JPH04367243A - Semiconductor wafer - Google Patents

Abstract

PURPOSE:To bring a probe needle into contact with a wafer only once, to enhance the accuracy of a needle-putting position and to lower the cost of a prober. CONSTITUTION:Test pads 4, 5, arbitrary chips 2 and a multiplexer 3 which is user to change over the test pads are formed in regions other than chip formation regions on a semiconductor wafer 1. As a result, it is sufficient to put a needle once and in one place, the accuracy of its position is enhanced and a low-cost prober can be used.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to semiconductor wafers, and particularly to a probing system that can achieve lower costs and higher precision.

0002

2. Description of the Related Art FIG. 3 is a diagram showing a conventional semiconductor wafer, and FIG. 4 is a plan view showing the direction in which a fixed probe 4 moves over the wafer. In the figure, 1 is a wafer, 2 is a chip, and 4 is a wafer.
0 is a test pad provided for each chip, 6 is a fixed probe, and 70 is a meter reading.

Next, the operation will be explained. In FIG. 4, a plurality of chips 2 are built on a wafer 1,
Test the electrical characteristics of each chip before cutting it out. This test is performed by bringing the fixed probe 6 into contact with the meter reading 7 and the test pad 40 in order in the direction of the arrow shown in the figure.

0004

[Problems to be Solved by the Invention] Conventional semiconductor wafers are constructed as described above, so it is necessary to move the position of the fixed probe and wafer using a prober for each chip. required and therefore required the use of expensive probers.

The present invention was made in order to solve the above-mentioned problems, and it provides a semiconductor wafer that can be easily touched with a needle and therefore allows a wafer test to be performed using a low-cost prober. The purpose is to provide.

[0006]

SUMMARY OF THE INVENTION In a semiconductor wafer according to the present invention, test pads for all chips are assembled in one place, and the test pads are connected to each chip via a multiplexer.

[0007]

[Operation] In this invention, the test pads for all the chips are in one place, and each chip can be switched by a multiplexer, so the needle application is easy and can be performed only once.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows a semiconductor wafer according to an embodiment of the present invention. In the figure, 1 is a wafer, 2 is a chip, 3 is a multiplexer for switching each chip, 4 is a test pad for sending signals to each chip, 5 is a test pad for switching multiplexer 3, 9 is a multiplexer 3 This is the wiring that connects the chips 2.

Note that in this embodiment, the test pads conventionally provided for each chip are omitted. In addition, the multiplexer 3 and the wiring 9 are transferred onto the main wafer at the same time as forming the chip or on another occasion.
Destroyed during dicing after testing.

FIG. 2 shows the relationship between a wafer and a fixed probe according to an embodiment of the present invention. In the figure, 6 is a fixed probe, 7 is a meter reader for sending signals to each chip,
8 is a meter reading for switching the multiplexer 3.

Next, the operation will be explained. During measurement, the probes 7 and 8 come into contact with the test pads 4 and 5 provided on the wafer 1, respectively. The switching signal from the test device is needle 8.
, and enters the multiplexer 3 via the test pad 5, and selects the chip 2 from the chip 2. Next, a test signal from the test device enters the chip (2) via the needle 7 and the test pad 4, and the chip (2) is tested. After the test of chip (2) is completed, chip (2) is selected by the multiplexer switching signal of the test pad 5 and tested. Thereafter, the test is repeated in the same manner up to chip (2) using the multiplexer switching signal of test pad 5.

As described above, according to the above embodiment, since the test pads are arranged in one place other than the chip forming area and the chip to be tested is switched by the multiplexer, the needle placement is easy. Even with an inexpensive prober with low positional accuracy, high needle-placement position accuracy can be obtained, and the effect is that the needle-placement only needs to be done once.

[0013]

As described above, according to the semiconductor wafer of the present invention, the test pads are arranged in one place other than the chip area, and the chip to be tested is switched by the multiplexer, which makes it possible to use an inexpensive prober. This has the effect of obtaining high needle placement position accuracy.

[Brief explanation of drawings]

FIG. 1 is a plan view showing a semiconductor wafer according to an embodiment of the present invention.

FIG. 2 is a perspective view of a semiconductor wafer and a fixed probe according to an embodiment of the present invention.

FIG. 3 is a plan view showing a conventional wafer.

FIG. 4 is a perspective view of a conventional wafer and fixed probe.

[Explanation of symbols] 1 Wafer 2 Chip 3 Multiplexer 4 Test pad for test signal 5 Test pad for chip selection 6 Fixed probe 7 Test signal meter reading 8 Meter reading for chip selection 9 Wiring

Claims (3)

[Claims] 1. In a semiconductor wafer, a test pad shared by each chip to input a test signal to the chips formed on the wafer, and a test pad for selectively transmitting the test signal from the test pad to each chip. A multiplexer is provided in a region other than the chip forming region. 2. The semiconductor wafer according to claim 1, wherein the test pad transmits a chip selection signal for driving the multiplexer in addition to the test signal. 3. The semiconductor wafer according to claim 1, wherein wiring connecting the multiplexer and each chip is formed in a region other than the chip forming region.