JPH0723863Y2 - Thermal fuse - Google Patents
Thermal fuseInfo
- Publication number
- JPH0723863Y2 JPH0723863Y2 JP1779688U JP1779688U JPH0723863Y2 JP H0723863 Y2 JPH0723863 Y2 JP H0723863Y2 JP 1779688 U JP1779688 U JP 1779688U JP 1779688 U JP1779688 U JP 1779688U JP H0723863 Y2 JPH0723863 Y2 JP H0723863Y2
- Authority
- JP
- Japan
- Prior art keywords
- low
- melting point
- melting
- point metal
- metal body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000002844 melting Methods 0.000 claims description 58
- 230000008018 melting Effects 0.000 claims description 48
- 229910052751 metal Inorganic materials 0.000 claims description 48
- 239000002184 metal Substances 0.000 claims description 48
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000006023 eutectic alloy Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Landscapes
- Fuses (AREA)
Description
【考案の詳細な説明】 〈産業上の利用分野〉 本考案は合金型温度ヒューズの改良に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to improvement of an alloy type thermal fuse.
〈従来の技術〉 合金型温度ヒューズは、ヒューズエレメントに低融点金
属体を使用したものであり、保護すべき電気機器に接触
させて用い、当該電気機器が過電流のために異常に温度
上昇すると、温度ヒューズの低融点金属体がその温度上
昇下での受熱により溶融し、この溶融金属の球状化分断
により電気機器への通電が遮断される。<Prior Art> An alloy-type thermal fuse uses a low-melting-point metal body for a fuse element and is used by contacting it with an electrical device to be protected, and when the electrical device is abnormally heated due to overcurrent. The low-melting-point metal body of the thermal fuse is melted by receiving heat while the temperature rises, and the spheroidization of this molten metal cuts off the electric power supply to the electric equipment.
〈解決しようとする問題点〉 ところで、上記低融点金属の溶融分断時、電力の遮的に
伴う反作用としてアークの発生があり、このアークのた
めに溶融金属が飛散して、温度ヒューズを設置した電気
回路部分を酷く損傷させるといった問題がある。<Problems to be solved> By the way, at the time of melting and dividing the low melting point metal, an arc is generated as a reaction due to the interruption of electric power, and the molten metal scatters due to the arc, and a thermal fuse is installed. There is a problem that the electric circuit part is severely damaged.
かかる不合理を排除するために、電気機器の回路にコン
デンサー、抵抗等を挿入してアーク時の電圧または電流
を緩和し、アークエネルギーを軽減することが知られて
いるが、回路構成上不利である。In order to eliminate such unreasonableness, it is known to insert a capacitor, a resistor, etc. in the circuit of the electric device to reduce the voltage or current at the time of arc and reduce the arc energy, but it is disadvantageous in the circuit configuration. is there.
本考案の目的は、アークエネルギーを軽減する機能をそ
れ自体で備えた製造容易で、しかも作動性に秀れた温度
ヒューズを提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a thermal fuse which has a function of reducing arc energy by itself, is easy to manufacture, and has excellent operability.
〈問題点を解決するための技術的手段〉 本考案に係る温度ヒューズは、２個の低融点金属体にお
ける一方の低融点金属体の融点を他方の低融点金属体の
融点に等しいかやや低くし、これらの低融点金属体を直
列に接続し、上記一方の低融点金属体に並列に抵抗体を
接続し、抵抗体と上記一方の低融点金属体との間の距離
を抵抗体と他方の低融点金属体との間の距離よりも短か
くしたことを特徴とする構成である。<Technical Means for Solving Problems> In the thermal fuse according to the present invention, the melting point of one low melting metal body of two low melting metal bodies is equal to or slightly lower than the melting point of the other low melting metal body. Then, these low melting point metal bodies are connected in series, a resistor is connected in parallel to the one low melting point metal body, and the distance between the resistor and the one low melting point metal body is set to the resistance body and the other side. The distance between the low melting point metal body and the low melting point metal body is shorter than that of the low melting point metal body.
〈実施例の説明〉 以下、図面により本考案を説明する。<Description of Embodiments> The present invention will be described below with reference to the drawings.
第１図において、１は絶縁基板、例えばセラミックス板
である。2,・・・は絶縁基板上に設けた層状電極であ
り、導電性ペーストの塗布・焼付けにより形成できる。
3a,3bは低融点金属体（線状、箔状）であり互に直列に
接続してある。一方の低融点金属体3aの融点は他方の低
融点金属体3bの融点に等しいか、あるいは、３〜４℃低
くしてある。4a,4bは各低融点金属体3a,3b上に被覆した
フラックスである。５は上記一方の低融点金属体3aに並
列に接続した抵抗体であり、膜抵抗を使用できる。この
抵抗体５と上記一方の低融点金属体3aとの間の距離は、
抵抗体５と他方の低融点金属体3bとの間の距離よりも短
かくしてある。6,6はリード線、７は絶縁基板上に被覆
した樹脂絶縁層、例えば、常温硬化性のエポキシ樹脂モ
ールド層である。In FIG. 1, reference numeral 1 is an insulating substrate, for example, a ceramic plate. 2, ... are layered electrodes provided on an insulating substrate, which can be formed by applying and baking a conductive paste.
3a and 3b are low-melting metal bodies (linear or foil-shaped), which are connected in series with each other. The melting point of one low-melting metal body 3a is equal to or lower than the melting point of the other low-melting metal body 3b by 3 to 4 ° C. 4a and 4b are fluxes coated on the low melting point metal bodies 3a and 3b. Reference numeral 5 is a resistor connected in parallel to the one low melting point metal body 3a, and a film resistor can be used. The distance between the resistor 5 and the one low melting point metal body 3a is
It is made shorter than the distance between the resistor 5 and the other low melting point metal body 3b. Reference numerals 6 and 6 are lead wires, and 7 is a resin insulating layer coated on the insulating substrate, for example, an epoxy resin mold layer that is curable at room temperature.
第２図は本考案の別実施例を示している。Ａ、（Ｂ）は
温度ヒューズエレメントを示しており、リード線61a,62
a（61b,62b）間に低融点金属体3a,（3b）を接合し、融
点金属体上にフラックス4a,（4b）を被覆し、これらを
絶縁筒体（例えばセラミックス筒体）1a,（1b）で覆
い、筒体両端をシール剤（常温硬化性のエポキシ樹脂）
7a,（7b）でシールしてある。これらの温度ヒューズエ
レメントA,Bはリード線61a,61bにおいて相互に直列に接
続してあり、一方の低融点金属体3aの融点は他方の低融
点金属体3bの融点に等しいか、あるいは３〜４℃低くし
てある。５は上記一方の低融点金属体3aに並列に接続し
た巻線型抵抗であり、上記一方の温度ヒューズエレメン
トＡに並列配置で密接させてある。７は絶縁体、例えば
セメント注型体である。FIG. 2 shows another embodiment of the present invention. A and (B) show the thermal fuse elements, and the lead wires 61a, 62
Low melting point metal bodies 3a, (3b) are bonded between a (61b, 62b), fluxes 4a, (4b) are coated on the melting point metal bodies, and these are insulated cylindrical bodies (for example, ceramic cylindrical bodies) 1a, ( 1b) to cover both ends of the cylinder (epoxy resin that cures at room temperature)
Sealed with 7a, (7b). These thermal fuse elements A and B are connected in series with each other in lead wires 61a and 61b, and the melting point of one low-melting point metal body 3a is equal to the melting point of the other low-melting point metal body 3b, or 3 ~ 3. It was lowered by 4 ° C. Reference numeral 5 denotes a wire-wound resistor connected in parallel to the one low-melting-point metal body 3a, which is closely arranged in parallel with the one thermal fuse element A. Reference numeral 7 is an insulator, for example, a cement cast body.
上記において、融点の高い方の低融点金属体3bには低融
点共晶合金を使用でき、融点のやや低い方の低融点金属
体3aには、組成比を共晶点に対して低融点側にややづら
せた合金を使用できる。In the above, a low melting point eutectic alloy can be used for the low melting point metal body 3b having a higher melting point, and the composition ratio of the low melting point metal body 3a having a slightly lower melting point is lower than the eutectic point. A slightly hazy alloy can be used.
例えば、前者にはスズ:42重量部、鉛:1重量部、ビスマ
ス:57重量部、の共晶合金（合金融点135,0℃）を使用で
き、後者には前者に対して、鉛量を２〜３重量部（融点
132〜131℃）としたものを使用できる。For example, tin: 42 parts by weight, lead: 1 part by weight, bismuth: 57 parts by weight, a eutectic alloy (alloy melting point: 135,0 ° C) can be used. 2-3 parts by weight (melting point
It can be used at 132 to 131 ° C).
上記温度ヒューズの作動温度は融点の高い方の低融点金
属体3bの融点Tbによって定まる。Operating temperature of the thermal fuse is determined by the melting point T b of the low melting metal member 3b having a higher melting point.
抵抗体５の抵抗値は一方の抵抗融点金属体3aの抵抗値よ
りも一段と高抵抗であり、常時においては、電流は低融
点金属体3a,3bの直列通路を流れる。The resistance value of the resistor 5 is much higher than the resistance value of one of the resistance melting point metal bodies 3a, and the current always flows through the series passage of the low melting point metal bodies 3a and 3b.
而して、周囲温度が上記融点Tbに近づくと、温度Tbの直
前温度において低融点金属体3aが溶断する。この直前溶
断は、低融点金属体3aの融点が低融点金属体3bの融点よ
りも低いこと、または、低融点金属体3aを抵抗体５に近
接させてあり、当該低融点金属体3aの加熱が抵抗体５の
発生熱によって助成されることから、確実に遂行され
る。従って、温度がTbになって低融点金属体3bが溶断す
る際には、抵抗体５が低融点金属体3bに対して直列に連
結されており、その抵抗体５のために回路電流を充分に
小さくでき、かかる低電流下のもとで低融点金属3bの溶
断による通電遮断がなされるので、発生するアークのエ
ネルギーを充分に弱小化できる。And Thus, the ambient temperature approaches the melting point T b, the low-melting metal member 3a is blown immediately before the temperature of the temperature T b. Immediately before this melting, the melting point of the low-melting metal body 3a is lower than the melting point of the low-melting metal body 3b, or the low-melting metal body 3a is brought close to the resistor 5, and the low-melting metal body 3a is heated. Is supported by the heat generated by the resistor 5, so that it is reliably performed. Therefore, when the temperature becomes T b and the low melting point metal body 3b is blown, the resistor 5 is connected in series to the low melting point metal body 3b, and the circuit current is transferred due to the resistor 5. It can be made sufficiently small, and the energization is cut off by melting the low melting point metal 3b under such a low current, so that the energy of the generated arc can be sufficiently weakened.
〈考案の効果〉 上述した通り本考案に係る温度ヒューズにおいては、低
融点金属の溶断時に発生するアークのエネルギーを弱小
にできるので、溶断時の飛散障害をよく軽減できる。<Effect of the Invention> As described above, in the thermal fuse according to the present invention, the energy of the arc generated when the low melting point metal is melted can be weakened, so that the scattering obstacle at the time of melting can be well reduced.
第１図並びに第２図はそれぞれ本考案の実施例を示す説
明図である。 図において、3a,3bは低融点金属体、５は抵抗体であ
る。1 and 2 are explanatory views showing an embodiment of the present invention. In the figure, 3a and 3b are low melting point metal bodies, and 5 is a resistor.
Claims (1)
金属体の融点を他方の低融点金属体の融点に等しいかや
や低くし，これらの低融点金属体を直列に接続し，上記
一方の低融点金属体に並列に抵抗体を接続し，抵抗体と
上記一方の低融点金属体との間の距離を抵抗体と他方の
低融点金属体との間の距離よりも短くしたことを特徴と
する温度ヒューズ。1. The melting point of one low-melting-point metal body of the two low-melting-point metal bodies is made equal to or slightly lower than the melting point of the other low-melting-point metal body, and these low-melting-point metal bodies are connected in series. A resistor is connected in parallel to one low-melting-point metal body, and the distance between the resistor and the one low-melting-point metal is shorter than the distance between the resistor and the other low-melting-point metal. Thermal fuse characterized by.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1779688U JPH0723863Y2 (en) | 1988-02-12 | 1988-02-12 | Thermal fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1779688U JPH0723863Y2 (en) | 1988-02-12 | 1988-02-12 | Thermal fuse |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01122240U JPH01122240U (en) | 1989-08-18 |
| JPH0723863Y2 true JPH0723863Y2 (en) | 1995-05-31 |
Family
ID=31231892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1779688U Expired - Lifetime JPH0723863Y2 (en) | 1988-02-12 | 1988-02-12 | Thermal fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0723863Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010123277A3 (en) * | 2009-04-21 | 2011-01-27 | Smart Electronics Inc. | Thermal fuse resistor, manufacturing method thereof, and installation method thereof |
| WO2010123276A3 (en) * | 2009-04-21 | 2011-02-03 | Smart Electronics Inc. | Thermal fuse resistor |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008311161A (en) * | 2007-06-18 | 2008-12-25 | Sony Chemical & Information Device Corp | Protective element |
| JP4663760B2 (en) * | 2007-08-20 | 2011-04-06 | 内橋エステック株式会社 | Secondary battery protection circuit |
| JP2010165685A (en) * | 2010-03-04 | 2010-07-29 | Sony Chemical & Information Device Corp | Protection element, and battery pack |
| JP5590966B2 (en) * | 2010-05-28 | 2014-09-17 | 京セラ株式会社 | Fuse device and circuit board |
| JP2014044955A (en) * | 2013-10-01 | 2014-03-13 | Dexerials Corp | Protection element, and battery pack |
-
1988
- 1988-02-12 JP JP1779688U patent/JPH0723863Y2/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010123277A3 (en) * | 2009-04-21 | 2011-01-27 | Smart Electronics Inc. | Thermal fuse resistor, manufacturing method thereof, and installation method thereof |
| WO2010123276A3 (en) * | 2009-04-21 | 2011-02-03 | Smart Electronics Inc. | Thermal fuse resistor |
| US8400252B2 (en) | 2009-04-21 | 2013-03-19 | Smart Electronics Inc. | Thermal fuse resistor |
| US8400253B2 (en) | 2009-04-21 | 2013-03-19 | Smart Electronics Inc. | Thermal fuse resistor, manufacturing method thereof, and installation method thereof |
| DE112010001694B4 (en) * | 2009-04-21 | 2013-08-01 | Smart Electronics, Inc. | fusible resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01122240U (en) | 1989-08-18 |
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