JPH0440855B2 - - Google Patents
Info
- Publication number
- JPH0440855B2 JPH0440855B2 JP2242185A JP2242185A JPH0440855B2 JP H0440855 B2 JPH0440855 B2 JP H0440855B2 JP 2242185 A JP2242185 A JP 2242185A JP 2242185 A JP2242185 A JP 2242185A JP H0440855 B2 JPH0440855 B2 JP H0440855B2
- Authority
- JP
- Japan
- Prior art keywords
- fuse
- solid electrolytic
- electrolytic capacitor
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 17
- 239000007787 solid Substances 0.000 claims description 14
- 239000012212 insulator Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 4
- 239000013013 elastic material Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Fuses (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はヒユーズ付き固体電解コンデンサに関
し、特にヒユーズを固体電解コンデンサに内蔵さ
せた構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a solid electrolytic capacitor with a fuse, and particularly to a structure in which a fuse is built into the solid electrolytic capacitor.
一般に固体電解コンデンサは種々の電子回路に
使用されており、故障率は小さいが、万一故障が
起きた場合の故障モードは短絡故障が多く、大き
な短絡電流が流れると、コンデンサ素子が発熱し
焼損に至ることもある。この過度の短絡電流によ
る故障発生の際には、回路構成素子を保護するた
め、故障モードを短絡（シヨート）から開放（オ
ープン）にすることが必要であり一般にヒユーズ
を用いる手段が知られている。従来技術としては
例えば、特公昭58−21816号公報のようにヒユー
ズを内蔵させた固体電解コンデンサがある。
Generally, solid electrolytic capacitors are used in various electronic circuits, and their failure rate is low, but in the event that a failure occurs, the failure mode is often short-circuit failure, and when a large short-circuit current flows, the capacitor element heats up and burns out. It may even lead to. When a failure occurs due to this excessive short-circuit current, it is necessary to change the failure mode from short to open in order to protect the circuit components, and a commonly known method is to use a fuse. . As an example of the prior art, there is a solid electrolytic capacitor with a built-in fuse as disclosed in Japanese Patent Publication No. 58-21816.
上述した従来のヒユーズ付き固体電解コンデン
サは第４図に示すようにコンデンサ素子１と陰極
外部端子４との間に金属板１０とヒユーズ７とを
接続している。
The conventional solid electrolytic capacitor with a fuse described above has a metal plate 10 and a fuse 7 connected between the capacitor element 1 and the cathode external terminal 4, as shown in FIG.
(イ) そのためコンデンサ素子１と陰極外部端子４
間の接続は三箇所となり、多大な接続工数を要
し、かつ接続面積が小さくなるため接続の信頼
性にも問題がある。(a) Therefore, capacitor element 1 and cathode external terminal 4
There are three connections between the two, which requires a large amount of connection work, and the connection area is small, so there is a problem with the reliability of the connection.
(ロ) またヒユーズ７は対向配設した断熱体１１間
の空洞部１２に位置し、かつ断熱体１１を陰極
外部端子４および金属板１０とで挟んではんだ
付けして気密状態を保持しているが、はんだ付
けの際のはんだの垂れ込み等により空洞部１２
がはんだで埋まつたり、はんだ量の不足により
気密性が得られず、後工程の樹脂外装の際に外
装樹脂９が入り込む、などの欠点がある。(b) The fuse 7 is located in the cavity 12 between the heat insulators 11 disposed facing each other, and the heat insulator 11 is sandwiched between the cathode external terminal 4 and the metal plate 10 and soldered to maintain an airtight state. However, due to solder dripping during soldering, etc., the cavity 12
There are drawbacks such as the solder being buried in the solder, airtightness not being achieved due to insufficient amount of solder, and the exterior resin 9 entering the resin exterior during the subsequent process.
本発明のヒユーズ付き固体電解コンデンサは、
絶縁板の片面に帯状の絶縁体部を中間に配して対
向配設した導電体層と、前記絶縁体部の中央に設
けた凹部を横断し、かつ導電体層間を橋絡接続す
るヒユーズと、ヒユーズを絶縁性を有する弾性体
で被着させた印刷配線板を固体電解コンデンサの
素子と外部端子との間に介挿接続させ、絶縁外装
したことを特徴とする。
The solid electrolytic capacitor with a fuse of the present invention is
conductor layers disposed on one side of an insulating plate to face each other with a band-shaped insulator section in the middle; and a fuse that traverses a recess provided in the center of the insulator section and connects the conductor layers by bridging. , a printed wiring board on which a fuse is covered with an insulating elastic material is inserted and connected between an element of a solid electrolytic capacitor and an external terminal, and an insulating exterior is provided.
以下、本発明について図面を参照して説明す
る。
Hereinafter, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の側断面図である。
例えばタンタルなどの弁作用金属の陽極体を陽極
酸化し、その上に二酸化マンガン層、カーボン
層、銀ペースト層を順次被着させ、最外層に陰極
部を有する固体電解コンデンサ素子（以後素子と
略称）１を形成する。この素子１に植立された陽
極リード２と直板状の陽極外部端子３を溶接等の
手段により接続する。次に直板状の陰極外部端子
４の端部と後述するヒユーズ内蔵した印刷配線板
５の端部をはんだ付け等により接続した後、印刷
配線板５と素子１の陰極部の一側面をはんだ付け
等により接続し、その後トランスフアモールド等
の手段によりエポキシ樹脂等の外装樹脂９で絶縁
外装し陽・陰極外部端子３，４を断面Ｌ字状に折
り曲げて成形し、ヒユーズ付き固体電解コンデン
サを形成する。 FIG. 1 is a side sectional view of one embodiment of the present invention.
For example, an anode body made of a valve metal such as tantalum is anodized, and a manganese dioxide layer, a carbon layer, and a silver paste layer are sequentially deposited thereon to form a solid electrolytic capacitor element (hereinafter abbreviated as element), which has a cathode part in the outermost layer. ) form 1. The anode lead 2 planted on this element 1 and the straight plate-shaped anode external terminal 3 are connected by means such as welding. Next, the end of the straight plate-shaped cathode external terminal 4 and the end of a printed wiring board 5 with a built-in fuse (described later) are connected by soldering or the like, and then one side of the printed wiring board 5 and the cathode part of the element 1 is soldered. After that, the external terminals 3 and 4 of the anode and cathode are bent and molded into an L-shaped cross section, and a solid electrolytic capacitor with a fuse is formed. do.
第２図、第３図は前述第１図のヒユーズを内蔵
した印刷配線板５と陰極外部端子４の構造および
製造工程を説明する斜視図である。 FIGS. 2 and 3 are perspective views illustrating the structure and manufacturing process of the printed wiring board 5 with built-in fuses and the cathode external terminal 4 shown in FIG. 1.
第２図に示す如く片面銅張りのガラス−エポキ
シ材などからなる長方形状の絶縁板をエツチング
加工して〓形の段差状の銅箔除去パターン５ａを
もつ印刷配線板５を形成した後、ドリル等の穿孔
具により印刷配線板５の銅箔除去パターン５ａの
ほぼ中央部にたとえば円形、正方形の凹部６を設
ける。次に印刷配線板５上の２分割された銅箔部
５ｂ，５ｃとたとえばクラツドによりパラジウム
で外周面を覆つたアルミニウム細線からなるヒユ
ーズ７を凹部６の上を跨ぐように横断させて、は
んだ付けなどの手段により接続する。次に第３図
に示す如くシリコン樹脂等の弾性を有する絶縁性
樹脂８（以後、弾性樹脂と称す）で凹部６内を充
填し、かつ凹部６上に橋絡したヒユーズ７を覆う
ように被着させた後乾燥する。次にこのヒユーズ
７を付設した印刷配線板５を前述の如く陰極外部
端子４に接続する。 As shown in FIG. 2, a rectangular insulating plate made of glass-epoxy material coated with copper on one side is etched to form a printed wiring board 5 having a step-shaped copper foil removal pattern 5a. For example, a circular or square recess 6 is formed approximately in the center of the copper foil removal pattern 5a of the printed wiring board 5 using a punching tool such as the above. Next, a fuse 7 made of a fine aluminum wire whose outer circumferential surface is covered with palladium by cladding the two divided copper foil parts 5b and 5c on the printed wiring board 5 is passed across the recess 6 and soldered. Connect by other means. Next, as shown in FIG. 3, the inside of the recess 6 is filled with an elastic insulating resin 8 such as silicone resin (hereinafter referred to as elastic resin), and the fuse 7 bridged over the recess 6 is covered. Dry after wearing. Next, the printed wiring board 5 provided with the fuse 7 is connected to the cathode external terminal 4 as described above.
この弾性樹脂８はヒユーズ７に過電流が流れ発
熱する際の周囲への熱放散を防ぎ、かつ後工程の
モールド外装工程における外装樹脂９注入時の衝
撃からヒユーズ７を保護する。またヒユーズの溶
断の際には、従来の弾性の低い樹脂でヒユーズが
覆われている場合には、ヒユーズが溶けても周囲
が硬いためヒユーズの原型を保ち電気的な接続を
保持し続けるので溶断しない欠点があつた。 This elastic resin 8 prevents heat dissipation to the surroundings when an overcurrent flows through the fuse 7 and generates heat, and also protects the fuse 7 from impact when the exterior resin 9 is injected in the subsequent mold exterior process. In addition, when blowing a fuse, if the fuse is covered with a conventional resin with low elasticity, even if the fuse melts, the surrounding area is hard, so the original shape of the fuse is maintained and the electrical connection is maintained. There was a drawback to not doing so.
一方、本発明では柔軟性のある弾性樹脂でヒユ
ーズの周囲が覆われているので、ヒユーズが溶け
るとヒユーズ自体の表面張力によりヒユーズは球
状に溶断して電気的な接続が分断される。従つて
弾性樹脂８にはヒユーズの働きを妨害しない役割
を要する。 On the other hand, in the present invention, since the fuse is surrounded by a flexible elastic resin, when the fuse melts, the fuse blows into a spherical shape due to the surface tension of the fuse itself, and the electrical connection is severed. Therefore, the elastic resin 8 is required to have a role that does not interfere with the function of the fuse.
なお、本発明ではヒユーズ７と印刷配線板５と
の接続手段としてはんだ付けを用いたが、溶接、
ワイヤーボンデイング等の手段でもよい。また弾
性樹脂８は凹部６への充填が完全でなくても、ヒ
ユーズ７を完全に被覆していればよい。 In the present invention, soldering is used as a means of connecting the fuse 7 and the printed wiring board 5, but welding,
Means such as wire bonding may also be used. Further, even if the recess 6 is not completely filled with the elastic resin 8, it is sufficient that the fuse 7 is completely covered.
以上説明したように本発明により次の効果があ
る。
As explained above, the present invention has the following effects.
（） 接続工数が低減され、かつ接続部の面積
が広くなり接続の信頼性が向上する。() Connection man-hours are reduced, and the area of the connection portion is increased, improving connection reliability.
（） ヒユーズを溶断の妨害とならない弾性樹
脂で覆うことができるので外装樹脂からの保護
が容易となる。() Since the fuse can be covered with an elastic resin that does not interfere with blowing, it is easy to protect it from the exterior resin.
第１図は本発明のヒユーズ付き固体電解コンデ
ンサの側断面図。第２図および第３図は第１図本
発明主要部のヒユーズ付き印刷配線板の斜視図で
ある。第４図は従来のヒユーズ付き固体電解コン
デンサの側断面図である。
１……（固体電解コンデンサ）素子、２……陽
極体リード、３……陽極外部端子、４……陰極外
部端子、５……印刷配線板、６……凹部、７……
ヒユーズ、８……弾性樹脂、９……外装樹脂、１
０……金属板、１１……断熱体、１２……空洞
部。
FIG. 1 is a side sectional view of a solid electrolytic capacitor with a fuse according to the present invention. 2 and 3 are perspective views of the fuse-equipped printed wiring board of FIG. 1, which is the main part of the present invention. FIG. 4 is a side sectional view of a conventional solid electrolytic capacitor with a fuse. DESCRIPTION OF SYMBOLS 1... (Solid electrolytic capacitor) element, 2... Anode body lead, 3... Anode external terminal, 4... Cathode external terminal, 5... Printed wiring board, 6... Recess, 7...
Fuse, 8...Elastic resin, 9...Exterior resin, 1
0...Metal plate, 11...Insulator, 12...Cavity part.
Claims (1)
て対向配設した導電体層と、前記絶縁体部の中央
に設けた凹部を横断し、かつ前記導電体層間を橋
絡接続するヒユーズと、前記ヒユーズを絶縁性を
有する弾性体で被着させた印刷配線板を固体電解
コンデンサの素子と外部端子との間に介挿接続さ
せ絶縁外装したことを特徴とするヒユーズ付き固
体電解コンデンサ。1 Conductor layers arranged opposite to each other on one side of an insulating plate with a band-shaped insulator section arranged in the middle, and a concave portion provided at the center of the insulator section, and a bridge connection between the conductor layers. A solid electrolytic capacitor with a fuse, characterized in that a fuse and a printed wiring board on which the fuse is covered with an insulating elastic material are inserted and connected between an element of the solid electrolytic capacitor and an external terminal, and an insulating exterior is provided. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2242185A JPS61181120A (en) | 1985-02-07 | 1985-02-07 | Solid electrolytic capacitor with fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2242185A JPS61181120A (en) | 1985-02-07 | 1985-02-07 | Solid electrolytic capacitor with fuse |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61181120A JPS61181120A (en) | 1986-08-13 |
| JPH0440855B2 true JPH0440855B2 (en) | 1992-07-06 |
Family
ID=12082210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2242185A Granted JPS61181120A (en) | 1985-02-07 | 1985-02-07 | Solid electrolytic capacitor with fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61181120A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6384010A (en) * | 1986-09-26 | 1988-04-14 | 日本電気株式会社 | Chip-type solid electrolytic capacitor with fuse |
| JPS6422019A (en) * | 1987-07-17 | 1989-01-25 | Nec Corp | Solid electrolytic capacitor |
| JP2850330B2 (en) * | 1987-08-31 | 1999-01-27 | 日本電気株式会社 | Chip-shaped solid electrolytic capacitor with fuse and method of manufacturing the same |
| JPH01103163A (en) * | 1987-10-15 | 1989-04-20 | Toshiba Corp | Semiconductor rectifier |
-
1985
- 1985-02-07 JP JP2242185A patent/JPS61181120A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61181120A (en) | 1986-08-13 |
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