JPH0438044U - - Google Patents

Info

Publication number
JPH0438044U
JPH0438044U JP1990080473U JP8047390U JPH0438044U JP H0438044 U JPH0438044 U JP H0438044U JP 1990080473 U JP1990080473 U JP 1990080473U JP 8047390 U JP8047390 U JP 8047390U JP H0438044 U JPH0438044 U JP H0438044U
Authority
JP
Japan
Prior art keywords
wire
bonding
spool
clamper
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990080473U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990080473U priority Critical patent/JPH0438044U/ja
Publication of JPH0438044U publication Critical patent/JPH0438044U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Wire Bonding (AREA)
JP1990080473U 1990-07-26 1990-07-26 Pending JPH0438044U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990080473U JPH0438044U (cs) 1990-07-26 1990-07-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990080473U JPH0438044U (cs) 1990-07-26 1990-07-26

Publications (1)

Publication Number Publication Date
JPH0438044U true JPH0438044U (cs) 1992-03-31

Family

ID=31625568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990080473U Pending JPH0438044U (cs) 1990-07-26 1990-07-26

Country Status (1)

Country Link
JP (1) JPH0438044U (cs)

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