームを予備加熱させるものであることを特徴と
する請求項第(1)項記載の半導体素子封入装置。 (3) 前記予備加熱部は、フープ状リードフレー
ムの搬送路に沿う前後及び左右位置で該フープ状
リードフレームを予備加熱させるものであること
を特徴とする請求項第(1)項記載の半導体素子封
入装置。[Scope of Claim for Utility Model Registration] (1) A semiconductor device encapsulation device having an encapsulation mold, a conveying section, and a preheating section, wherein the encapsulation mold is used to mount a semiconductor device on a hoop-shaped lead frame. The transport section is for transporting the hoop-shaped lead frame to the encapsulation mold, and the preheating section is for preheating the hoop-shaped lead frame to be transported to the encapsulation mold. A semiconductor element encapsulation device characterized by the following. (2) The semiconductor element encapsulation according to claim (1), wherein the preheating section preheats the hoop-shaped lead frame at front and back positions along the conveyance path of the hoop-shaped lead frame. Device. (3) The semiconductor according to claim 1, wherein the preheating section preheats the hoop-shaped lead frame at front and rear and left and right positions along the conveyance path of the hoop-shaped lead frame. Element encapsulation equipment.
JP1990075802U 1990-07-17 1990-07-17 Semiconductor device encapsulation equipment Expired - Lifetime JP2551100Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990075802U JP2551100Y2 (en) 1990-07-17 1990-07-17 Semiconductor device encapsulation equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990075802U JP2551100Y2 (en) 1990-07-17 1990-07-17 Semiconductor device encapsulation equipment

Publications (2)

Publication Number Publication Date
JPH0434734U true JPH0434734U (en) 1992-03-23
JP2551100Y2 JP2551100Y2 (en) 1997-10-22

Family

ID=31616703

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990075802U Expired - Lifetime JP2551100Y2 (en) 1990-07-17 1990-07-17 Semiconductor device encapsulation equipment

Country Status (1)

Country Link
JP (1) JP2551100Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599729A (en) * 1979-01-26 1980-07-30 Hitachi Ltd Resin molding method of electronic part

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599729A (en) * 1979-01-26 1980-07-30 Hitachi Ltd Resin molding method of electronic part

Also Published As

Publication number Publication date
JP2551100Y2 (en) 1997-10-22

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