JPH04358B2 - - Google Patents

Info

Publication number: JPH04358B2
Authority: JP; Japan
Prior art keywords: lead; leads; long groove; insulating material; connecting body
Prior art date: 1989-09-29
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP25400089A

Other languages

English (en)

Japanese (ja)

Other versions

JPH02155180A (ja

Inventor

Asaji Mochizuki

Isao Ookubo

Shintaro Aiba

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

AI TEI TEI KYANON KK

Original Assignee

AI TEI TEI KYANON KK

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1989-09-29

Filing date

1989-09-29

Publication date

1992-01-07

1989-09-29 Application filed by AI TEI TEI KYANON KK filed Critical AI TEI TEI KYANON KK

1989-09-29 Priority to JP25400089A priority Critical patent/JPH02155180A/ja

1990-06-14 Publication of JPH02155180A publication Critical patent/JPH02155180A/ja

1992-01-07 Publication of JPH04358B2 publication Critical patent/JPH04358B2/ja

Status Granted legal-status Critical Current

Links

239000011810 insulating material Substances 0.000 claims description 14
238000000034 method Methods 0.000 claims description 8
239000012212 insulator Substances 0.000 claims description 6
239000000463 material Substances 0.000 claims description 4
238000005530 etching Methods 0.000 claims description 2
238000004080 punching Methods 0.000 claims 1
239000002184 metal Substances 0.000 description 6
229910052751 metal Inorganic materials 0.000 description 6
238000004519 manufacturing process Methods 0.000 description 4
239000004065 semiconductor Substances 0.000 description 2
238000005476 soldering Methods 0.000 description 2
229910000881 Cu alloy Inorganic materials 0.000 description 1
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
239000000853 adhesive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
239000004020 conductor Substances 0.000 description 1
238000005520 cutting process Methods 0.000 description 1
230000002950 deficient Effects 0.000 description 1
238000010586 diagram Methods 0.000 description 1
230000000694 effects Effects 0.000 description 1
238000003825 pressing Methods 0.000 description 1
230000035939 shock Effects 0.000 description 1
229910000679 solder Inorganic materials 0.000 description 1
229920003002 synthetic resin Polymers 0.000 description 1
239000000057 synthetic resin Substances 0.000 description 1

Landscapes

Connecting Device With Holders (AREA)

JP25400089A 1989-09-29 1989-09-29 接続素子の組み立て方法および，リード構体 Granted JPH02155180A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP25400089A JPH02155180A (ja)	1989-09-29	1989-09-29	接続素子の組み立て方法および，リード構体

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP25400089A JPH02155180A (ja)	1989-09-29	1989-09-29	接続素子の組み立て方法および，リード構体

Publications (2)

Publication Number	Publication Date
JPH02155180A JPH02155180A (ja)	1990-06-14
JPH04358B2 true JPH04358B2 (2)	1992-01-07

Family

ID=17258872

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP25400089A Granted JPH02155180A (ja)	1989-09-29	1989-09-29	接続素子の組み立て方法および，リード構体

Country Status (1)

Country	Link
JP (1)	JPH02155180A (2)

1989
- 1989-09-29 JP JP25400089A patent/JPH02155180A/ja active Granted

Also Published As

Publication number	Publication date
JPH02155180A (ja)	1990-06-14

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