JPH0436023Y2 - - Google Patents
Info
- Publication number
- JPH0436023Y2 JPH0436023Y2 JP1604386U JP1604386U JPH0436023Y2 JP H0436023 Y2 JPH0436023 Y2 JP H0436023Y2 JP 1604386 U JP1604386 U JP 1604386U JP 1604386 U JP1604386 U JP 1604386U JP H0436023 Y2 JPH0436023 Y2 JP H0436023Y2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- melting point
- point metal
- metal body
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000002844 melting Methods 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 230000008018 melting Effects 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 11
- 239000002470 thermal conductor Substances 0.000 claims description 11
- 239000004020 conductor Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Landscapes
- Fuses (AREA)
Description
【考案の詳細な説明】
＜産業上の利用分野＞
本考案は抵抗・温度ヒユーズ結合体の改良に関
するものである。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to an improvement of a resistance/temperature fuse combination.
＜先行技術と問題点＞
第４図は基板型の抵抗体付温度ヒユーズを示
し、絶縁基板１′上に層状抵抗体２′と層状低融点
金属体５′とを設けてある。その使用要領は層状
抵抗体２′を被保護回路本体に、低融点金属体
５′をリレー回路にそれぞれ接続し、被保護回路
に過電流が流れると、その過電流によつて層状抵
抗体２′を発熱させ、その発生熱で層状低融点金
属体５′を溶断させて、被保護回路への通電を遮
断することにある。<Prior Art and Problems> FIG. 4 shows a substrate-type temperature fuse with a resistor, in which a layered resistor 2' and a layered low-melting point metal body 5' are provided on an insulating substrate 1'. The method of use is to connect the layered resistor 2' to the circuit to be protected and the low melting point metal body 5' to the relay circuit, and when an overcurrent flows through the circuit to be protected, the overcurrent will cause the layered resistor to The purpose is to generate heat and melt the layered low-melting point metal body 5' with the generated heat, thereby cutting off the power supply to the circuit to be protected.
しかしながら、この抵抗体付温度ヒユーズにお
いては、抵抗体２′から低融点金属体５′への熱伝
達の指向角度が狭く、而して、熱伝達性が低く、
低融点金属体５′の溶断性、従つて、温度ヒユー
ズの作動性に問題がある。 However, in this temperature fuse with a resistor, the directivity angle of heat transfer from the resistor 2' to the low melting point metal body 5' is narrow, and the heat transfer performance is low.
There is a problem in the blowability of the low melting point metal body 5' and, therefore, in the operability of the temperature fuse.
＜考案の目的＞
本考案の目的は抵抗体の発生熱を低融点金属体
に効率よく伝達できる作動性に秀れた抵抗・温度
ヒユーズ結合体を提供することにある。<Purpose of the invention> The purpose of the invention is to provide a resistance/temperature fuse combination that has excellent operability and can efficiently transfer heat generated by a resistor to a low-melting point metal body.
＜考案の構成＞
本考案に係る抵抗・温度ヒユーズ結合体は、絶
縁基板上に抵抗体と低融点金属体を設け、該基板
上に上記抵抗体または低融点金属体の一方に対す
る枠状の熱良伝導体を設け、この枠状の熱良伝導
体を上記抵抗体または低融点金属体の他方に連結
したことを特徴とする構成である。<Structure of the invention> The resistance/temperature fuse combination according to the invention includes a resistor and a low-melting point metal body provided on an insulating substrate, and a frame-shaped heat shield for either the resistor or the low-melting point metal body on the substrate. This structure is characterized in that a good conductor is provided, and this frame-shaped good thermal conductor is connected to the other of the resistor or the low melting point metal body.
＜実施例の説明＞ 以下、図面により本考案を説明する。<Explanation of Examples> The present invention will be explained below with reference to the drawings.
第１図において、１は絶縁基板、例えばセラミ
ツクス板である。２は絶縁基板のほぼ中央に設け
た層状の抵抗体、３，３はリード用電極、４，４
はリード導体である。５は絶縁基板１上に設けた
層状の低融点金属体である。６，６は抵抗体２を
囲む枠状の熱良伝導体であり、この熱良伝導体に
は、上記リード用電極３と同材料の銅箔を用いる
ことができる。この熱良伝導体６，６と上記低融
点金属体５とは直列に連結してある。７，７はリ
ード導体である。８は絶縁基板上に設けた絶縁層
である。第１図において、抵抗体２が過電流の通
電により発熱すると、発生熱が実質上、抵抗体の
全周囲の方向において枠状の熱良伝導体６，６で
とらえられ、この熱が熱良伝導体６，６を熱伝導
路として低融点金属体５に伝達され、低融点金属
体５が溶断される。而して、抵抗体２の発生熱
を、ほぼ全周囲の角度範囲から伝達できるので、
その熱伝達効率は頗る良好である。 In FIG. 1, 1 is an insulating substrate, for example a ceramic plate. 2 is a layered resistor provided approximately in the center of the insulating substrate, 3, 3 is a lead electrode, 4, 4
is the lead conductor. 5 is a layered low melting point metal body provided on the insulating substrate 1. Reference numerals 6 and 6 denote a frame-shaped thermal conductor surrounding the resistor 2, and a copper foil made of the same material as the lead electrode 3 can be used for this thermal conductor. The thermal conductors 6, 6 and the low melting point metal body 5 are connected in series. 7, 7 are lead conductors. 8 is an insulating layer provided on the insulating substrate. In FIG. 1, when the resistor 2 generates heat due to overcurrent, the generated heat is substantially captured by the frame-shaped heat conductors 6, 6 in the direction of the entire periphery of the resistor, and this heat is transferred to the heat conductor 6. The heat is transmitted to the low melting point metal body 5 using the conductors 6, 6 as heat conduction paths, and the low melting point metal body 5 is fused. Therefore, the heat generated by the resistor 2 can be transmitted from almost the entire angular range, so
Its heat transfer efficiency is very good.
第２図は本考案の別実施例に係る抵抗体付温度
ヒユーズを示し、層状抵抗体２のリード電極（銅
箔）３，３上に絶縁膜９を介して層状の低融点金
属体５を設けてある。１は絶縁基板、４，４はリ
ード導体である。６，６は枠状の熱良伝導体であ
り、上記の低融点金属体５に直列に連結してあ
る。７，７はリード導体、８は絶縁層である。こ
の別実施例においては、抵抗体２の発生熱が枠状
の熱良伝導体６，６を経て低融点金属体５に伝達
されるだけではなく、リード電極３，３→絶縁膜
９の経路によつても伝達でき、その熱伝達効率を
上記実施例よりも一段と向上できる。 FIG. 2 shows a temperature fuse with a resistor according to another embodiment of the present invention, in which a layered low-melting point metal body 5 is placed on lead electrodes (copper foil) 3, 3 of a layered resistor 2 via an insulating film 9. It is provided. Reference numeral 1 is an insulating substrate, and reference numerals 4 and 4 are lead conductors. Reference numerals 6 and 6 designate frame-shaped heat conductors, which are connected in series to the low melting point metal body 5. 7, 7 is a lead conductor, and 8 is an insulating layer. In this other embodiment, the heat generated by the resistor 2 is not only transmitted to the low melting point metal body 5 through the frame-shaped heat conductors 6, 6, but also through the path from the lead electrodes 3, 3 to the insulating film 9. The heat transfer efficiency can be further improved compared to the above embodiment.
第３図は本考案の他の実施例に係る温度ヒユー
ズ付抵抗器を示し、第２図の実施例に較べて、抵
抗体２と低融点金属体５とを直列に接続してある
点が相異している。３６はその直列用のボンド用
電極部である。 FIG. 3 shows a resistor with a temperature fuse according to another embodiment of the present invention, which differs from the embodiment in FIG. 2 in that the resistor 2 and the low melting point metal body 5 are connected in series. They are different. 36 is a bonding electrode portion for the series.
この温度ヒユーズ付抵抗器の使用要領は、抵抗
体２を回路素子として使用し、その抵抗体回路素
子２が過電流により発熱すると、その発生熱で低
融点金属体５を加熱溶断させて、抵抗回路素子２
の通電を遮断することにあり、抵抗体回路素子２
の異常発熱から回路を良好に保護できる。 The method of using this resistor with a temperature fuse is that the resistor 2 is used as a circuit element, and when the resistor circuit element 2 generates heat due to overcurrent, the low melting point metal body 5 is heated and fused with the generated heat, and the resistor 2 is used as a circuit element. circuit element 2
The purpose is to cut off the current flow to the resistor circuit element 2.
The circuit can be well protected from abnormal heat generation.
上記、何れの実施例においても、抵抗体と低融
点金属体とを交互に逆とした構成にすることもで
きる。 In any of the above-mentioned embodiments, the resistor and the low-melting point metal body may be alternately reversed.
＜考案の効果＞
上述に係る抵抗・温度ヒユーズ結合体は、上述
した通りの構成であり、抵抗体（または低融点金
属体）の周囲に枠状の熱良伝導体を設け、この熱
良伝導体を低融点金属体（または抵抗体）に連結
してあり、抵抗体から全周囲に放射する熱を熱良
伝導体で受熱して低融点金属体に伝達できるから
（または、抵抗体の発生熱を熱良伝導体を介して
低融点金属体に全周囲から放射できるから）、熱
効率に優れ、低融点金属体を高感度で溶断作動さ
せ得る。<Effect of the invention> The above-described resistance/temperature fuse combination has the same configuration as described above, and a frame-shaped good thermal conductor is provided around the resistor (or low melting point metal body), and this good thermal conductor is provided. The body is connected to a low melting point metal body (or a resistor), and the heat radiated from the resistor all around can be received by a good thermal conductor and transferred to the low melting point metal body (or the heat generated by the resistor Heat can be radiated from all around the low-melting point metal body via a good thermal conductor), so it has excellent thermal efficiency and can fuse and cut the low-melting point metal body with high sensitivity.
第１図、第２図並びに第３図はそれぞれ本考案
の実施例を示す説明図、第４図は従来例を示す説
明図である。
図において、１は絶縁基板、２は抵抗体、５は
低融点金属体、６，６は枠状の熱良伝導体であ
る。
FIGS. 1, 2, and 3 are explanatory views showing embodiments of the present invention, and FIG. 4 is an explanatory view showing a conventional example. In the figure, 1 is an insulating substrate, 2 is a resistor, 5 is a low melting point metal body, and 6 is a frame-shaped thermal conductor.
Claims (1)
基板上に上記抵抗体、または低融点金属体の一方
に対する枠状の熱良伝導体を設け、この枠状の熱
良伝導体を上記低融点金属体、または抵抗体の他
方に連結したことを特徴とする抵抗・温度ヒユー
ズ連結体。 A resistor and a low melting point metal body are provided on an insulating substrate, a frame-shaped good thermal conductor for one of the resistor or the low melting point metal body is provided on the substrate, and this frame-shaped good thermal conductor is A resistance/temperature fuse connection body characterized in that it is connected to the other of a low melting point metal body or a resistor body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1604386U JPH0436023Y2 (en) | 1986-02-05 | 1986-02-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1604386U JPH0436023Y2 (en) | 1986-02-05 | 1986-02-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62127639U JPS62127639U (en) | 1987-08-13 |
| JPH0436023Y2 true JPH0436023Y2 (en) | 1992-08-26 |
Family
ID=30807541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1604386U Expired JPH0436023Y2 (en) | 1986-02-05 | 1986-02-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0436023Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0515126Y2 (en) * | 1988-02-19 | 1993-04-21 |
-
1986
- 1986-02-05 JP JP1604386U patent/JPH0436023Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62127639U (en) | 1987-08-13 |
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