JPH0434795U - - Google Patents
Info
- Publication number
- JPH0434795U JPH0434795U JP7655090U JP7655090U JPH0434795U JP H0434795 U JPH0434795 U JP H0434795U JP 7655090 U JP7655090 U JP 7655090U JP 7655090 U JP7655090 U JP 7655090U JP H0434795 U JPH0434795 U JP H0434795U
- Authority
- JP
- Japan
- Prior art keywords
- heat conduction
- conduction block
- block
- metal core
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 4
- 230000013011 mating Effects 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第1図は本考案による熱伝導式棚箱の一実施例
を示す要部斜視図、第2図はその一部分断面図、
第3図は従来の熱伝導式棚箱を示す要部斜視図、
第4図はその一部分断面図である。
1……金属コアプリント基板、2……電子部品
、6a……上部熱伝導ブロツク、6b……下部熱
伝導ブロツク、7a,7b……くさび状金具、8
a,8b……ヒートパイプ、9a,9b……パイ
プ、10a,10b……冷却ブロツク、11a,
11b……熱伝導コネクタ、12……金属コア入
マザーボード、13……金属コア。
Fig. 1 is a perspective view of essential parts showing an embodiment of a thermally conductive shelf box according to the present invention, Fig. 2 is a partially sectional view thereof,
Figure 3 is a perspective view of the main parts of a conventional thermally conductive shelf box.
FIG. 4 is a partially sectional view thereof. DESCRIPTION OF SYMBOLS 1...Metal core printed circuit board, 2...Electronic component, 6a...Upper heat conduction block, 6b...Lower heat conduction block, 7a, 7b...Wedge-shaped metal fittings, 8
a, 8b...Heat pipe, 9a, 9b...Pipe, 10a, 10b...Cooling block, 11a,
11b...Heat conduction connector, 12...Motherboard with metal core, 13...Metal core.
Claims (1)
及び下部熱伝導ブロツクと、 この上部熱伝導ブロツク及び下部熱伝導ブロツ
クにそれぞれ埋設され、一端を上部熱伝導ブロツ
ク及び下部熱伝導ブロツク後端面から突出させた
ヒートパイプと、 このヒートパイプの一端に取り付けられた冷却
ブロツクとを備え、 前記上部熱伝導ブロツクと下部熱伝導ブロツク
との間に実装された金属コアプリント基板に搭載
された電子部品の熱を、金属コアプリント基板か
ら上部熱伝導ブロツクと下部熱伝導ブロツクに伝
え、更にこの両ブロツクからそれぞれヒートパイ
プを介して冷却ブロツクに伝えて冷却する熱伝導
式棚箱において、 金属コアプリント基板の先端に熱伝導コネクタ
を取り付け、 この熱伝導コネクタが嵌合する相手方の熱伝導
コネクタを取り付けた金属コア入マザーボードの
上端部と下端部を前記上部熱伝導ブロツクと下部
熱伝導ブロツクの後端面に固定して、 金属コアプリント基板に搭載された電子部品の
熱が、この熱伝導コネクタと金属コア入マザーボ
ードからも上部熱伝導ブロツクと下部熱伝導ブロ
ツクに伝わるようにしたことを特徴とする熱伝導
式棚箱。[Claim for Utility Model Registration] An upper heat conduction block and a lower heat conduction block forming the upper and lower surfaces of the shelf box; The heat conduction block has a heat pipe protruding from the rear end surface, a cooling block attached to one end of the heat pipe, and a metal core printed circuit board mounted between the upper heat conduction block and the lower heat conduction block. In a thermally conductive shelf box, heat from mounted electronic components is transferred from a metal core printed circuit board to an upper heat conduction block and a lower heat conduction block, and then from these blocks to a cooling block via heat pipes for cooling. A heat conduction connector is attached to the tip of the metal core printed circuit board, and the upper and lower ends of the metal core motherboard, to which the mating heat conduction connector is attached, are connected to the upper heat conduction block and the lower heat conduction block. It is fixed to the rear end of the block so that the heat from the electronic components mounted on the metal core printed circuit board is transferred from this heat conduction connector and the metal core motherboard to the upper heat conduction block and the lower heat conduction block. Features a heat conductive shelf box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7655090U JPH0434795U (en) | 1990-07-20 | 1990-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7655090U JPH0434795U (en) | 1990-07-20 | 1990-07-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0434795U true JPH0434795U (en) | 1992-03-23 |
Family
ID=31618123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7655090U Pending JPH0434795U (en) | 1990-07-20 | 1990-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0434795U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009123828A (en) * | 2007-11-13 | 2009-06-04 | Denki Kagaku Kogyo Kk | Light emitting device |
| JP2009123829A (en) * | 2007-11-13 | 2009-06-04 | Denki Kagaku Kogyo Kk | Light emitting device |
| JP2017522677A (en) * | 2014-07-08 | 2017-08-10 | エーディーシー テクノロジーズ インコーポレイテッドAdc Technologies Inc. | Robust and redundant leak-proof cooling enclosure wall |
-
1990
- 1990-07-20 JP JP7655090U patent/JPH0434795U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009123828A (en) * | 2007-11-13 | 2009-06-04 | Denki Kagaku Kogyo Kk | Light emitting device |
| JP2009123829A (en) * | 2007-11-13 | 2009-06-04 | Denki Kagaku Kogyo Kk | Light emitting device |
| JP2017522677A (en) * | 2014-07-08 | 2017-08-10 | エーディーシー テクノロジーズ インコーポレイテッドAdc Technologies Inc. | Robust and redundant leak-proof cooling enclosure wall |
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