JPH0440873B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to semiconductor devices, and particularly to improvements in the package structure of semiconductor laser diode devices.

[Conventional technology]

FIG. 2 shows a schematic structure of a conventional semiconductor laser diode device of this type.

That is, in the conventional structure shown in FIG. 2, reference numeral 1 denotes a stem body made of Fe-Ni plated with Au for holding the device, and 2 denotes a Fe-Ni stem body fixed to the stem body 1 by glass welding or the like. 3 is a block body made of Ag or the like having good thermal conductivity, which is attached to the stem body 1 by soldering or the like, and 4 is this block body 3.
Submount such as Si, which is bonded with solder etc.
5 is a semiconductor laser diode chip bonded to the submount 4 with solder, 6 is a photodiode bonded to the stem body 1 with solder or conductive resin, and 7 is the lead 2 and the semiconductor laser diode chip 5. 8 is a cap body made of Kovar or the like which is fitted onto the stem body 1 so as to cover each part thereof, and 9 is a glass window provided in this cap body 8. .

However, in this conventional structure, the semiconductor laser diode chip 5 is biased in the forward direction by an external circuit (not shown) through the leads 2, and when the bias current exceeds the threshold current,
A laser beam is emitted and input into an external optical system (not shown) through a glass window 9, and then a photodiode 6
is biased in the opposite direction by an external circuit through lead 2, but when its surface is irradiated with laser light, its leakage current increases approximately in proportion to the amount of light, so the increase or decrease in this leakage current is detected. do,
By controlling the bias current of the semiconductor laser diode chip 5, the laser light output is maintained as constant as possible.

[Problem that the invention seeks to solve]

However, because conventional semiconductor laser diode devices are configured in this way, they generally have a very large number of parts, and some parts cannot be assembled automatically, resulting in high material costs and assembly processing costs. In addition, there is a problem that the overall size is inevitably increased, and it is not possible to obtain a compact and low-cost device configuration.

This invention was made to improve these problems in conventional semiconductor laser diode devices, and its purpose is to reduce the number of parts and provide a semiconductor laser diode device that is easy to assemble automatically. That's true.

[Means for solving problems]

In order to achieve the above object, in the present invention, a semiconductor laser diode chip and a photodiode are arranged on one lead so that their end faces are not parallel to each other, and the end faces of the semiconductor laser diode chip and the end face of this lead are parallel to each other. At the same time, each electrode of the semiconductor laser diode chip and photodiode is
A semiconductor laser diode chip and a photodiode are molded with a transparent synthetic resin body, each connected to other leads separately, and including a portion of each lead.

[Effect]

Therefore, in this invention, the number of required parts is extremely small, consisting of only the required number of leads, a semiconductor laser diode chip, a photodiode, and a transparent synthetic resin body for molding these, and the whole can be miniaturized. Each of them has an easy-to-handle form, which enables automatic assembly.

It can be done.

〔Example〕

Hereinafter, one embodiment of a semiconductor device according to the present invention will be described in detail with reference to FIG.

FIG. 1 is a perspective view showing the general structure of a semiconductor laser diode device to which an embodiment of the present invention is applied.

In FIG. 1, numerals 10, 11, and 12 are three leads each made of copper or the like having good thermal conductivity, and numeral 13 is on the end of one lead 10, and the end faces 10a, 13a of the lead 13 are on the end. Semiconductor laser diode chips are bonded with solder or the like so that they are not parallel to each other, and 14 is also connected to this lead 1.
0, semiconductor laser diode chip 1
3 is a photodiode whose end surfaces 13a and 14a are bonded with solder or the like so that they are not parallel to each other; 15;
are these semiconductor laser diode chips 13,
and thin metal wires connecting each electrode of the photodiode 14 and the other leads 11 and 12, and 16 includes a corresponding part of each of the leads 10, 11, and 12, and connects these semiconductor laser diode chips. 13, and photodiode 14
It is a transparent synthetic resin body molded to cover the entire body.

Therefore, in the structure of the embodiment shown in FIG. 1, the semiconductor laser diode chip 13 is biased forward in the forward direction by an external circuit (not shown) through the leads 10 and 11, and the bias current is equal to the threshold current. , the laser beam is emitted and input from the molded transparent synthetic resin body 16 to an external optical system (not shown), and the photodiode 14 is biased in the opposite direction by an external circuit through the leads 10 and 12. By detecting increases and decreases in the leakage current and controlling the bias current of the semiconductor laser diode chip 13, the laser light output is maintained as constant as possible.

That is, in the structure shown in FIG. 1, only the required number of component parts are required, in this case three leads 10, 11, 12, a semiconductor laser diode chip 13, and a photodiode 14.
Since there is only a transparent synthetic resin body 16 for molding these, the number of parts is extremely small compared to the conventional structure described above, and the entire device can be downsized, and each component can be easily handled individually. Because of this, automatic assembly using mechanical equipment can be achieved.

Further, the end face 13a of the semiconductor laser diode chip 13 and the end face 10 of the lead 10 bonded thereto.
Since it is configured so that a is not parallel to
It has great practical effects when applied to AV equipment. In other words, 3 for CD (compact disc)
When used in a beam-type optical pickup, the light emitted from the end face 13a of the semiconductor laser diode chip 13 is divided into three beams, with the center beam used for signal reading and the left and right beams used for tracking. The returned light of one of the tracking beams reaches the end face 10a of the lead 10 and is reflected. When this end surface 10a is parallel to the end surface 13a, the end surface 10a is parallel to the end surface 13a.
The reflected light a returns to the optical path of the laser beam and becomes noise, which upsets the balance of the tracking signal. However, when the end surface 10a is inclined with respect to the end surface 13a as in the present invention, the reflected light does not return to the optical path of the laser beam, and no noise is generated.

〔Effect of the invention〕

As detailed above, according to the present invention, a semiconductor laser diode chip and a photodiode are mounted on one lead so that their end faces are not parallel to each other, and each electrode is connected to the other lead separately. Since the semiconductor laser diode chip and photodiode, including a portion of each of these leads, are molded with a transparent synthetic resin body, the required parts in the device structure are as follows.
The required number of leads, a semiconductor laser diode chip, a photodiode, and a transparent synthetic resin body for molding them are all that is needed, and as a result, the device structure can be configured with an extremely small number of parts, and each required part can be assembled individually. Since it is in a form that is easy to handle, on the one hand, the overall device structure can be easily miniaturized when compared to the conventional device structure, and on the other hand, automatic assembly using mechanical devices can be easily applied. As a result, the material cost and processing and assembly cost of the device structure itself can be significantly reduced, making it possible to provide the device at a low cost.In addition, from a functional standpoint, it is possible to improve the positional accuracy of the semiconductor laser diode chip and, ultimately, the laser oscillation source with respect to the lead. It has excellent features such as:

In addition, since the end face of the semiconductor laser diode chip and the end face of the leads to which it is bonded are not parallel to each other, it is extremely effective in increasing the S/N ratio, and is useful when applied to AV equipment. The above effect is great.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the general structure of a semiconductor laser diode device to which an embodiment of the present invention is applied, and FIG. 2 is a partially cutaway perspective view showing the general structure of the same semiconductor laser diode device according to the conventional example. be. 10, 11, 12... Lead, 10a... End face of lead, 13... Semiconductor laser diode chip, 13a... End face of chip, 14... Photodiode, 14a... End face of photodiode, 15
...Thin metal wire, 16...Transparent synthetic resin body.

Claims (1)

[Claims] 1. A semiconductor device including a semiconductor laser diode chip and a photodiode, which has at least three leads, and of each of these leads,
The semiconductor laser diode chip and the photodiode are mounted on one lead so that their end faces are not parallel to each other, and the end faces of the semiconductor laser diode chip and the end face of this lead are not parallel to each other. Each electrode of the laser diode chip and the photodiode is connected to another lead separately, and the semiconductor laser diode chip and the photodiode, including a part of each lead, are molded with transparent synthetic resin. semiconductor device.