JPH0437145A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To realize simplified manufacture without giving any damage on a resin film or to a chip in the discrimination pattern forming process by forming an insulating organic resin film to a chip mounting position of a tape carrier, forming a discrimination pattern at the surface thereof and softening an organic resin film by the heat treatment in the assembling process causing the resin film to be closely adhered to the chip. CONSTITUTION:In a semiconductor device assembled by the TAB system, an insulating organic resin film 11 is formed on a chip mounting position 10 of a tape carrier 3, a discrimination pattern 12 is formed on the surface thereof and the organic resin film 11 is softened by the heat treatment in the assembling process to cause the film to be closely adhered to a chip 6. For example, a copper foil 4 is attached to the carrier tape 3 forming window holes 2 and a lead 5 is formed by the etching to the part of window hole 2. Next, an insulating organic resin film 11 is arranged at the chip mounting position 10, it is attached to the end part of lead 5 by the thermal pressurizing method and a discrimination pattern 12 is formed on the surface thereof. Next, a chip 6 is bonded to the lead 5 by the heat treatment through a solder bump 7. With the heat generated at this time, the insulating organic resin film 11 is softened and closely adhered to the chip 6.

Description

[Detailed Description of the Invention] [Summary] Concerning a method for manufacturing a semiconductor device, tape automated bonding is used for the purpose of simplifying manufacturing and preventing damage to the resin film or chip during the identification pattern forming process. In semiconductor devices that are assembled using this method, an insulating organic resin film is formed at the chip mounting position of the tape carrier, an identification pattern is formed on its surface, and the organic resin film is softened by heat treatment during the assembly process. It is configured to be in close contact with the chip.

[Industrial application field]

The present invention relates to a method for manufacturing a semiconductor device.

In order to use the semiconductor device, it is necessary to display an identification symbol in an easily visible position to indicate what kind of integrated circuit it is. The present invention relates to a method for manufacturing a semiconductor device with an identification symbol assembled by a tape automated bonding method (hereinafter referred to as the TAB method).

[Conventional technology]

FIG. 2 is a diagram showing a method of manufacturing a semiconductor device with an identification symbol assembled by the conventional tape automated method.

In this method, first, as shown in Fig. (b), a copper foil 4 is pasted onto a carrier tape 3 made of polyimide having sprocket holes 1 and window holes 2, as shown in Fig. (b). The copper foil 4 is etched to form a lead 5 in the window hole as shown in figure (C), and a chip 6 is attached to the lead 5 as shown in figure (d). After connecting lead 5 to A-A wire $ and B-B
After cutting from the wire, an insulating organic resin 8 is coated on the chip 6 shown in FIG. 6(e) and cured, and then an identification pattern 9 is formed in a concave shape on the surface using a laser or the like.

[Problem to be solved by the invention]

In the above-mentioned conventional method for manufacturing a semiconductor device, two steps are required: (1) after assembly is completed using the TAB method, a resin application step and an identification pattern generation step. (2) Due to variations in resin film thickness, material, etc., damage to the resin, damage to the chip, etc. may occur in the subsequent identification pattern forming process. There were other problems.

SUMMARY OF THE INVENTION In view of the above conventional problems, it is an object of the present invention to provide a method for manufacturing a semiconductor device that is easy to manufacture and does not damage a resin film or a chip in the process of forming an identification pattern.

[Means for solving problems]

In order to achieve the above object, in the semiconductor device manufacturing method of the present invention, in a semiconductor device assembled by the TAB method,
An insulating organic resin film 11 is formed at the chip mounting position of the tape carrier 3, and an identification pattern 12 is formed on its surface.The organic resin film 11 is softened by heat treatment in the assembly process and adheres to the chip 6. It is characterized by causing

[For production]

By forming the insulating resin film 11 on the tape carrier 3 and forming the identification pattern 12 thereon, laser irradiation is not required to form the identification pattern after the chip 6 is mounted on the tape carrier 3. Therefore, insulation +11
: No scratches are caused to the resin film 11 or the chip 6.

〔Example〕

FIG. 1 is a diagram for explaining the present invention in detail.

In this embodiment, first, as shown in Figure (a), a window hole 2 is formed in a carrier tape (polyimide tape) 3 having a sprocket hole 1. Next, a copper foil 4 is attached to the carrier tape 3 as shown in FIG. Next, as shown in Figure (C), leads 5 are formed in the window holes 2 by etching. Next, an insulating organic resin film 11 made of polyimide, epoxy, etc. is placed at the chip mounting position indicated by the dotted line 10 as shown in FIG. It is attached to the tip by thermocompression bonding or the like, and an identification pattern 12 is formed on its surface. Furthermore, this identification pattern 12
Screen printing with heat-resistant ink is preferred. Then (f
) As shown in the figure, the chip 6 is bonded to the leads 5 through the solder bumps 7 formed on the chip by heat treatment. Due to the heating at this time, the insulating organic resin film 1
1 softens and adheres closely to the chip 6. After this, lead 5
is completed by cutting it from the A-A line and the B-B line.

〔effect〕

As described above, according to the present invention, when manufacturing a semiconductor device using the TAB method, an insulating organic resin film is provided on a tape carrier before a chip is mounted, and an identification pattern is formed on the resin film in advance. As a result, no damage is caused to the chip when forming the identification pattern, and there is no fear of damage to the resin film and the chip when forming the identification pattern using a conventional laser or the like. In addition, formation of identification patterns becomes simple and easy.

4, 'fl! BRIEF DESCRIPTION OF THE J-SIDE FIG. 1 is a diagram for explaining the present invention in detail, and FIG. 2 is a diagram showing a conventional manufacturing method of a semiconductor device with an identification symbol.

In the figure, 1 is the sprocket hole, 2 is a window hole, 3 is carrier tape, 4 is copper foil, 5 is lead, 6 is a chip, 7 is solder bump, 10 is the chip mounting position; 11 is an insulating organic resin film; 12 is the identification pattern shows.

Claims (1)

[Claims] 1. In a semiconductor device assembled using a tape automated bonding method, an insulating organic resin film (11) is formed at the chip mounting position of the tape carrier (3), and an identification pattern is formed on the surface of the insulating organic resin film (11). (
12) is formed in advance, and the organic resin film (11) is softened by heat treatment in the assembly process and brought into close contact with the chip (6).