JPH0440559U - - Google Patents
Info
- Publication number
- JPH0440559U JPH0440559U JP8270190U JP8270190U JPH0440559U JP H0440559 U JPH0440559 U JP H0440559U JP 8270190 U JP8270190 U JP 8270190U JP 8270190 U JP8270190 U JP 8270190U JP H0440559 U JPH0440559 U JP H0440559U
- Authority
- JP
- Japan
- Prior art keywords
- board body
- printed circuit
- insulating layer
- circuit board
- conductive pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011810 insulating material Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 2
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案によるプリント基板の一実施例
の製造工程を順次に示す概略断面図、第２図は従
来のプリント基板の一例の製造工程を順次に示す
概略断面図である。
１０……プリント基板、１１……基板本体、１
２……第一の導電パターン、１３……第一の絶縁
層、１４……第二の導電パターン、１５……第二
の絶縁層、１６……表示。
FIG. 1 is a schematic cross-sectional view sequentially showing the manufacturing process of an embodiment of a printed circuit board according to the present invention, and FIG. 2 is a schematic cross-sectional view sequentially showing the manufacturing process of an example of a conventional printed circuit board. 10... Printed circuit board, 11... Board body, 1
2...First conductive pattern, 13...First insulating layer, 14...Second conductive pattern, 15...Second insulating layer, 16...Display.
Claims (1)
ターンを形成し、該基板本体表面に絶縁層を形成
することにより構成されたプリント基板において
、 該導電パターンを形成した後に、該絶縁層と、
各種情報を示す文字、パターン等の形状と有する
表示とが、同時に同一の絶縁材料により該基板本
体表面に形成されることを特徴とするプリント基
板。[Claims for Utility Model Registration] In a printed circuit board constructed by forming a conductive pattern in a predetermined pattern shape on the surface of a board body and forming an insulating layer on the surface of the board body, after the conductive pattern is formed. , the insulating layer;
1. A printed circuit board characterized in that shapes of characters, patterns, etc. indicating various information and indications thereof are simultaneously formed on the surface of the board body using the same insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990082701U JP2524161Y2 (en) | 1990-08-03 | 1990-08-03 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990082701U JP2524161Y2 (en) | 1990-08-03 | 1990-08-03 | Printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0440559U true JPH0440559U (en) | 1992-04-07 |
| JP2524161Y2 JP2524161Y2 (en) | 1997-01-29 |
Family
ID=31629747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990082701U Expired - Lifetime JP2524161Y2 (en) | 1990-08-03 | 1990-08-03 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2524161Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH029473U (en) * | 1988-06-30 | 1990-01-22 |
-
1990
- 1990-08-03 JP JP1990082701U patent/JP2524161Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH029473U (en) * | 1988-06-30 | 1990-01-22 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2524161Y2 (en) | 1997-01-29 |
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