JPH04367251A - High-frequency hybrid integrated circuit device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency hybrid integrated circuit device, and more particularly to a high frequency hybrid integrated circuit device that can be soldered to an external circuit board in the same process as other components.

0002

2. Description of the Related Art FIG. 4 is a diagram showing the assembly of a conventional high frequency hybrid integrated circuit device having a substrate and a cap to which a heat sink and leads are attached, and FIG. 5 is a diagram showing a plan view of the conventional high frequency hybrid integrated circuit device after assembly. FIG. 6 is a plan view of a case in which a positional shift occurs in the attachment of a substrate or a cap during assembly of a conventional high-frequency hybrid integrated circuit device, and FIG. 7 shows a state of mounting of a conventional high-frequency hybrid integrated circuit device. In the figure, 1 is a radiation fin made of a good thermal conductor;
1a is a notch for fixing the radiation fin 1 by screwing or the like; 2 is a hybrid integrated circuit board that constitutes a circuit section of a high-frequency hybrid integrated circuit device; and 3 is a connection from the board 2 to an external circuit (not shown). 4 is a cap; 5 is a chassis to which a high frequency hybrid integrated circuit device is attached;
Reference numeral a designates a screw hole for fixing a screw or the like that passes through the cutout portion 1a of the radiation fin 1, 6 designates an external circuit board, and 6a designates a lead hole.

Next, the operation at the time of implementation will be explained. The conventional high frequency hybrid integrated circuit device operates by connecting the circuit of the hybrid integrated circuit board 2 and the external circuit board 6 by passing the leads 3 through the lead holes 6a provided in the external circuit board 6 and soldering them. Furthermore, the heat radiation fin 1 is fixed to the chassis 5 using screws or the like through the notch portion 1a and the screw hole 5a. The heat generated by the high frequency hybrid integrated circuit device during operation is radiated from the heat radiation fins 1 to the chassis 5.

0004

[Problems to be Solved by the Invention] Since the conventional high frequency hybrid integrated circuit device is constructed as described above, as shown in FIG. If the dimensional accuracy of the cap 4 is poor or the dimensional accuracy of the cap 4 is poor, the dimensional accuracy between the center line of the notch 1a and the cap end on the side where the leads 3 are protruding will be poor. After soldering components (not shown) other than the hybrid integrated circuit device, the leads 3 are passed through the lead holes 6a, the notches 1a are screwed into the screw holes 5a, and the leads 3 are soldered to the external circuit board 6. Therefore, there was a problem in that the soldering process was required twice.

[0005] This invention was made to solve the above problems, and even if the cap is misaligned or the dimensional accuracy of the cap is poor, it can be soldered together with other parts in one step. The purpose is to obtain a high frequency hybrid integrated circuit device that can be soldered to an external circuit board during the process.

[0006]

[Means for Solving the Problems] A high-frequency hybrid integrated circuit device according to the present invention includes an integrated circuit board having protruding leads for connection to an external circuit, and is attached to a chassis in contact with the integrated circuit board. In the high-frequency hybrid integrated circuit device, the heat dissipation fin has a heat dissipation fin having a notch and a cap that covers the integrated circuit board, and the heat dissipation fin is provided with a plurality of positioning protrusions that protrude from the lead side edge of the heat dissipation fin in the lead protrusion direction. , the dimension from the tip of the positioning protrusion to the center of the mounting notch is equal to the distance between the surface of the external circuit board provided on the chassis and the center of the mounting screw hole provided on the chassis. It is something that

[0007]

[Operation] The high frequency hybrid integrated circuit device in this invention has the following features:
It consists of a heat dissipation fin with a notch for attachment, a board to which leads are attached for connection to an external circuit, and a cap. Two or more positioning protrusions are provided in the lead extraction direction of the heat dissipation fin, and the positioning protrusions are The dimension from the edge to the center of the notch was made equal to the distance from the surface of the external circuit board provided on the chassis to the center of the mounting screw hole on the chassis. Even if the dimensional accuracy of
It can be soldered to an external circuit board along with other components in a single soldering process.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows a high frequency hybrid integrated circuit device according to an embodiment of the present invention, and is a diagram showing the assembly of the high frequency hybrid integrated circuit device consisting of a hybrid integrated circuit board 2 to which leads 3 are attached, a radiation fin 1, and a cap 4. FIG. 2 is a plan view after assembly of a high frequency hybrid integrated circuit device according to an embodiment of the present invention, and FIG. 3 is a plan view when a positional shift occurs when attaching the cap 4. The same reference numerals as those in FIG. 7 indicate the same or corresponding parts, and 1b is a positioning projection provided on the radiation fin 1, which is provided to protrude from the radiation fin 1 in the direction in which the leads 3 protrude.

Regarding the operation during mounting, it is the same as the conventional one in that it operates by being connected to an external circuit by the lead 3, but the positioning protrusion 1b protruding from the heat dissipation fin 1 provided in the lead extraction direction is located inside the chassis 5. It is in contact with the external circuit board 6, and the dimension from the end of the protrusion 1b to the center of the notch 1a is the mounting surface of the high frequency hybrid integrated circuit device.
In other words, since it is made equal to the height from the surface of the external circuit board 6 to the center of the screw hole 5a, that dimension becomes the accuracy of the radiation fin 1 alone, which may cause positional deviation when attaching the cap 4, or the dimensional accuracy of the cap 4. Even if the high frequency hybrid integrated circuit device itself is bad, it is possible to solder the leads 3 to the external circuit board 6 together with other parts (not shown) and then screw them together.

In this embodiment, as described above, the heat dissipation fin 1 has a notch 1a for attachment, the hybrid integrated circuit board 2 has the lead 3 attached thereto for connection to an external circuit, and the cap 4. The positioning protrusions 1b are provided at two locations in the direction in which the leads 3 of the heat dissipation fin 1 protrude.
The dimension from the end of the cutout 1a to the center of the notch 1a is made equal to the distance from the mounting surface of the high frequency hybrid integrated circuit device, that is, the surface of the external circuit board 6 in the chassis 5 to the center of the screw hole 5a of the chassis 5. , its dimensions are radiation fin 1
Even in the case of a high frequency hybrid integrated circuit device in which the accuracy of the single unit is insufficient and positional deviation occurs when attaching the cap 4, or the dimensional accuracy of the cap 4 itself is poor, it is necessary to pass the lead 3 through the lead hole 6a of the external circuit board 6 and then attach it together with other parts (not shown). After soldering, the notch portion 1a can be screwed into the screw hole 5a, and the soldering process can be performed in one step.

In the above embodiment, the positioning protrusions 1b are provided at two locations beside the notch 1a of the heat dissipation fin 1, facing in the direction in which the leads 3 protrude. Any position may be used as long as it is in the protruding direction, and the number of positions may be two or more, and the same effect can be achieved in that case as well.

0012

As described above, according to the present invention, the heat dissipation fin includes a heat dissipation fin having a notch for attachment, a board to which a lead for connection with an external circuit is attached, and a cap. Two or more positioning protrusions are provided in the direction of the protrusion, and the dimension from the end of the positioning protrusion to the center of the notch is equal to the distance from the mounting surface of the high frequency hybrid integrated circuit device to the center of the screw hole. This has the effect of providing a high frequency hybrid integrated circuit device that can be screwed together with other parts of the external circuit board after being soldered to the external circuit board in one step.

[Brief explanation of drawings]

FIG. 1 is a diagram showing the assembly of a high frequency hybrid integrated circuit device according to an embodiment of the present invention.

FIG. 2 is a plan view of a high frequency hybrid integrated circuit device according to an embodiment of the present invention.

FIG. 3 is a plan view of a high frequency hybrid integrated circuit device according to an embodiment of the present invention in which a cap is misaligned;

FIG. 4 is a diagram showing the assembly of a conventional high frequency hybrid integrated circuit device.

FIG. 5 is a plan view of a conventional high frequency hybrid integrated circuit device.

FIG. 6 is a plan view of a conventional high-frequency hybrid integrated circuit device in which a cap is misaligned.

FIG. 7 is a diagram showing how a conventional high frequency hybrid integrated circuit device is mounted.

[Explanation of symbols]

1 Heat radiation fin 1a Notch part 1b Positioning protrusion 2 Hybrid integrated circuit board 3 Lead 4 Cap 5 Chassis 5a Screw hole 6 External circuit board 6a Lead hole

Claims (1)

[Claims] 1. An integrated circuit board having protruding leads for connection to an external circuit, a heat dissipation fin attached to a chassis in contact with the integrated circuit board and having a mounting notch, and covering the integrated circuit board. In the high frequency hybrid integrated circuit device having a cap, the radiation fin is provided with a plurality of positioning protrusions that protrude from the lead side edge thereof in the lead protruding direction, and from the tip of the positioning protrusion to the center of the mounting notch. A high frequency hybrid integrated circuit device, wherein the dimensions of are equal to the distance between the surface of an external circuit board provided on the chassis and the center of a mounting screw hole provided on the chassis.