JPH0438064U - - Google Patents

Info

Publication number
JPH0438064U
JPH0438064U JP1990080494U JP8049490U JPH0438064U JP H0438064 U JPH0438064 U JP H0438064U JP 1990080494 U JP1990080494 U JP 1990080494U JP 8049490 U JP8049490 U JP 8049490U JP H0438064 U JPH0438064 U JP H0438064U
Authority
JP
Japan
Prior art keywords
electronic component
main body
component main
lead type
tab lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990080494U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990080494U priority Critical patent/JPH0438064U/ja
Publication of JPH0438064U publication Critical patent/JPH0438064U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips

Landscapes

  • Wire Bonding (AREA)
JP1990080494U 1990-07-27 1990-07-27 Pending JPH0438064U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990080494U JPH0438064U (cs) 1990-07-27 1990-07-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990080494U JPH0438064U (cs) 1990-07-27 1990-07-27

Publications (1)

Publication Number Publication Date
JPH0438064U true JPH0438064U (cs) 1992-03-31

Family

ID=31625607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990080494U Pending JPH0438064U (cs) 1990-07-27 1990-07-27

Country Status (1)

Country Link
JP (1) JPH0438064U (cs)

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