JPH0444151U - - Google Patents
Info
- Publication number
- JPH0444151U JPH0444151U JP8325290U JP8325290U JPH0444151U JP H0444151 U JPH0444151 U JP H0444151U JP 8325290 U JP8325290 U JP 8325290U JP 8325290 U JP8325290 U JP 8325290U JP H0444151 U JPH0444151 U JP H0444151U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive sheet
- semiconductor element
- needle
- adsorbent
- push
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000003463 adsorbent Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
Description
第１図、第２図および第３図は従来装置の説明
図、第４図は本考案の一実施例の説明図である。
１……枠体、２……半導体素子、３……粘着シ
ート、４……吸着体、４ａ……ガイド孔、４ｂ…
…排気孔、４ｃ……排気路、５……突き上げ針、
６……吸着ノズル、７……吸着体ホルダ、８……
焼結体製吸着体、８ａ……ガイド孔、９……吸着
ホルダ、９ａ……排気路。
1, 2, and 3 are explanatory diagrams of a conventional device, and FIG. 4 is an explanatory diagram of an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Frame body, 2... Semiconductor element, 3... Adhesive sheet, 4... Adsorption body, 4a... Guide hole, 4b...
...Exhaust hole, 4c...Exhaust path, 5...Pushing needle,
6...Adsorption nozzle, 7...Adsorption body holder, 8...
Adsorption body made of sintered body, 8a...guide hole, 9...adsorption holder, 9a...exhaust path.
Claims (1)
粘着シートと、この粘着シートを真空吸着する吸
着体と、この吸着体による粘着シートの粘着状態
において前記半導体素子を粘着シートを介して突
き上げる突き上げ針と、この突き上げ針による突
き上げ時突き上げられた半導体素子の吸着ノズル
を備えたダイピツクアツプ装置において、前記吸
着体を通気性のある焼結材で形成したことを特徴
とするダイピツクアツプ装置。 An adhesive sheet fixed on a frame body for adhesively fixing a semiconductor element, an adsorbent for vacuum adsorbing this adhesive sheet, and a push-up needle that pushes up the semiconductor element through the adhesive sheet when the adhesive sheet is adhered by the adsorbent. and a die pick-up device equipped with a suction nozzle for a semiconductor element pushed up when pushed up by the push-up needle, characterized in that the sucking body is formed of a breathable sintered material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8325290U JPH0444151U (en) | 1990-08-08 | 1990-08-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8325290U JPH0444151U (en) | 1990-08-08 | 1990-08-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0444151U true JPH0444151U (en) | 1992-04-15 |
Family
ID=31814381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8325290U Pending JPH0444151U (en) | 1990-08-08 | 1990-08-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0444151U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5816685A (en) * | 1981-07-22 | 1983-01-31 | Takeda Chem Ind Ltd | Immobilized enzyme, its preparation and pharmaceutical preparation |
| JPS60102754A (en) * | 1983-11-09 | 1985-06-06 | Nec Corp | Chip isolating mechanism |
-
1990
- 1990-08-08 JP JP8325290U patent/JPH0444151U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5816685A (en) * | 1981-07-22 | 1983-01-31 | Takeda Chem Ind Ltd | Immobilized enzyme, its preparation and pharmaceutical preparation |
| JPS60102754A (en) * | 1983-11-09 | 1985-06-06 | Nec Corp | Chip isolating mechanism |
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