JPH0438041U - - Google Patents
Info
- Publication number
- JPH0438041U JPH0438041U JP8015490U JP8015490U JPH0438041U JP H0438041 U JPH0438041 U JP H0438041U JP 8015490 U JP8015490 U JP 8015490U JP 8015490 U JP8015490 U JP 8015490U JP H0438041 U JPH0438041 U JP H0438041U
- Authority
- JP
- Japan
- Prior art keywords
- die bonding
- positioning
- suction
- light source
- collet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 5
- 238000001179 sorption measurement Methods 0.000 claims description 3
Landscapes
- Die Bonding (AREA)
Description
第１図ａは本考案の実施例１の主要部を断面し
た斜視図、第１図ｂは実施例１でのペレツト吸着
状態を示す斜視図、第２図は本考案の実施例２の
主要部を断面した斜視図、第３図は従来例におけ
るダイボンデイング位置合せ状態を示す斜視図、
第４図は従来例におけるペレツト吸着状態を示す
斜視図である。
１……ダイボンデイングアーム、２……加圧用
スプリング、３……コレツトホルダ、４……位置
合せ用光源、５……吸着配管、６……吸着コレツ
ト、６ａ……吸着孔、７……リードフレーム、８
……ダイボンデイングアイランド、９……位置合
せ用のスポツト光、１０……ペレツト、１１……
ヘアライン。
Figure 1a is a cross-sectional perspective view of the main part of Embodiment 1 of the present invention, Figure 1b is a perspective view showing the pellet adsorption state in Embodiment 1, and Figure 2 is the main part of Embodiment 2 of the present invention. FIG. 3 is a perspective view showing a die bonding alignment state in a conventional example;
FIG. 4 is a perspective view showing a pellet adsorption state in a conventional example. 1... Die bonding arm, 2... Pressure spring, 3... Collet holder, 4... Light source for alignment, 5... Suction piping, 6... Suction collet, 6a... Suction hole, 7... Lead frame , 8
...Die bonding island, 9...Spot light for positioning, 10...Pellet, 11...
hairline.
Claims (1)
トで吸着搬送して所定の位置にダイボンデイング
するダイボンデイング装置であつて、 位置合せ用光源は、吸着コレツトの吸着孔を通
して位置決め用のスポツト光をリードフレーム上
のダイボンデイング位置或いはペレツトの吸着位
置に照射するものであることを特徴とするダイボ
ンデイング装置。[Scope of Claim for Utility Model Registration] A die bonding device that has a light source for positioning and conveys pellets by suction with a suction collet for die bonding to a predetermined position, wherein the light source for positioning is arranged in a suction hole of the suction collet. 1. A die bonding apparatus characterized in that a spot light for positioning is irradiated through a die bonding position on a lead frame or a pellet adsorption position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8015490U JPH0438041U (en) | 1990-07-27 | 1990-07-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8015490U JPH0438041U (en) | 1990-07-27 | 1990-07-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0438041U true JPH0438041U (en) | 1992-03-31 |
Family
ID=31624957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8015490U Pending JPH0438041U (en) | 1990-07-27 | 1990-07-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0438041U (en) |
-
1990
- 1990-07-27 JP JP8015490U patent/JPH0438041U/ja active Pending
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