JPH0444411B2 - - Google Patents

Info

Publication number
JPH0444411B2
JPH0444411B2 JP2242085A JP2242085A JPH0444411B2 JP H0444411 B2 JPH0444411 B2 JP H0444411B2 JP 2242085 A JP2242085 A JP 2242085A JP 2242085 A JP2242085 A JP 2242085A JP H0444411 B2 JPH0444411 B2 JP H0444411B2
Authority
JP
Japan
Prior art keywords
fuse
solid electrolytic
electrolytic capacitor
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2242085A
Other languages
Japanese (ja)
Other versions
JPS61181119A (en
Inventor
Yoshinobu Kawakami
Kenji Mochizuki
Koichi Morimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP2242085A priority Critical patent/JPS61181119A/en
Publication of JPS61181119A publication Critical patent/JPS61181119A/en
Publication of JPH0444411B2 publication Critical patent/JPH0444411B2/ja
Granted legal-status Critical Current

Links

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  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Fuses (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はヒユーズ付き固体電解コンデンに関
し、特にヒユーズを固体電解コンデンサに内蔵さ
せた構造に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a solid electrolytic capacitor with a fuse, and particularly to a structure in which a fuse is built into the solid electrolytic capacitor.

〔従来の技術〕[Conventional technology]

一般に固体電解コンデンサは種々の電子回路に
使用されており、故障率は小さいが、万一故障が
起きた場合の故障モードは短絡故障が多く、大き
な短絡電流が流れると、コンデンサ素子が発熱し
焼損に至ることもある。この過度の短絡電流によ
る故障発生の際には、回路構成素子を保護するた
め、故障モードを短絡(シヨート)から開放(オ
ープン)にすることが必要であり、一般にヒユー
ズを用いる手段が知られている。従来技術として
は、例えば、特公昭58−21816号公報のようにヒ
ユーズを内蔵させた固体電解コンデンがある。
Generally, solid electrolytic capacitors are used in various electronic circuits, and their failure rate is low, but in the event of a failure, the failure mode is often short-circuit failure, and when a large short-circuit current flows, the capacitor element heats up and burns out. It may even lead to. When a failure occurs due to this excessive short-circuit current, it is necessary to change the failure mode from short circuit to open in order to protect the circuit components. There is. As a conventional technique, for example, there is a solid electrolytic capacitor with a built-in fuse as disclosed in Japanese Patent Publication No. 58-21816.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上述した従来のヒユーズ付き固体電解コンデン
サは第4図に示すようにコンデンサ素子1と陰極
外部端子4との間に金属板10とヒユーズ7とを
接続している。
The conventional solid electrolytic capacitor with a fuse described above has a metal plate 10 and a fuse 7 connected between the capacitor element 1 and the cathode external terminal 4, as shown in FIG.

(イ) そのためコンデンサ素子1と陰極外部端子4
間の接続は三個所となり、多大な接続工数を要
し、かつ接続面積が小さくなるため接続の信頼
性にも問題がある。
(b) Therefore, capacitor element 1 and cathode external terminal 4
There are three connections between the two, which requires a large amount of connection work, and the connection area is small, which poses a problem in connection reliability.

(ロ) またヒユーズ7は対向配設した断熱体11間
の空洞部12に位置し、かつ断野体11を陰極
外部端子4および金属板10とで狭んではんだ
付けし気密状態を保持しているが、はんだ付け
の際のはんだの垂れ込み等により空洞部12が
はんだで埋まつたり、はんだ量の不足により気
密性が得られず、後工程の樹脂外装の際に外装
樹脂9が入り込む、などの欠点がある。
(b) The fuse 7 is located in the cavity 12 between the heat insulators 11 disposed facing each other, and the insulation body 11 is sandwiched between the cathode external terminal 4 and the metal plate 10 and soldered to maintain an airtight state. However, the cavity 12 may be filled with solder due to solder dripping during soldering, or airtightness cannot be achieved due to insufficient amount of solder, and the exterior resin 9 may enter during the resin exterior process in the subsequent process. There are drawbacks such as.

〔問題点を解決するための手段〕[Means for solving problems]

本発明のヒユーズ付き固体電解コンデンサは、
絶縁板の片面に帯状の絶縁体部を中間に配して対
向配設した導電体層と、絶縁体部中央に設けた凹
部を横断し、かつ導電体層間を橋絡接続するヒユ
ーズと、上記ヒユーズと接触する面にヒユーズを
収納する凹部を有する絶縁板を接着した印刷配線
板を固体電解コンデンサの素子の外部端子との間
に介挿接続させ、絶縁外装したことを特徴とす
る。
The solid electrolytic capacitor with a fuse of the present invention is
A conductor layer disposed facing each other on one side of an insulating plate with a band-shaped insulator section in the middle, a fuse that traverses a recess provided in the center of the insulator section and bridges and connects the conductor layers; The present invention is characterized in that a printed wiring board to which an insulating plate having a concave portion for accommodating the fuse is bonded to the surface in contact with the fuse is inserted and connected between the external terminal of the solid electrolytic capacitor element, and an insulating exterior is formed.

〔実施例〕〔Example〕

以下、本発明について図面に参照して説明す
る。第1図は本発明の一実施例の側断面図であ
る。例えばタンタルなどの弁作用金属の陽極体を
陽極酸化し、その上に二酸化マンガン層カーボン
層、銀ベースト層を順次被着させ、最外層に陰極
部を有する固体電解コンデンサ素子(以後素子と
略称)1を形成する。この素子1に植立された陽
極リード2と陽極外部端子3を溶接等の手段によ
り接続する。次に陰極外部端子4の端部と後述す
るヒユーズを内蔵した印刷配線板5の端部をはん
だ付け等により接続した後、印刷配線板5と素子
1の陰極部の一側面をはんだ付け等により接続
し、その後トランスフアモールド等の手段により
エポキシ等の外装樹脂9で絶縁外装し、陽・陰極
外部端子3,4をそれぞれ折り曲げて断面し字状
に成形し、ヒユーズ付き固体電解コンデンサを形
成する。
Hereinafter, the present invention will be explained with reference to the drawings. FIG. 1 is a side sectional view of one embodiment of the present invention. For example, a solid electrolytic capacitor element (hereinafter abbreviated as element) has a cathode part as the outermost layer, by anodizing an anode body made of a valve metal such as tantalum, and sequentially depositing a manganese dioxide layer, a carbon layer, and a silver base layer thereon. Form 1. The anode lead 2 planted on this element 1 and the anode external terminal 3 are connected by means such as welding. Next, the end of the cathode external terminal 4 and the end of the printed wiring board 5 containing a built-in fuse (described later) are connected by soldering or the like, and then the printed wiring board 5 and one side of the cathode of the element 1 are connected by soldering or the like. After that, the capacitors are insulated and coated with a sheathing resin 9 such as epoxy by transfer molding or the like, and the anode and cathode external terminals 3 and 4 are bent and formed into a cross-sectional shape to form a solid electrolytic capacitor with a fuse. .

第2図、第3図は前述第1図のヒユーズを内蔵
した印刷配線板5と陰極外部端子4の構造および
製造工程を説明する斜視図である。
FIGS. 2 and 3 are perspective views illustrating the structure and manufacturing process of the printed wiring board 5 with built-in fuses and the cathode external terminal 4 shown in FIG. 1.

第2図に示す如く片面銅張りのガラスーエポキ
シ材などからなる長方形状の絶縁板をエツチング
加工して〓形の段差状の銅箔徐去パターン5aを
もつ印刷配設板5を形成した後、ドリル等の穿孔
により印刷配線板5の銅箔除去パターン5aのほ
ぼ中央部に円形または正方形の凹部6を設ける。
次に印刷配線板5上の上下に二分割された銅箔部
にはんだめつきなどの手段によりはんだを被着し
て導体層5b,5cを形成する。次にたとえばク
ラツドによりパラジウムで外周面を覆つたアルミ
ニウム細線からなるヒユーズ7を凹部6を上を跨
ぐように横断させて導体層5b,5cとはんだ付
けなどにより接続する。次に中央部に印刷配線板
5の凹部6より広い面積の凹部8aを設けたエポ
キシ樹脂などからなる絶縁板8を接着材にて印刷
配線板5の凹部8a内にヒユーズ7が収納され密
封するように取付ける。次に第3図に示す如く絶
縁板8を取り付けた印刷配線板5を前述の如く陰
極外部端子4に接続する。
As shown in FIG. 2, a rectangular insulating plate made of glass-epoxy material coated with copper on one side is etched to form a printing arrangement board 5 having a step-shaped copper foil removal pattern 5a. A circular or square recess 6 is provided approximately in the center of the copper foil removal pattern 5a of the printed wiring board 5 by drilling with a drill or the like.
Next, solder is applied to the upper and lower copper foil portions of the printed wiring board 5 by means of soldering or the like to form conductor layers 5b and 5c. Next, a fuse 7 made of a fine aluminum wire whose outer circumferential surface is covered with palladium, for example, by a cladding is made to cross over the recess 6 and connected to the conductor layers 5b and 5c by soldering or the like. Next, an insulating plate 8 made of epoxy resin or the like is provided with a recess 8a having a larger area than the recess 6 of the printed wiring board 5 in the center, and the fuse 7 is housed in the recess 8a of the printed wiring board 5 using an adhesive and sealed. Install it as shown. Next, as shown in FIG. 3, the printed wiring board 5 with the insulating plate 8 attached thereto is connected to the cathode external terminal 4 as described above.

この絶縁板8はヒユーズ7の周囲を空洞化して
密封し、ヒユーズ7に過電流が流れ発熱する際の
周囲への熱放散を防ぎ、かつ後工程のモールド外
装工程における外装樹脂9の注入時の衝撃からヒ
ユーズ7を保護する。絶縁板8の印刷配線板5へ
の接続はたとえばエポキシ樹脂などの絶縁性接着
材で行なうため多少量が多くなつても空洞化され
た凹部6,8aが全部埋まらなければよく、従来
手段のはんだで密封した際にはんだ量が多ければ
空洞12内がはんだて導通しでヒユーズの効果が
なくなり、一方はんだ量が少なければ密封されず
外装樹脂が浸入していたのに比べ本発明では接着
材の量の調整が容易になる。
This insulating plate 8 hollows out the area around the fuse 7 and seals it to prevent heat dissipation to the surrounding area when an overcurrent flows through the fuse 7 and generates heat, and also when injecting the exterior resin 9 in the mold exterior process in the later process. Protect fuse 7 from impact. Since the insulating board 8 is connected to the printed wiring board 5 using an insulating adhesive such as epoxy resin, it is sufficient that the hollow recesses 6 and 8a are not completely filled even if the amount of solder is increased to a certain extent, compared to the conventional method of soldering. When sealed with a large amount of solder, solder conduction occurs inside the cavity 12 and the effect of the fuse is lost.On the other hand, if there is a small amount of solder, the seal is not sealed and the exterior resin infiltrates.In contrast, in the present invention, the adhesive It becomes easier to adjust the amount.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明により次の効果があ
る。
As explained above, the present invention has the following effects.

() 接続工数が低減され、かつ接続部の面積が
広くなり接続の信頼性が向上する。
() Connection man-hours are reduced, the area of the connection part is increased, and connection reliability is improved.

() ヒユーズが絶縁板で覆つた気密状態中に確
実に設置できるので、ヒユーズの動作信頼性が
増し、外装樹脂からの保護が容易となる。
() Since the fuse can be reliably installed in an airtight state covered with an insulating plate, the operational reliability of the fuse is increased and it is easier to protect it from the exterior resin.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明のヒユーズ付き固体電解コンデ
ンサの側断面図、第2図、および第3図は第1図
本発明主要部のヒユーズつき印刷配線板の製造工
程を示す斜視図である。第4図は従来のヒユーズ
付き固体電解コンデンサの側断面図である。 1:(固体電解コンデンサ)素子、2:陽極体
リード、3:陽極外部端子、4:陰極外部端子、
5:印刷配線板、6:凹部、7:ヒユーズ、8:
絶縁板、9:外装樹脂、10:金属板、11:断
熱体、12:空洞部。
FIG. 1 is a sectional side view of a solid electrolytic capacitor with a fuse according to the present invention, and FIGS. 2 and 3 are perspective views showing the manufacturing process of the printed wiring board with a fuse, which is the main part of the present invention shown in FIG. FIG. 4 is a side sectional view of a conventional solid electrolytic capacitor with a fuse. 1: (solid electrolytic capacitor) element, 2: anode body lead, 3: anode external terminal, 4: cathode external terminal,
5: Printed wiring board, 6: Recess, 7: Fuse, 8:
Insulating plate, 9: Exterior resin, 10: Metal plate, 11: Heat insulator, 12: Cavity.

Claims (1)

【特許請求の範囲】[Claims] 1 絶縁板の片面に帯状の絶縁体部を中間に配し
て対向配設した導電体層と、前記絶縁体部中央に
設けた凹部を横断し、かつ前記導電体層間を橋絡
接続するヒユーズと、前記ヒユーズと接触する面
にヒユーズを収納する凹部を有する絶縁板を接着
した印刷配線板を固体電解コンデンサの素子と外
部端子との間に介挿接続させ絶縁外装したことを
特徴とするヒユーズ付き固体電解コンデンサ。
1. A conductive layer arranged on one side of an insulating plate to face each other with a band-shaped insulating section in the middle, and a fuse that crosses a recess provided in the center of the insulating section and connects the conductive layer by bridging. and a printed wiring board having an insulating plate bonded thereto having a concave portion for accommodating the fuse on the surface that contacts the fuse is inserted and connected between the element of the solid electrolytic capacitor and the external terminal, and an insulating exterior is provided. solid electrolytic capacitor.
JP2242085A 1985-02-07 1985-02-07 Solid electrolytic capacitor with fuse Granted JPS61181119A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2242085A JPS61181119A (en) 1985-02-07 1985-02-07 Solid electrolytic capacitor with fuse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2242085A JPS61181119A (en) 1985-02-07 1985-02-07 Solid electrolytic capacitor with fuse

Publications (2)

Publication Number Publication Date
JPS61181119A JPS61181119A (en) 1986-08-13
JPH0444411B2 true JPH0444411B2 (en) 1992-07-21

Family

ID=12082181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2242085A Granted JPS61181119A (en) 1985-02-07 1985-02-07 Solid electrolytic capacitor with fuse

Country Status (1)

Country Link
JP (1) JPS61181119A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0298619U (en) * 1989-01-24 1990-08-06
EP3179495B1 (en) * 2015-12-09 2018-05-02 ABB Schweiz AG Power capacitor unit for high pressure applications

Also Published As

Publication number Publication date
JPS61181119A (en) 1986-08-13

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