JPH0436122Y2 - - Google Patents

Description

[Detailed Description of the Invention] (a) Field of Industrial Application The present invention relates to a hybrid integrated circuit, and particularly to improvements in the frame of a hybrid integrated circuit.

(b) Conventional technology As shown in FIG. 3, a conventional hybrid integrated circuit consists of two hybrid integrated circuit boards 1 on which circuit elements 16 are provided.
1, 12, a frame 15 for fixing the hybrid integrated circuit boards 11, 12 apart, and a frame 15 and the board 11,
12 and a resin layer 14 filled in the space formed by the periphery of the resin layer 12. Hybrid integrated circuit board 1
Reference numerals 1 and 12 use metal substrates such as aluminum, the surfaces of which are insulated, desired conductive paths are formed, and circuit elements 16 such as passive elements and active elements are provided. The frame 15 fixes the two boards 11 and 12 apart from each other, and the frame 15 has a structure that controls the positions of the boards 11 and 12 when the boards 11 and 12 are inserted into the frame 15. A board stopper is provided for carrying out the external lead 13, and a longitudinal side body portion of the frame 15 is provided with a board stopper for leading out the external lead 13.
It is formed by recessing it further inward. The hybrid integrated circuit boards 11 and 12 are inserted above and below the frame 15, and a resin such as epoxy is injected into the space formed by the side bodies of the frame 15 and the boards 11 and 12 to form the resin layer 14. This is provided to reinforce the external lead 13.

A technique similar to that described above is described in Japanese Patent Publication No. 35817/1983.

(c) Problems to be solved by the invention However, in the conventional frame body 15 for fixing the hybrid integrated circuit at a distance, the space formed by the side body of the frame body 15 and the periphery of the hybrid integrated circuit boards 11 and 12 is A resin layer 14 is formed by injecting resin and external leads 13 are formed.
However, due to the expansion and contraction of the resin injected into the resin layer 14, the connecting portions of the external leads 13 may peel off.

(d) Means for solving the problems The present invention has been made in view of the above-mentioned points, and as shown in FIGS. The two hybrid integrated circuit boards 1 and 2 are separated so that the external leads 3 lead out from at least one periphery of the two hybrid integrated circuit boards 1 and 2 face each other. The exterior of a hybrid integrated circuit is provided with a frame 4 to be fixed to the outside of the hybrid integrated circuit, and a resin layer 6 injected into the space formed by the frame 4 and the periphery of the two hybrid integrated circuit boards 1 and 2. This problem is solved by forming a partition plate 5 in the space where the leads 3 exist and approximately at the center of the two hybrid integrated circuit boards 1 and 2 to divide the resin layer 6 into two.

(e) Effect As described above, by providing a partition plate approximately parallel to the hybrid integrated circuit board in the space where the external leads exist, the resin layer can be divided into two, so that the expansion and contraction effect of the resin can be reduced. It is something.
Furthermore, the amount of resin injected into the resin layer can be reduced.

(f) Examples The present invention will be described in detail below based on the examples shown in FIGS. 1 and 2. As shown in FIG. 1, the hybrid integrated circuit according to the present invention has two hybrid integrated circuit boards 1 and 2, an external lead 3 led out from one periphery of the boards 1 and 2, and the boards 1 and 2 separated from each other. A frame body 4 to be fixed, a partition plate 5 provided on the frame body 4,
It is composed of a resin layer 6 provided in a space between a frame 4 and the periphery of the substrates 1 and 2. The hybrid integrated circuit boards 1 and 2 are made of aluminum substrates with excellent thermal conductivity, and their surfaces are insulated to form desired conductive paths to connect transistors, power transistors, chip resistors, and chip capacitors. External leads 3 are fixed to the circumferential edges of the substrates 1 and 2 on which circuit elements 7 such as the above are fixed and conductive paths are extended. These two hybrid integrated circuit boards 1 and 2 are inserted into the frame 4 and fixed. As shown in FIG. 2, the frame 4 is provided with a board stopper 8 for regulating the position of the boards 1 and 2, a side body part 9 for guiding the external leads 3 to the outside, and a partition plate 5. The feature of the present invention lies in this partition plate 5. Partition plate 5 is external lead 3
The substrates 1, 2 are placed approximately in the center of the substrates 1, 2 in the space formed by the frame 4 in which the substrates 1, 2 are arranged, and around the substrates 1, 2.
formed in parallel with. That is, the partition plate 5 is connected to the side body portion 9
Formed so that it protrudes from the Even if the resin layer 6 is formed by inserting two hybrid integrated circuit boards 1 and 2 into the upper and lower parts of the frame body 4 and injecting a resin such as epoxy resin into the space where the external leads 3 are provided, the present invention will still work. Partition plate 5
divided into two by

As described above, by providing the partition plate 5 on the frame body 4, that is, the side body part 9, the resin layer 6 is divided into two parts,
The elastic force of the resin can be halved, and it is possible to prevent the connecting portion of the external lead 3 from peeling off due to the elastic force of the resin.

(g) Effects of the invention As mentioned above, by providing a partition plate on the frame, the resin layer can be divided into two, the elastic force of the resin is halved, and the peeling of the external leads, which has been a problem in the past, is prevented. I can do it. It also has the advantage of reducing the amount of resin.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a plan view of the frame of this embodiment, and FIG. 3 is a sectional view showing a conventional example. 1, 2... Hybrid integrated circuit board, 3... External lead, 4... Frame, 5... Partition plate, 6... Resin layer,
7... Circuit element, 8... Board stopper, 9...
Lateral body part.

Claims (1)

[Scope of utility model registration request] two hybrid integrated circuit boards to which circuit elements are fixed; external leads led out from at least one periphery of the two hybrid integrated circuit boards; and two hybrid integrated circuit boards with the external leads facing each other. A hybrid integrated circuit comprising a frame for fixing the substrates apart from each other, and a resin layer injected into a space formed by the frame and the periphery of the two hybrid integrated circuit boards, A hybrid integrated circuit characterized in that a partition plate extending from the frame is formed in the space where the external leads exist and approximately at the center of the two hybrid integrated circuit boards to divide the resin layer into two. circuit.