JPH0440533U - - Google Patents
Info
- Publication number
- JPH0440533U JPH0440533U JP8217490U JP8217490U JPH0440533U JP H0440533 U JPH0440533 U JP H0440533U JP 8217490 U JP8217490 U JP 8217490U JP 8217490 U JP8217490 U JP 8217490U JP H0440533 U JPH0440533 U JP H0440533U
- Authority
- JP
- Japan
- Prior art keywords
- case
- robot body
- belt
- belt support
- dust
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000003028 elevating effect Effects 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 description 1
Description
第１図は本考案に係る半導体製造装置の一実施
例を示し、その要部を断面した正面図である。第
２図は第１図の要部を断面した側面図である。第
３図は第１図の矢視Ａ−Ａ方向拡大断面図である
。第４図は本考案に係る防塵ベルトの一端及び他
端が固定した状態を示す斜視図である。第５図は
本考案に係るロボツト体及びその周辺構造を示す
斜視図である。
１……ケース、１ａ……ケースの上蓋部、２…
…ロボツト体、４……レール、９……キヤリヤケ
ース、１０……ベルト支持ローラ、１１……防塵
ベルト、１２……リンク機構、１３……ベルト受
支持ローラ、１５……防塵バンド。
FIG. 1 shows an embodiment of a semiconductor manufacturing apparatus according to the present invention, and is a front view of a main part thereof in section. FIG. 2 is a cross-sectional side view of the main part of FIG. 1. FIG. 3 is an enlarged sectional view in the direction of arrow A-A in FIG. 1. FIG. 4 is a perspective view showing a state in which one end and the other end of the dustproof belt according to the present invention are fixed. FIG. 5 is a perspective view showing the robot body and its peripheral structure according to the present invention. 1...Case, 1a...Top lid of case, 2...
... Robot body, 4 ... Rail, 9 ... Carrier case, 10 ... Belt support roller, 11 ... Dustproof belt, 12 ... Link mechanism, 13 ... Belt receiver support roller, 15 ... Dustproof band.
Claims (1)
半導体の生成処理を司どる昇降パイプを備えたロ
ボツト体と、該ロボツト体の左右に配置した伸縮
自在のリンク機構とでなる半導体製造装置におい
て、該リンク機構の上部に一連のベルト受支持ロ
ーラ若しくはベルト支持ローラを配し、防塵ベル
トを該ベルト受支持ローラ及び該ロボツト体の両
側面並びに底面に一連に敷設し、該防塵ベルトと
ケース上部開口縁との隙間を閉塞すべく防塵バン
ドをケースの上蓋部に覆設したことを特徴とする
半導体製造装置の防塵構造。 In a semiconductor manufacturing device comprising a robot body equipped with an elevating pipe that slides on a rail provided at the bottom of a case and controls semiconductor production processing, and a telescopic link mechanism disposed on the left and right sides of the robot body. A series of belt support rollers or belt support rollers are disposed on the upper part of the link mechanism, and a dustproof belt is laid in series on both sides and bottom of the belt support roller and the robot body, and the dustproof belt and the upper part of the case are connected to each other. A dust-proof structure for semiconductor manufacturing equipment, characterized in that a dust-proof band is placed over the top cover of the case to close the gap with the opening edge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8217490U JP2531292Y2 (en) | 1990-08-03 | 1990-08-03 | Dustproof structure of semiconductor manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8217490U JP2531292Y2 (en) | 1990-08-03 | 1990-08-03 | Dustproof structure of semiconductor manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0440533U true JPH0440533U (en) | 1992-04-07 |
| JP2531292Y2 JP2531292Y2 (en) | 1997-04-02 |
Family
ID=31628747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8217490U Expired - Fee Related JP2531292Y2 (en) | 1990-08-03 | 1990-08-03 | Dustproof structure of semiconductor manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2531292Y2 (en) |
-
1990
- 1990-08-03 JP JP8217490U patent/JP2531292Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2531292Y2 (en) | 1997-04-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |