JPH0437939B2 - - Google Patents

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Publication number
JPH0437939B2
JPH0437939B2 JP58203222A JP20322283A JPH0437939B2 JP H0437939 B2 JPH0437939 B2 JP H0437939B2 JP 58203222 A JP58203222 A JP 58203222A JP 20322283 A JP20322283 A JP 20322283A JP H0437939 B2 JPH0437939 B2 JP H0437939B2
Authority
JP
Japan
Prior art keywords
thick film
particle size
substrate
detection element
gas sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58203222A
Other languages
Japanese (ja)
Other versions
JPS6093949A (en
Inventor
Takao Kojima
Akira Nakano
Toshitaka Matsura
Akio Takami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP20322283A priority Critical patent/JPS6093949A/en
Priority to US06/664,872 priority patent/US4688015A/en
Priority to EP84112859A priority patent/EP0140340B1/en
Priority to DE8484112859T priority patent/DE3479053D1/en
Publication of JPS6093949A publication Critical patent/JPS6093949A/en
Priority to US06/880,013 priority patent/US4720394A/en
Publication of JPH0437939B2 publication Critical patent/JPH0437939B2/ja
Granted legal-status Critical Current

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/12Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

本発明は厚膜型検出素子と素子支持基板とが強
固に接着したガスセンサとその製造法に関するも
のである。 従来、基板表面に厚膜型検出素子を形成したガ
スセンサとしては、第1図に示すように検出素子
を支える絶縁セラミツク基板1の表面に厚膜印刷
によつて所望形状の電極パターン2a,2bを形
成し、その上にガス感応性金属酸化物を主成分と
するペーストを素子形状に厚膜印刷し、焼き付け
て検出素子3としたものが知られていた。この種
のセンサは、素子の厚さが薄いことから応答性が
良いこと、多くのガスセンサに不可欠なヒータを
厚膜印刷によつて検出素子と同一基板上に形成し
て構造を簡単にできることなど、多くの利点を有
している。ところが、この種のセンサは第2図に
示す第1図I−I′線断面図からわかるように、検
出素子3が焼き付けられている基板の表面1aが
平滑であるために素子と基板との接着強度が低
く、自動車の排気のように熱サイクルの激しい過
酷な雰囲気中で使用される場合には、基板材質と
素子材質の熱膨張係数の差に起因する熱歪によ
り、検出素子が基板から剥離するおそれがあつ
た。このおそれをなくすために基板自体に粒径の
大きいセラミツク粒子を原料として使用し、基板
表面を粗くすることも考えられるが、反面このよ
うな粗粒化は絶縁性、機械的強度等基板自体に要
求される諸性質を劣化させることになる。 発明者等は鋭意検討の結果、基板上の素子形成
面に予め粒子群を固着させて凹凸を設けておき、
その上に厚膜型検出素子を形成すれば、検出素子
と支持基板との間の接着強度が高められ剥離の可
能性が極めて少なくなることを見出した。 本発明は上記の知見に基づいてなされたもの
で、その要旨は絶縁性焼結セラミツクスからなり
表面に厚膜型電極が形成されている支持基板上記
支持基板と上記厚膜型電極近傍で一体化固着して
いる焼結前の造粒粒子の寸法が平均粒径5μm以上
最大500μm以下の焼結セラミツク粒子群及び上記
支持基板上に形成され上記厚膜型電極と電気的に
接続し、かつ上記粒子群に被着している厚膜型検
出素子を備えていることを特徴とするガスセンサ
に存する。 また、上記特定発明と関連する同様に本発明の
要旨は絶縁性セラミツク粉末と有機質結合剤から
なるグリーンシートの表面に所望形状の電極パタ
ーンを厚膜印刷によつて形成し、上記グリーンシ
ート表面の上記電極パターン近傍に平均粒径5μm
以上最大粒径500μm以下の造粒セラミツク粒子群
を分散し点在させた後、焼成し、次いでその上に
主としてガス感応性金属酸化物よりなるペースト
を厚膜印刷し、焼き付けることを特徴とするガス
センサの製造法に存する。 以下図面を参照し乍ら本発明を詳細に説明す
る。 まず、第3図は本発明ガスセンサにおける検出
素子と支持基板との接着状態を示す断面図であ
る。絶縁性焼結セラミツクスからなる支持基板1
1の表面に厚膜型電極12a,12bが形成さ
れ、電極12a,12bの近傍でセラミツク粒子
群4,4……4が基板11と一体化固着し、更に
基板11表面には検出素子13が電極12a,1
2bと電気的に接続し、かつ粒子群4,4……4
に被着するように厚膜印刷されている。本発明ガ
スセンサの検出素子と支持基板の接着強度が高い
第一の理由は基板表面に上記粒子群4,4……4
による凹凸が設けられていることから接着面積が
大きくなつたことであり、第二の理由は、粒子群
4,4……4を構成するそれぞれの球状粒子が検
出素子側の窪み13a,13a……13aと相互
に鉤機能を果たしていることであると考えられ
る。ここで粒子群とは、顆粒状に造粒された未焼
結の二次粒子から出発したものの群を意味するも
ので、上記限定した粒径範囲はこの未焼結の二次
粒子の平均粒径範囲である。従つて、これによつ
て設けられる凹凸は通常の基板表面粗さから生じ
る凹凸よりもはるかに大きなものである。粒子群
4,4……4の平均粒径は焼結前の状態で5μm以
上最大粒径500μm以下であることを必要とし、平
均粒径が5μmに満たないと接着強度を高める凹凸
効果に乏しく、500μmを超えるものが存在すると
後に検出素子を厚膜印刷によつて均一に形成する
ことが困難となるし、またばらつきも大きくな
る。平均粒径の最も望ましい範囲は50〜200μmで
ある。 粒子群の量は、検出素子を印刷する前の粒子群
を設けた焼結前また後の基板表面を、面に対し垂
直方向上方から見た場合の基板露見面積と粒子群
によつて視界がさえぎられた面積(群子群の投影
面積)との比(以下「被覆比」と略称)が4/1〜
1/4の範囲内となる量が望ましく、最適量は上記
比がおよそ1/1となる量である。粒子群の材質は
支持基板11と同材質のものが製造上最も簡単で
望ましいが、本発明の効果を奏する限り異なる材
質の絶縁性セラミツクスを用いることも可能であ
る。機械的強度、耐熱性、絶縁性、価格等の点か
ら本発明で使用する最適な絶縁性セラミツクスは
アルミナであり、次いでムライト、ジルコニア及
びスピネルである。 次に本発明ガスセンサの製造法について説明す
る。絶縁性セラミツクス粉末と有機質結合剤を有
機溶剤中で混合し、スラリーとし、ドクターブレ
ードによつて支持基板11となるべきシート状に
成形する。得られたシート表面にPt,Pd,Rh,
Au及びそれらの合金等の金属ペーストを用いて
櫛形、渦巻き形等所望形状の電極パターンを厚膜
印刷する。別途、粒子群4,4……4となるべき
セラミツク粉末からなる二次粒子を造粒し、これ
を上記シート表面で前記電極パターン近傍に分散
し点在させた後、焼成し、その上に主として
TiO2,SnO2等ガス感応性金属酸化物よりなり必
要に応じて貴金属粉末を含有させてもよいペース
トを厚膜印刷し、焼き付けることによつて本発明
ガスセンサを得る。ガス感応性金属酸化物よりな
るペーストは焼き付け後、検出素子13となつて
いる。 本発明ガスセンサは以上のように検出素子を粒
子群による大きな凹凸による窪みが形成された基
板上に接着したものである故に、検出素子の接着
強度が極めて高いものである。また、その製造法
において上記凹凸が、基板及び粒子群をそれぞれ
別途に常套手段に従つて成形又は造粒した後焼結
一体化したものである故に、特殊な装置を要する
ことなく簡単な工程で製造される利点がある。 なお、本発明ガスセンサは第4図に示すよう
に、開口5を有する保護基板6が支持基板11上
に積層され、検出素子13が開口5を充塞する形
で厚膜印刷された構造としても良い。この場合は
粒子群4,4……4となるべき造粒セラミツク粒
子の分散面積が開口5の底面積で限定されるの
で、所定部分への均一分散を容易にし、また検出
素子13の接着強度を一層高めることができる。 以下実施例を述べる。 実施例 平均粒径1.5μmのAl2O392重量%、SiO24重量
%、CaO2重量%及びMgO2重量%からなる混合
粉末100重量部に対してブチラール樹脂12重量部
及びDBP6重量部を添加し、有機溶剤中で混合し
スラリーとし、ドクターブレードにて第5図及び
第6図に示す形状で、厚さ1mmのグリーンシート
21及び厚さ0.2mmのグリーンシート7を作つた。
グリーンシート21の表面に第1図に示す形状の
発熱抵抗体パターン8及び電極パターン22a,
22bを白金ペーストで厚膜印刷し、各パターン
の端部に0.3mmφの白金リード線9a,9b,9
cを配置した。他方、グリーンシート7にこれを
グリーンシート21上に重ねた場合に電極パター
ン22a,22bの先端が露出し得る位置に打ち
抜きによつて開口5を設けた後、これら2枚のグ
リーンシートを積層熱圧着した。別途、上記シー
トに使用した混合粉末と同一組成の同一粉末に4
重量部のポリビニルアルコールを添加し湿式混合
し、噴霧乾燥機にかけて球状に造粒した後第1表
に示す粒度範囲に篩い分けしセラミツク粒子群
4,4……4とすべき顆粒を得た。この顆粒を開
口5内の表面上に被覆比が1程度になるように充
散し、圧着した二枚のシートとともに大気中温度
1500℃、保持時間2時間の条件で焼成した。次に
平均粒径1.2μmのTiO2粉末に対し1モル部の白金
ブラツクを添加し、更に全粉末に対し3重量部の
エチルセルローズを添加しブチルカルビトール中
で混合し300ポイズに粘度調整したTiO2ペースト
を、開口5を充塞し、かつ電極パターン22a,
22bの先端に被着するように厚膜印刷し、検出
素子13とし、大気中温度1200℃、保持時間1時
間の条件で焼き付けることによつて、第7図に示
すガスセンサNo.1〜No.8を製造した。 ただし、ガスセンサNo.1は比較のために開口5
にセラミツク粒子群を充散せずに検出素子13を
形成したものである。ガスセンサNo.1〜No.8の素
子内部抵抗をプロパンバーナーにより温度350℃
に設定した雰囲気で測定した処、理論空燃比λ>
1ではいずれも200MΩ以上であつたがλ=0.9に
なると第1表の値に変化し、センサ機能を維持し
ていることがわかつた。 上記ガスセンサを全負荷状態の2000c.c.エンジン
から排出される最高温度800℃の排気に5分間晒
し、次いでアイドリング状態に5分間晒す熱衝撃
試験を繰り返し実施し、検出素子13が剥離する
までの時間を測定した結果を第1表に示す。
The present invention relates to a gas sensor in which a thick-film detection element and an element support substrate are firmly adhered, and a method for manufacturing the same. Conventionally, as shown in FIG. 1, a gas sensor having a thick-film type detection element formed on the surface of a substrate has electrode patterns 2a and 2b of a desired shape formed by thick-film printing on the surface of an insulating ceramic substrate 1 that supports the detection element. It has been known to form a detection element 3 by printing a thick film of paste containing a gas-sensitive metal oxide as a main component thereon in the shape of the element, and then baking it. This type of sensor has good response due to its thin element, and the heater, which is essential for many gas sensors, can be formed on the same substrate as the detection element by thick film printing, simplifying the structure. , has many advantages. However, in this type of sensor, as can be seen from the cross-sectional view taken along line I-I' in FIG. When used in harsh environments with low adhesive strength and severe thermal cycles such as automobile exhaust, the sensing element may separate from the substrate due to thermal distortion caused by the difference in thermal expansion coefficient between the substrate material and the element material. There was a risk of peeling. In order to eliminate this fear, it is possible to use large ceramic particles as a raw material for the substrate itself to make the substrate surface rough, but on the other hand, such coarse graining may affect the insulation, mechanical strength, etc. of the substrate itself. This results in deterioration of the required properties. As a result of intensive study, the inventors determined that particles were adhered to the element forming surface of the substrate in advance to create irregularities.
It has been found that by forming a thick film detection element thereon, the adhesive strength between the detection element and the support substrate is increased and the possibility of peeling is extremely reduced. The present invention has been made based on the above findings, and its gist is that a support substrate made of insulating sintered ceramics and having a thick film electrode formed on its surface is integrated in the vicinity of the support substrate and the thick film electrode. A group of sintered ceramic particles in which the fixed granulated particles before sintering have an average particle diameter of 5 μm or more and a maximum of 500 μm or less, and are formed on the support substrate and electrically connected to the thick film electrode, and The present invention resides in a gas sensor characterized by comprising a thick film detection element adhered to a particle group. Further, the gist of the present invention, which is related to the above-mentioned specific invention, is to form an electrode pattern of a desired shape on the surface of a green sheet made of insulating ceramic powder and an organic binder by thick film printing, and to form an electrode pattern on the surface of the green sheet. Average particle size 5μm near the above electrode pattern
The method is characterized in that granulated ceramic particles having a maximum particle size of 500 μm or less are dispersed and dotted, then fired, and then a thick film of a paste mainly consisting of a gas-sensitive metal oxide is printed thereon and baked. The problem lies in the manufacturing method of gas sensors. The present invention will be described in detail below with reference to the drawings. First, FIG. 3 is a sectional view showing the state of adhesion between the detection element and the support substrate in the gas sensor of the present invention. Support substrate 1 made of insulating sintered ceramics
Thick film type electrodes 12a, 12b are formed on the surface of the substrate 1, ceramic particle groups 4, 4...4 are integrally fixed to the substrate 11 near the electrodes 12a, 12b, and a detection element 13 is further formed on the surface of the substrate 11. Electrode 12a, 1
2b, and particle groups 4, 4...4
Printed in thick film to adhere to. The first reason why the adhesive strength between the detection element and the supporting substrate of the gas sensor of the present invention is high is that the above-mentioned particle groups 4, 4...4 are present on the substrate surface.
The second reason is that each spherical particle constituting the particle groups 4, 4...4 has a depression 13a, 13a... on the detection element side. ...13a and is thought to function as a hook mutually. Here, the particle group refers to a group of particles starting from unsintered secondary particles granulated into granules, and the particle size range limited above corresponds to the average particle size of these unsintered secondary particles. diameter range. Therefore, the unevenness created by this is much larger than the unevenness caused by normal substrate surface roughness. The average particle size of particle groups 4, 4...4 must be 5 μm or more and the maximum particle size is 500 μm or less before sintering, and if the average particle size is less than 5 μm, the unevenness effect that increases adhesive strength will be poor. , if the thickness exceeds 500 μm, it will be difficult to uniformly form the detection element later by thick film printing, and variations will also increase. The most desirable range of average particle size is 50-200 μm. The amount of particle groups is determined by the visibility depending on the exposed area of the substrate and the particle group when the surface of the substrate before and after sintering on which the particle groups are provided before printing the detection element is viewed from above in a direction perpendicular to the surface. The ratio (hereinafter abbreviated as "coverage ratio") to the blocked area (projected area of the cluster) is 4/1 ~
An amount within the range of 1/4 is desirable, and an optimal amount is an amount where the above ratio is approximately 1/1. The material of the particle group is preferably the same as that of the support substrate 11 because it is easiest to manufacture, but it is also possible to use insulating ceramics of a different material as long as the effects of the present invention are achieved. In terms of mechanical strength, heat resistance, insulation, cost, etc., the most suitable insulating ceramic to be used in the present invention is alumina, followed by mullite, zirconia, and spinel. Next, a method of manufacturing the gas sensor of the present invention will be explained. An insulating ceramic powder and an organic binder are mixed in an organic solvent to form a slurry, and the slurry is formed into a sheet to become the supporting substrate 11 using a doctor blade. Pt, Pd, Rh,
An electrode pattern in a desired shape such as a comb shape or a spiral shape is thick-film printed using a metal paste such as Au or an alloy thereof. Separately, secondary particles made of ceramic powder to form particle groups 4, 4...4 are granulated, and after being dispersed and dotted near the electrode pattern on the surface of the sheet, they are fired, and then mainly
The gas sensor of the present invention is obtained by printing a thick film of a paste made of a gas-sensitive metal oxide such as TiO 2 or SnO 2 and optionally containing noble metal powder, and baking the paste. The paste made of gas-sensitive metal oxide becomes the detection element 13 after baking. In the gas sensor of the present invention, as described above, the detection element is bonded onto the substrate in which the depressions are formed due to the large irregularities formed by the particles, and therefore the adhesive strength of the detection element is extremely high. In addition, in the manufacturing method, the above-mentioned irregularities are formed by molding or granulating the substrate and the particle groups separately according to conventional methods, and then sintering them into one piece, so it is a simple process without requiring any special equipment. It has the advantage of being manufactured. As shown in FIG. 4, the gas sensor of the present invention may have a structure in which a protective substrate 6 having an opening 5 is laminated on a supporting substrate 11, and the detection element 13 is printed with a thick film so as to fill the opening 5. . In this case, since the dispersion area of the granulated ceramic particles to form the particle groups 4, 4...4 is limited by the bottom area of the opening 5, uniform dispersion to a predetermined portion is facilitated, and the adhesive strength of the detection element 13 is can be further enhanced. Examples will be described below. Example 12 parts by weight of butyral resin and 6 parts by weight of DBP were added to 100 parts by weight of a mixed powder consisting of 92% by weight of Al 2 O 3 , 4% by weight of SiO 2 , 2% by weight of CaO, and 2% by weight of MgO with an average particle size of 1.5 μm. The mixture was mixed in an organic solvent to form a slurry, and a green sheet 21 with a thickness of 1 mm and a green sheet 7 with a thickness of 0.2 mm were produced in the shapes shown in FIGS. 5 and 6 using a doctor blade.
On the surface of the green sheet 21, a heating resistor pattern 8 and an electrode pattern 22a having the shape shown in FIG.
22b is thickly printed with platinum paste, and platinum lead wires 9a, 9b, 9 with a diameter of 0.3 mm are attached to the ends of each pattern.
c was placed. On the other hand, after punching out openings 5 at positions where the tips of the electrode patterns 22a and 22b can be exposed when the green sheet 7 is stacked on the green sheet 21, these two green sheets are laminated and heated. It was crimped. Separately, add 40% to the same powder with the same composition as the mixed powder used for the above sheet.
Parts by weight of polyvinyl alcohol were added, wet-mixed, and granulated into spheres using a spray dryer, followed by sieving into the particle size range shown in Table 1 to obtain granules to be Ceramic Particle Groups 4, 4...4. These granules are scattered on the surface inside the opening 5 so that the coverage ratio is about 1, and the granules are placed in the atmosphere with the two sheets that are crimped together.
It was fired under the conditions of 1500°C and a holding time of 2 hours. Next, 1 mole part of platinum black was added to TiO 2 powder with an average particle size of 1.2 μm, and 3 parts by weight of ethyl cellulose was added to the total powder, mixed in butyl carbitol, and the viscosity was adjusted to 300 poise. The opening 5 is filled with TiO 2 paste, and the electrode pattern 22a,
By printing a thick film so as to adhere to the tip of the gas sensor 22b to form the detection element 13, and baking it in the atmosphere at a temperature of 1200°C and a holding time of 1 hour, the gas sensors No. 1 to No. 1 shown in FIG. 8 was manufactured. However, gas sensor No. 1 has aperture 5 for comparison.
The detection element 13 is formed without dispersing the ceramic particles. The internal resistance of gas sensors No. 1 to No. 8 was measured at 350℃ using a propane burner.
The stoichiometric air-fuel ratio λ>
1, all values were 200 MΩ or more, but when λ = 0.9, the values changed to those shown in Table 1, indicating that the sensor function was maintained. A thermal shock test was repeatedly conducted in which the gas sensor was exposed to exhaust gas with a maximum temperature of 800°C from a 2000cc engine under full load for 5 minutes, and then idling for 5 minutes, until the detection element 13 peeled off. Table 1 shows the results of time measurements.

【表】 第1表からわかるように本発明ガスセンサNo.3
〜No.6は比較例のガスセンサNo.1〜No.2に比べて
極めて接着強度の高いものであつた。なお比較例
ガスセンサNo.7〜No.8は本発明例と同程度の接着
強度を示したが、検出素子の印刷状態が不均一な
ものであつた。 これは、自動車の排気のように激しい熱サイク
ルと振動に曝されて耐えるに適するように、基板
上に一体化固着した造粒粒子により形成された窪
みによる鉤機能を有する凹凸を設け、その基板上
に厚膜型の薄い検出素子を形成したことによるも
のである。しかもその鉤機能を有する凹凸を基板
に破損をもたらすような圧縮力を加えることなく
球状の造粒粒子を基板上の所定位置に振り掛け、
それを焼成することで達成することができたもの
である。
[Table] As can be seen from Table 1, the present invention gas sensor No. 3
- No. 6 had extremely high adhesive strength compared to gas sensors No. 1 to No. 2 of comparative examples. Comparative example gas sensors No. 7 to No. 8 showed adhesive strength comparable to that of the inventive example, but the printing state of the detection element was non-uniform. In order to withstand exposure to intense thermal cycles and vibrations such as automobile exhaust, the substrate is provided with concavities and convexities that have a hook function by concavities formed by granulated particles that are integrated and fixed on the substrate. This is due to the fact that a thick-film thin detection element is formed on top. Moreover, the spherical granulated particles are sprinkled onto a predetermined position on the substrate using the unevenness that has a hook function, without applying compressive force that would cause damage to the substrate.
This was achieved by firing it.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のガスセンサを示す斜視図、第2
図は第1図のI−I′線拡大断面図、第3図は本発
明ガスセンサの一実施例を示す断面図、第4図は
本発明ガスセンサの他の実施例を示す断面図、第
5図は本発明ガスセンサ製造法の初期段階を示す
平面図、第6図は同じく中期段階を示す平面図、
第7図は第4図と同じ実施例を示す平面図であ
る。 11……支持基板、12a,12b……電極、
4……セラミツク粒子群、13……検出素子、2
1……グリーンシート、22a,22b……電極
パターン。
Figure 1 is a perspective view of a conventional gas sensor; Figure 2 is a perspective view of a conventional gas sensor;
The figures are an enlarged sectional view taken along the line I-I' in FIG. 1, FIG. 3 is a sectional view showing one embodiment of the gas sensor of the present invention, FIG. The figure is a plan view showing the initial stage of the gas sensor manufacturing method of the present invention, FIG. 6 is a plan view showing the middle stage,
FIG. 7 is a plan view showing the same embodiment as FIG. 4. 11... Support substrate, 12a, 12b... Electrode,
4... Ceramic particle group, 13... Detection element, 2
1... Green sheet, 22a, 22b... Electrode pattern.

Claims (1)

【特許請求の範囲】 1 絶縁性焼結セラミツクスからなり表面に厚膜
型電極が形成されている支持基板、上記厚膜型電
極近傍で上記支持基板と一体化固着している焼結
前の造粒粒子寸法が平均粒径5μm以上最大粒径
500μm以下である焼結セラミツク粒子群及び上記
支持基板上に形成され上記厚膜型電極と電気的に
接続し、かつ上記粒子群に被着している厚膜型検
出素子を備えていることを特徴とするガスセン
サ。 2 絶縁性セラミツク粉末と有機質結合剤からな
るグリーンシートの表面に所望形状の電極パター
ンを厚膜印刷によつて形成し、上記グリーンシー
ト表面の上記電極パターン近傍に平均粒径5μm以
上最大粒径500μm以下の造粒セラミツク粒子群を
分散させた後、焼成し次いでその上に主としてガ
ス感応性金属酸化物よりなるペーストを厚膜印刷
し、焼き付けることを特徴とするガスセンサの製
造法。
[Scope of Claims] 1. A support substrate made of insulating sintered ceramics and having a thick film electrode formed on its surface, a pre-sintered structure that is integrally fixed to the support substrate in the vicinity of the thick film electrode. Particle size is average particle size 5μm or more maximum particle size
The device comprises a group of sintered ceramic particles having a size of 500 μm or less and a thick film detection element formed on the support substrate, electrically connected to the thick film electrode, and adhered to the particle group. Characteristic gas sensor. 2. An electrode pattern of a desired shape is formed on the surface of a green sheet made of insulating ceramic powder and an organic binder by thick film printing, and the average particle size is 5 μm or more and the maximum particle size is 500 μm on the surface of the green sheet near the electrode pattern. A method for producing a gas sensor, which comprises dispersing the following group of granulated ceramic particles, then firing, and then printing a thick film of paste mainly consisting of a gas-sensitive metal oxide thereon and baking it.
JP20322283A 1983-10-28 1983-10-28 Gas sensor and preparation thereof Granted JPS6093949A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP20322283A JPS6093949A (en) 1983-10-28 1983-10-28 Gas sensor and preparation thereof
US06/664,872 US4688015A (en) 1983-10-28 1984-10-25 Gas sensor with ceramics substrate having surface-carried ceramics particles
EP84112859A EP0140340B1 (en) 1983-10-28 1984-10-25 Gas sensor with ceramics substrate and method for producing the same
DE8484112859T DE3479053D1 (en) 1983-10-28 1984-10-25 Gas sensor with ceramics substrate and method for producing the same
US06/880,013 US4720394A (en) 1983-10-28 1986-06-30 Gas sensor with ceramics substrate and method for producing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20322283A JPS6093949A (en) 1983-10-28 1983-10-28 Gas sensor and preparation thereof

Publications (2)

Publication Number Publication Date
JPS6093949A JPS6093949A (en) 1985-05-25
JPH0437939B2 true JPH0437939B2 (en) 1992-06-22

Family

ID=16470477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20322283A Granted JPS6093949A (en) 1983-10-28 1983-10-28 Gas sensor and preparation thereof

Country Status (1)

Country Link
JP (1) JPS6093949A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5202154A (en) * 1988-09-19 1993-04-13 Ngk Spark Plug Co., Ltd. Method of producing thick-film gas sensor element having improved stability

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5721051B2 (en) * 1974-06-04 1982-05-04
JPS5288098A (en) * 1976-01-17 1977-07-22 Murata Manufacturing Co Gas detecting element

Also Published As

Publication number Publication date
JPS6093949A (en) 1985-05-25

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