JPH04355378A - Confirmation of contact probe - Google Patents
Confirmation of contact probeInfo
- Publication number
- JPH04355378A JPH04355378A JP3155502A JP15550291A JPH04355378A JP H04355378 A JPH04355378 A JP H04355378A JP 3155502 A JP3155502 A JP 3155502A JP 15550291 A JP15550291 A JP 15550291A JP H04355378 A JPH04355378 A JP H04355378A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- probe
- measuring
- measurement point
- confirmed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims abstract description 40
- 238000012790 confirmation Methods 0.000 title claims description 5
- 238000007689 inspection Methods 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 9
- 238000005259 measurement Methods 0.000 description 29
- 238000010586 diagram Methods 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】この発明は、複数個のコンタクト
プローブを位置制御装置で制御し、プリント回路基板の
所望の部分に当て、該プリント回路基板上の素子の特性
を検査するプリント配線基板検査装置(以下プローブ移
動式基板検査装置と呼ぶ)の測定方法に関し、更に詳し
くはコンタクトプローブの接触状態の確認方法に関する
ものである。[Industrial Application Field] This invention is a printed wiring board inspection method in which a plurality of contact probes are controlled by a position control device and applied to a desired portion of a printed circuit board to inspect the characteristics of elements on the printed circuit board. The present invention relates to a method for measuring a device (hereinafter referred to as a moving probe type board inspection device), and more specifically to a method for checking the contact state of a contact probe.
【0002】0002
【従来の技術】プローブ移動式基板検査装置では、従来
、コンタクトプローブ(以下プローブと呼ぶ)が、プリ
ント回路基板(以下基板と呼ぶ)に正確に接触している
かどうかを検知する方法はなかった。2. Description of the Related Art Conventionally, in a probe movable board inspection apparatus, there has been no method for detecting whether a contact probe (hereinafter referred to as a probe) is accurately in contact with a printed circuit board (hereinafter referred to as a board).
【0003】0003
【発明が解決しようとする課題点】近年、基板実装部品
の小型化に伴い、部品端子間の短絡不良が発生しやすい
ため、プローブを用いて、測定点間が短絡していないこ
とを検査する場合が多い。しかし、プローブの接触不良
が生じている場合は、端子間が短絡していても、短−2
−絡を検出することができず、誤判定をする。本発明は
かかる誤判定を未然に防止するためになされたものであ
る。[Problems to be Solved by the Invention] In recent years, with the miniaturization of board-mounted components, short-circuit defects between component terminals are likely to occur, so a probe is used to inspect for short-circuits between measurement points. There are many cases. However, if the probe has poor contact, even if the terminals are short-circuited,
- Unable to detect faults and make incorrect judgments. The present invention has been made in order to prevent such misjudgments.
【0004】0004
【課題を解決するための手段・作用】以下、本発明の構
成ならびに作用を図1を用いて説明する。コンタクトプ
ローブ1(1)、2(2)、3(3)はいずれも位置制
御装置に装着された移動式プローブであり、各プローブ
からの測定信号はすべて測定部(9)に入力される。ま
た、測定ポイント1(4)と測定ポイント2(5)の間
の導通及び測定ポイント3(6)と測定ポイント4(7
)の間の導通は、先行する検査で確認済とする。[Means and Operations for Solving the Problems] The structure and operations of the present invention will be explained below with reference to FIG. Contact probes 1 (1), 2 (2), and 3 (3) are all movable probes attached to a position control device, and all measurement signals from each probe are input to a measurement section (9). In addition, continuity between measurement point 1 (4) and measurement point 2 (5) and measurement point 3 (6) and measurement point 4 (7) is also confirmed.
) has been confirmed in a previous inspection.
【0005】今、被測定素子(8)の両端子(測定ポイ
ント1および測定ポイント3)間が短絡していないこと
を確認する場合を考える。まず、プローブ1(1)を測
定ポイント1(4)に、プローブ2(2)を測定ポイン
ト2(5)に接触させ、測定部(9)により導通を確認
することにより、プローブ1(1)の接触状態を確認し
、続いてプローブ1(1)はそのままにして、プローブ
3(3)を測定ポイント3(6)にプローブ2(2)を
測定ポイント4(7)に接触させ、導通状態を確認して
、プローブ3(3)の接触を確認する。Now, let us consider the case of confirming that there is no short circuit between both terminals (measurement point 1 and measurement point 3) of the device under test (8). First, probe 1 (1) is brought into contact with measurement point 1 (4), probe 2 (2) is brought into contact with measurement point 2 (5), and continuity is confirmed by the measurement part (9). Then, leave probe 1 (1) as it is and touch probe 3 (3) to measurement point 3 (6) and probe 2 (2) to measurement point 4 (7) to ensure continuity. Check the contact of probe 3 (3).
【0006】以上の操作により、プローブ1(1)及び
プローブ3(3)は、それぞれ測定ポイント1(4)お
よび測定ポイント3(6)に接触していることが確認で
きており、この状態で両測定ポイント間を測定部(9)
で測定することにより、短絡しているにもかわらず、短
絡していないという誤判定を防止できる。Through the above operations, it has been confirmed that probe 1 (1) and probe 3 (3) are in contact with measurement point 1 (4) and measurement point 3 (6), respectively, and in this state, Measurement part (9) between both measurement points
By measuring with , it is possible to prevent an erroneous determination that there is no short circuit even though there is a short circuit.
【0007】[0007]
【実施例】図1の実施例では、測定ポイント1と測定ポ
イント2および測定ポイント3と−3−測定ポイント4
は、プリントパターンにより接続されている場合を示し
ているが抵抗、ダイオード等の素子で接続されている場
合であっても同様に通用可能である。また、プローブの
本数は3本として説明したが、3本以上であれば同様の
方法が適用できる。[Example] In the example of FIG. 1, measurement point 1, measurement point 2, measurement point 3, -3-measurement point 4,
shows a case in which connections are made by printed patterns, but it is equally possible to use cases in which connections are made by elements such as resistors and diodes. Further, although the description has been made assuming that the number of probes is three, the same method can be applied if there are three or more probes.
【0008】図2は、本発明の他の実施例を示したもの
である。測定ポイント1(4)、測定ポイント2(5)
、測定ポイント3(6)にそれぞれプローブ1(1)、
プローブ2(2)、プローブ3(3)を接触させ、集積
回路(12)の保護ダイオードを検出することにより、
プローブの接触状態を確認する。その後、測定ポイント
1(4)、測定ポイント3(6)の短絡の有無を検査す
るものである。この場合はプローブを移動させることな
く接触確認を行うことが可能である。FIG. 2 shows another embodiment of the invention. Measurement point 1 (4), measurement point 2 (5)
, probe 1 (1) at measurement point 3 (6), respectively.
By bringing probe 2 (2) and probe 3 (3) into contact and detecting the protection diode of the integrated circuit (12),
Check the contact status of the probe. Thereafter, the presence or absence of a short circuit between measurement point 1 (4) and measurement point 3 (6) is inspected. In this case, contact confirmation can be performed without moving the probe.
【0009】[0009]
【発明の効果】本発明の方法を利用すれば、簡単な方法
でプローブの接触状態を検知することができ、測定点間
の短絡確認試験を確実に実施することができる。By using the method of the present invention, the contact state of a probe can be detected in a simple manner, and a short circuit confirmation test between measurement points can be reliably carried out.
【図1】本発明の方法を利用した測定方法を示す図であ
る。FIG. 1 is a diagram showing a measurement method using the method of the present invention.
【図2】本発明の他の方法を利用した他の測定方法を示
す図である。FIG. 2 is a diagram showing another measurement method using another method of the present invention.
(1)、(2)、(3)はコンタクトプローブ(4)、
(5)、 (6)、 (7)は測定ポイント(8)は被
測定素子
(9)はプリント回路基板(10)はプリント回路基板
(11)はプリントパターン
(12)は集積回路(1), (2), (3) are contact probes (4),
(5), (6), (7) are the measurement points (8) are the device under test (9) are the printed circuit board (10) are the printed circuit board (11) are the printed pattern (12) are the integrated circuit
Claims (1)
置で制御し、所望の部分の電気的検査を順次行うプリン
ト回路基板検査装置において、被測定点に当てられたコ
ンタクトプローブの接触状態を、接触状態が確定した回
路部分の測定により確認することを特徴とするコンタク
トプローブ接触確認法。1. A printed circuit board inspection apparatus in which a plurality of contact probes are controlled by a position control device to sequentially conduct an electrical test on a desired part. A contact probe contact confirmation method characterized by confirmation by measuring a circuit part whose state has been determined.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3155502A JPH04355378A (en) | 1991-05-31 | 1991-05-31 | Confirmation of contact probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3155502A JPH04355378A (en) | 1991-05-31 | 1991-05-31 | Confirmation of contact probe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04355378A true JPH04355378A (en) | 1992-12-09 |
Family
ID=15607453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3155502A Pending JPH04355378A (en) | 1991-05-31 | 1991-05-31 | Confirmation of contact probe |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04355378A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007121183A (en) * | 2005-10-31 | 2007-05-17 | Hioki Ee Corp | Circuit board inspection equipment |
| JP2009156860A (en) * | 2007-12-07 | 2009-07-16 | Ricoh Co Ltd | Inspection device |
-
1991
- 1991-05-31 JP JP3155502A patent/JPH04355378A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007121183A (en) * | 2005-10-31 | 2007-05-17 | Hioki Ee Corp | Circuit board inspection equipment |
| JP2009156860A (en) * | 2007-12-07 | 2009-07-16 | Ricoh Co Ltd | Inspection device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4247076B2 (en) | Substrate inspection system and substrate inspection method | |
| JPH04355378A (en) | Confirmation of contact probe | |
| KR101428661B1 (en) | Apparatus for testing | |
| JPH09203765A (en) | Visual combination type board inspection device | |
| JPS62187258A (en) | Inspecting method for circuit board | |
| JP6618826B2 (en) | Circuit board inspection equipment | |
| JPH07104026A (en) | Soldering defect detection method for mounted components | |
| JPH04315068A (en) | Apparatus for inspecting printed circuit board | |
| JPH1164428A (en) | Parts inspection equipment | |
| JPH10142281A (en) | Circuit board inspection method | |
| JP4982543B2 (en) | Detection method for through-hole breakage in multilayer boards | |
| JPH01242972A (en) | Inspecting device for short circuit and disconnection of pattern | |
| JPH11202016A (en) | Method and apparatus for inspecting circuit board | |
| JP4369002B2 (en) | Circuit board inspection equipment | |
| JP6733199B2 (en) | Inspection device, inspection method, and inspection program | |
| JPH07146322A (en) | Method for detecting defective soldering of mounted component leads | |
| JPH01100474A (en) | Circuit board inspector | |
| JP2591453B2 (en) | Burn-in board inspection apparatus and burn-in board inspection method | |
| JPS6122268A (en) | Inspecting machine for printed circuit board | |
| JPH0511022A (en) | Circuit board inspecting device | |
| JPS638432B2 (en) | ||
| JPH07287042A (en) | In-circuit inspection method | |
| JPS62130364A (en) | Inspecting method for printed wiring board | |
| JPH04102078A (en) | Wiring board inspection device | |
| JPH0567188B2 (en) |