JPH0437259U - - Google Patents
Info
- Publication number
- JPH0437259U JPH0437259U JP8046790U JP8046790U JPH0437259U JP H0437259 U JPH0437259 U JP H0437259U JP 8046790 U JP8046790 U JP 8046790U JP 8046790 U JP8046790 U JP 8046790U JP H0437259 U JPH0437259 U JP H0437259U
- Authority
- JP
- Japan
- Prior art keywords
- target material
- sputtering
- cleaning
- block diagram
- gas inlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004544 sputter deposition Methods 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 3
- 239000013077 target material Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
Landscapes
- Physical Vapour Deposition (AREA)
Description
第１図は本考案にかかる一実施例のスパツタ装
置の構成図、第２図は本考案にかかる他の実施例
のスパツタ装置の構成図、第３図は従来のスパツ
タ装置の構成図である。
Ｓ……スパツタ室、Ｃ……クリーニング室、１
，１６……真空ポンプ、２，８，１７，１８……
ゲートバルブ、３……スパツタ用ガス導入口、５
……カソード、６……ターゲツト材料、７ａ……
被スパツタ物質試料台、７ｂ……被スパツタ物質
、９……導波管、１０……高周波電源、１２……
エツチング用ガス導入口、１３……電極、１４…
…プラズマ発生室、１５……クリーニング用ガス
導入口、１６……真空ポンプ、１７……ゲートバ
ルブ、１８……ゲートバルブ。
Fig. 1 is a block diagram of a sputtering device according to an embodiment of the present invention, Fig. 2 is a block diagram of a sputtering machine according to another embodiment of the present invention, and Fig. 3 is a block diagram of a conventional sputtering machine. . S... Spattle room, C... Cleaning room, 1
, 16... Vacuum pump, 2, 8, 17, 18...
Gate valve, 3...Gas inlet for sputter, 5
...Cathode, 6...Target material, 7a...
Sample stand for material to be sputtered, 7b... Material to be sputtered, 9... Waveguide, 10... High frequency power supply, 12...
Etching gas inlet, 13...electrode, 14...
...Plasma generation chamber, 15...Cleaning gas inlet, 16...Vacuum pump, 17...Gate valve, 18...Gate valve.
Claims (1)
グにより成膜するスパツタ装置において、 ターゲツト材料表面をクリーニングする反応性
エツチング機構を有することを特徴としたスパツ
タ装置。[Claims for Utility Model Registration] A sputtering device for forming a film of a target material by sputtering using electric discharge, characterized by having a reactive etching mechanism for cleaning the surface of the target material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8046790U JPH0437259U (en) | 1990-07-26 | 1990-07-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8046790U JPH0437259U (en) | 1990-07-26 | 1990-07-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0437259U true JPH0437259U (en) | 1992-03-30 |
Family
ID=31625556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8046790U Pending JPH0437259U (en) | 1990-07-26 | 1990-07-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0437259U (en) |
-
1990
- 1990-07-26 JP JP8046790U patent/JPH0437259U/ja active Pending
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