JPH0438418B2 - - Google Patents
Info
- Publication number
- JPH0438418B2 JPH0438418B2 JP62306894A JP30689487A JPH0438418B2 JP H0438418 B2 JPH0438418 B2 JP H0438418B2 JP 62306894 A JP62306894 A JP 62306894A JP 30689487 A JP30689487 A JP 30689487A JP H0438418 B2 JPH0438418 B2 JP H0438418B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- sid
- distal end
- frame
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003384 imaging method Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000005286 illumination Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 238000003780 insertion Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 101100064323 Arabidopsis thaliana DTX47 gene Proteins 0.000 description 2
- 101150026676 SID1 gene Proteins 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 101100256916 Caenorhabditis elegans sid-1 gene Proteins 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Instruments For Viewing The Inside Of Hollow Bodies (AREA)
- Endoscopes (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、たとえば内視鏡の挿入部に設けら
れた先端構成部に設けられる撮像装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an imaging device provided, for example, in a distal end component provided in an insertion portion of an endoscope.
内視鏡において、挿入部の先端構成部に固体撮
像素子（以下SIDという）を備えたものが、たと
えば特開昭60−208726号公報で知られている。こ
の内視鏡の先端構成部には観察窓が設けられ、こ
の観察窓に対向して対物光学系が設けられてい
る。そして、この対物光学系の後方にSIDが設け
られている。ところで、前記SIDの背面には短軸
端子ピンと長軸端子ピンが突設され、短軸端子ピ
ンは、SIDの後部に設けたSID基板を貫通し、そ
の後方に回路基板に電気的に接続され、長軸端子
ピンは、前記SID基板および回路基板を貫通して
信号線に電気的に接続されている。つまり、回路
基板にはSIDの端子ピンを挿通する透孔と信号線
を接続するための透孔を別々に設けた構造であ
る。
An endoscope equipped with a solid-state imaging device (hereinafter referred to as SID) in the distal end component of an insertion section is known, for example, from Japanese Patent Laid-Open No. 60-208726. An observation window is provided in the distal end component of this endoscope, and an objective optical system is provided opposite to this observation window. A SID is provided behind this objective optical system. By the way, a short-axis terminal pin and a long-axis terminal pin are protruded from the back of the SID, and the short-axis terminal pin passes through the SID board provided at the rear of the SID and is electrically connected to the circuit board behind it. , the long axis terminal pin passes through the SID board and the circuit board and is electrically connected to the signal line. In other words, the circuit board has a structure in which a through hole for inserting the SID terminal pin and a through hole for connecting the signal line are separately provided.
ところが、前述したように、回路基板に端子ピ
ンを挿通する透孔と信号線を接続するための透孔
を別々に設け、透孔に半田付けすることによつて
電気的に接続する構造は、透孔の数が増え、しか
も短絡防止のために透孔の間隔を広げる必要があ
り、回路基板が大きくなり、その分、撮像装置が
大型化し、内視鏡の先端構成部の大型化につなが
るという事情がある。
However, as mentioned above, a structure in which a through hole for inserting a terminal pin and a through hole for connecting a signal line are separately provided in a circuit board, and electrical connection is made by soldering to the through hole, The number of through holes increases, and it is necessary to widen the spacing between the through holes to prevent short circuits, which increases the size of the circuit board, which increases the size of the imaging device and leads to an increase in the size of the endoscope's tip components. There is a situation.
この発明は、上記事情に着目してなされたもの
で、その目的とするところは、入出力端子および
信号線を基板の同一の透孔に挿入して電気的に接
続することにより、狭いスペースでの接続を可能
にして基板および装置全体の小型化を図ることが
できる撮像装置を提供することにある。 This invention was made in view of the above-mentioned circumstances, and its purpose is to insert input/output terminals and signal lines into the same through hole in the board and electrically connect them, thereby making it possible to reduce the amount of time required in a narrow space. It is an object of the present invention to provide an imaging device that can connect the circuit board and the entire device, thereby reducing the size of the board and the device as a whole.
この発明は、固体撮像素子への入出力回路を搭
載した基板に少なくとも１つの透孔を設け、この
透孔に前記固体撮像素子の入出力端子と信号線の
導体ともども前記基板に挿入して電気的に接続
し、入出力端子および信号線の基板への接続、入
出力端子と信号線との接続が１箇所で同時にでき
るようにしたことにある。
The present invention provides at least one through hole in a substrate on which an input/output circuit for a solid-state image sensor is mounted, and inserts an input/output terminal of the solid-state image sensor and a conductor of a signal line into the substrate into the through hole to conduct electricity. The purpose is to connect the input/output terminals and signal lines to the board, and to connect the input/output terminals and the signal lines simultaneously at one location.
以下、この発明の一実施例を図面に基づいて説
明する。
Hereinafter, one embodiment of the present invention will be described based on the drawings.
第１図は内視鏡の先端部の構造を示し、１は先
端構成部、１ａはその先端構成部１の先端に設け
た先端カバー、２は先端構成部１の後部に連結さ
れた外套管、３は照明系、４は対物系、５は送水
系、６は処置具挿通系である。照明系３は、先端
構成部１内に、先端面に臨む照明用光学レンズ７
を設けるとともに、外套管２内に挿通したライト
ガイドフアイバー８の先端部（出射側の端部）を
照明用光学レンズ７の後段に配する。そして、ラ
イドガイドフアイバー６の先端面を照明用光学レ
ンズ７に対向してなり、光源装置から供給される
照明光を先端カバー１ａの前方に照射することが
できるようにしている。処置具挿通系６は、外套
管２内に挿通したチヤンネルチユーブ９の先端側
の端部をチユーブ固定部材１０を使つて、先端構
成部１に形成されたチヤンネル孔１０ａに接続す
る他、後部側の端部を図示しない操作部に設けた
処置具入口部に接続して構成されていて、処置具
（図示しない）を内視鏡先端部へ導くことができ
るようにしている。送水系５は、外套管２内に送
水チユーブ１１を送水する他、先端構成部１の先
端部に、先端カバー１ａを貫通してノズル１２を
設け、このノズル１２と送水チユーブ１１の先端
側とをチユーブ固定部材１３および透孔１４を介
し連通して構成されていて、送水チユーブ１１の
後部側の端部につながる送気送水操作部（図示し
ない）にて送水を行なうことができるようにして
いる。また、対物系４は、先端構成部１内に、対
物レンズ系１５、SID１６、さらにSID１６の電
装系を１つのユニツトにした対物組部としての撮
像装置１７を設けて構成している。 FIG. 1 shows the structure of the distal end of the endoscope, with reference numeral 1 indicating the distal end component, 1a the distal cover provided at the distal end of the distal end component 1, and 2 a mantle tube connected to the rear of the distal end component 1. , 3 is an illumination system, 4 is an objective system, 5 is a water supply system, and 6 is a treatment instrument insertion system. The illumination system 3 includes an illumination optical lens 7 located in the tip component 1 and facing the tip surface.
At the same time, the tip portion (output side end portion) of the light guide fiber 8 inserted into the outer tube 2 is arranged after the illumination optical lens 7. The distal end surface of the ride guide fiber 6 is opposed to the illumination optical lens 7, so that the front of the distal end cover 1a can be irradiated with illumination light supplied from the light source device. The treatment instrument insertion system 6 connects the distal end of the channel tube 9 inserted into the mantle tube 2 to the channel hole 10a formed in the distal end component 1 using the tube fixing member 10, and also The end thereof is connected to a treatment instrument inlet provided in an operation section (not shown), so that a treatment instrument (not shown) can be guided to the distal end of the endoscope. The water supply system 5 includes a water supply tube 11 for supplying water into the mantle tube 2, and a nozzle 12 provided at the distal end of the distal end component 1 by penetrating the distal end cover 1a. are configured to communicate through the tube fixing member 13 and the through hole 14, and water can be supplied by an air/water supply operation section (not shown) connected to the rear end of the water supply tube 11. There is. Further, the objective system 4 is constructed by providing an imaging device 17 as an objective assembly section in which an objective lens system 15, an SID 16, and an electrical system of the SID 16 are integrated into one unit.
前記撮像装置１７について詳述すると、これは
金属製のシールドパイプ１８の先端部内に、対物
レンズ系１５およびSID１６で構成される対物部
を設けるとともに、シールドパイプ１８の後部内
に、信号線１９……を多条に巻回する他、外周部
にシールド線２０を配したケーブル２１とSID１
６とを、増幅回路２２を搭載した２枚の基板２３
ａ，２３ｂを使つてシールドパイプ１８内の中央
で接続した構造が採用されている。詳しくは、対
物部としては、先端にカバーレンズ２５を、内部
にレンズ群２６を装着したレンズ枠２７の先端側
の外周部に、絶縁部材からなるレンズ枠カバー２
８が設けられ、このレンズ枠２７とレンズ枠カバ
ー２８とによつて固定枠２５ａを構成している。
さらに、固定枠２５ａの後端側の外周部に、SID
枠２９を介しSID１６を設けて構成され、SID１
６の入出力端子１６ａを後方に突出している。ま
た、レンズ枠カバー２８とレンズ枠２７、SID１
６とSID枠２９は接着によつてそれぞれ気密に固
定される他、SID枠２９とレンズ枠２７とは固定
ねじ３０によつて固定される。ただし、カバーレ
ンズ２５とレンズ枠カバー２８との間隙には接着
剤３１が塗り込まれ、気密となつている。すなわ
ち、前記レンズ枠カバー２８の開口端部には大径
枠部が設けられ、この大径枠部の一部にレンズ枠
２７の開口端部に設けた大径枠部が内装されてい
る。したがつて、このレンズ枠２７の大径枠部に
よつて前記カバーレンズ２５を嵌合する嵌合孔２
７ａを形成しており、前記嵌合孔２７ａより大径
の挿通孔２８ａを形成している。このため、カバ
ーレンズ２５の外周と嵌合孔２７ａの内周との間
隙は狭く、カバーレンズ２５の外周と挿通孔２８
ａとの間隙は広く形成され、この両間隙に接着剤
３１が充填されている。また、ケーブル２１側の
構造としては、つぎのように構成されている。 To explain the imaging device 17 in detail, this is provided with an objective section consisting of an objective lens system 15 and an SID 16 in the tip of a metal shield pipe 18, and a signal line 19 in the rear part of the shield pipe 18. Cable 21 with shield wire 20 arranged around the outer periphery and SID 1
6 and two boards 23 on which the amplifier circuit 22 is mounted.
A structure is adopted in which the shield pipes are connected at the center within the shield pipe 18 using the pipes a and 23b. Specifically, the objective part includes a lens frame cover 2 made of an insulating material on the outer periphery of the front end side of a lens frame 27 which has a cover lens 25 attached to the front end and a lens group 26 inside.
8 is provided, and this lens frame 27 and lens frame cover 28 constitute a fixed frame 25a.
Furthermore, an SID is provided on the outer periphery of the rear end side of the fixed frame 25a.
It is configured by providing SID16 through the frame 29, and SID1
No. 6 input/output terminals 16a protrude rearward. In addition, the lens frame cover 28, the lens frame 27, and the SID1
6 and the SID frame 29 are each airtightly fixed by adhesive, and the SID frame 29 and the lens frame 27 are fixed by a fixing screw 30. However, adhesive 31 is applied to the gap between the cover lens 25 and the lens frame cover 28 to make it airtight. That is, a large-diameter frame portion is provided at the open end of the lens frame cover 28, and a large-diameter frame portion provided at the open end of the lens frame 27 is housed in a part of the large-diameter frame portion. Therefore, the fitting hole 2 into which the cover lens 25 is fitted is formed by the large diameter frame portion of the lens frame 27.
7a, and an insertion hole 28a having a larger diameter than the fitting hole 27a. Therefore, the gap between the outer periphery of the cover lens 25 and the inner periphery of the fitting hole 27a is narrow, and the gap between the outer periphery of the cover lens 25 and the insertion hole 27a is narrow.
A is formed wide, and both gaps are filled with adhesive 31. Further, the structure on the cable 21 side is configured as follows.
すなわち、一部周壁が切欠されたケーブル固定
枠３２をケーブル２１の先端に挿入し、シールド
線２０を外側に出すとともに、ケーブル固定枠３
２の切欠部３２ａを通じ信号線１９……を糸３３
でしばり、信号線１９……を固定する。そして、
その後、ケーブル固定枠３２との間に先のシール
ド線２０を挿入する他、その間隙に半田３５を充
填してなる。これにより、シールド線２０を固定
すると同時に、各信号線１９……を先端側に導出
させている。なお、３６は先端側がケーブル固定
枠３２の後部に糸（図示しない）で連結されたケ
ーブル２１の保護チユーブである。 That is, the cable fixing frame 32 with a partially cut out peripheral wall is inserted into the tip of the cable 21, the shield wire 20 is brought out to the outside, and the cable fixing frame 32 is inserted into the cable fixing frame 32.
The signal line 19... is threaded through the thread 33 through the notch 32a of No. 2.
and secure the signal wire 19... and,
Thereafter, in addition to inserting the shield wire 20 between the cable fixing frame 32 and the cable fixing frame 32, the gap is filled with solder 35. As a result, the shield wire 20 is fixed, and at the same time, each signal wire 19 is led out to the tip side. Note that 36 is a protective tube for the cable 21 whose tip end side is connected to the rear part of the cable fixing frame 32 with a thread (not shown).
一方、ケーブル２１の信号線１９……と先の
SID１６が基板２３ａ，２３ｂとの接続として
は、各基板２３ａ，２３ｂの板面に設けた複数の
透孔３８……を使つて行われている。すなわち、
接続には、信号線１９……を基板２３ｂの透孔３
８……を通じ基板２３ａの透孔３８……へ挿入す
るとともに、基板２３ａの同一の透孔３８にSID
１６の入出力端子１６ａを挿入して、その基板２
３ａの透孔３８には半田３９を充填して両者を接
続し、さらに基板２３ａあるいは基板２３ｂから
突出した信号線１９を、前記入出力端子１６ａと
もども半田３９によつて基板２３ａに接続するこ
とが行われ、またSID１６を信号線１９に直接接
続したり、増幅回路２２を介して接続したりして
いる。そして、こうして構成された対物部のSID
枠２９、電装系となるパイプ止め３４にかけてシ
ールドパイプ１８が外嵌されるとともに、そのパ
イプ端が導電接着剤でSID枠２９、パイプ止め３
４にそれぞれ吸着されて撮像装置１７の全体を構
成している。なお、４０ａはSID枠２９、シール
ドパイプ１８、保護チユーブ３６に渡り被覆され
た絶縁性のチユーブからなるシールドパイプカバ
ーである。 On the other hand, the signal line 19 of cable 21...
The SID 16 is connected to the substrates 23a, 23b using a plurality of through holes 38 provided in the plate surface of each substrate 23a, 23b. That is,
For connection, connect the signal line 19... to the through hole 3 of the board 23b.
8... into the through hole 38 of the board 23a, and insert the SID into the same through hole 38 of the board 23a.
16 input/output terminals 16a are inserted into the board 2.
The through hole 38 of 3a is filled with solder 39 to connect the two, and furthermore, the signal line 19 protruding from the board 23a or the board 23b can be connected to the board 23a together with the input/output terminal 16a by the solder 39. In addition, the SID 16 is connected directly to the signal line 19 or via an amplifier circuit 22. And the SID of the objective section configured in this way
The shield pipe 18 is externally fitted around the frame 29 and the pipe stopper 34 which is the electrical system, and the end of the pipe is attached to the SID frame 29 and the pipe stopper 3 with conductive adhesive.
4 to form the entire imaging device 17. Note that 40a is a shield pipe cover made of an insulating tube that covers the SID frame 29, the shield pipe 18, and the protective tube 36.
そして、この撮像装置１７が先端構成部１内に
形成された収容空間４０に、カバーレンズ２５が
先端カバー１ａの先端側に臨むように抜け止めピ
ン４１で固定され、先端カバー１ａの前方が像を
捕捉することができるようにしている。なお、４
２はレンズ枠カバー２８とレンズ枠２７との間を
シールドするＯリングで、このＯリング４２によ
つて先端構成部１の内部を気密にしている。 The imaging device 17 is fixed in a housing space 40 formed in the distal end component 1 with a retaining pin 41 such that the cover lens 25 faces the distal end side of the distal end cover 1a, and the front of the distal end cover 1a is an image. It is possible to capture the In addition, 4
Reference numeral 2 denotes an O-ring that shields between the lens frame cover 28 and the lens frame 27, and this O-ring 42 makes the inside of the distal end component 1 airtight.
以上説明したように、この発明によれば、入出
力端子および信号線を基板に設けた同一の透孔に
挿入し、これらを基板に電気的に接続することに
より、狭いスペースでの接続が可能となり、基板
および装置全体の小型化を図ることができるとい
う効果を奏する。
As explained above, according to the present invention, the input/output terminals and signal lines are inserted into the same through hole provided on the board and electrically connected to the board, making it possible to connect in a narrow space. Therefore, it is possible to reduce the size of the board and the entire device.
第１図はこの発明の第１の実施例を示す先端構
成部の縦断側面図である。
１６……SID（固体撮像素子）、１６ａ……入出
力端子、１７……撮像装置、１９……信号線、２
３ａ……基板、３８……透孔。
FIG. 1 is a longitudinal cross-sectional side view of a distal end component showing a first embodiment of the present invention. 16...SID (solid-state image sensor), 16a...input/output terminal, 17...imaging device, 19...signal line, 2
3a...Substrate, 38...Through hole.
Claims (1)
この固体撮像素子への入出力回路を搭載した基板
と、前記固体撮像素子と基板に電気的に接続され
る信号線とからなる撮像装置において、前記基板
に少なくとも１つの透孔を設け、この透孔に前記
固体撮像素子の入出力端子と信号線の導体ともど
も前記基板に挿入して電気的に接続したことを特
徴とする撮像装置。1. A solid-state image sensor having a signal input/output terminal,
In an imaging device comprising a substrate mounting an input/output circuit to the solid-state image sensor, and a signal line electrically connected to the solid-state image sensor and the substrate, at least one through hole is provided in the substrate, and the through hole is provided in the substrate. An imaging device characterized in that an input/output terminal of the solid-state imaging device and a conductor of a signal line are inserted into the substrate into the hole and electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62306894A JPS63177833A (en) | 1987-12-04 | 1987-12-04 | Image pickup apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62306894A JPS63177833A (en) | 1987-12-04 | 1987-12-04 | Image pickup apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63177833A JPS63177833A (en) | 1988-07-22 |
| JPH0438418B2 true JPH0438418B2 (en) | 1992-06-24 |
Family
ID=17962538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62306894A Granted JPS63177833A (en) | 1987-12-04 | 1987-12-04 | Image pickup apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63177833A (en) |
-
1987
- 1987-12-04 JP JP62306894A patent/JPS63177833A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63177833A (en) | 1988-07-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |