JPH0440912Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a substrate shape correction device for correcting irregularities in shape of a substrate such as a printed circuit board, such as warping and twisting.

[Summary of the idea]

The present invention is a shape correction device for correcting irregularities in the shape of a substrate such as warping and twisting. In a substrate shape correction device configured to correct the shape of a substrate, the pressure plate also serves as a cooling plate, a lower pressure plate among the pressure plates is provided with a plurality of grooves, and the pressure plate is By providing a plurality of wire rods movably attached in the pressure direction and configuring the wire rods to be able to move in and out of the groove, various substrates can be brought into uniform contact with the pressure plate, and uniform pressure can be applied. This allows for good shape correction and facilitates transportation of the substrate.

[Conventional technology]

There are a variety of substrates used for various purposes, and when looking at printed circuit boards, for example, there are many different types, both in terms of materials and manufacturing methods. With such a wide variety of substrates, irregularities such as warpage and twisting often occur in the final product as a substrate due to the complexity of the materials and manufacturing processes. Since printed circuit boards and the like are assumed to be processed later in the form of flat plates, such irregularities in shape cause various problems.
For example, in recent years, automatic component insertion and automatic component mounting have rapidly become popular, but in this case, warping or twisting of the printed circuit board can cause errors in mounting components on the automatic line, poor insertion, poor transportation, board cracking, etc. is being caused. Therefore, the irregular shape of printed circuit boards is a major obstacle to process automation.

Conventionally, warping and twisting of printed circuit boards has been corrected manually or by using a leveler using rubber rolls, metal rolls, or the like. However, manual work is extremely disadvantageous in terms of time and effort, and goes against the call for line automation. On the other hand, in straightening using a leveler, the printed circuit board is sandwiched between rolls and the rolls are rotated to flatten the shape. However, it may not be applicable to substrates with various external shapes, so-called irregularly shaped substrates, and lacks versatility. In addition, if the printed circuit board is thin, it may break when it is sandwiched between rolls. Furthermore, there is a problem that uniform shape correction is difficult.

In order to solve this problem, the applicant has developed a general-purpose method that can correct irregularities such as warpage and twisting that occur on printed circuit boards, regardless of the thickness, shape, board division method, or material of the printed circuit board. It is highly versatile, has a degree of freedom in design, allows for higher density and higher efficiency, and can be expected to improve productivity.It also does not cause cracks or deformation after straightening, making it possible to achieve desired results. We proposed a shape correction device that can efficiently perform uniform correction (Japanese Patent Application No. 59-210551). This shape correction device, as shown in FIG.
It is pressurized and cooled by a cooler facing the
The printed circuit board 9 is placed on the lower cooling plate 12 via the uneven absorber 13, and the upper cooling plate 11 is lowered and pressurized to sandwich the printed circuit board 9 between the two cooling plates 11 and 12. By sandwiching in this manner, the heated printed circuit board 9 is cooled and its shape is corrected. Further, in this example, an uneven absorber 13 (made of felt, cloth, etc.) is placed on the lower cooling plate 12.
(paper, sponge, rubber, etc.) prevents the printed circuit board 9 from coming into contact with the lower cooling plate 12 first, and prevents the cooling state from becoming uneven.

[Problem that the invention attempts to solve]

However, in the above-mentioned example, uniformity is obtained by the unevenness absorber 13, but this unevenness absorber 13 must be replaced with an appropriate one due to differences in the thickness and material of the printed circuit board 9. However, it was inconvenient to use. In addition, the uneven absorber 13
Depending on the material, the edges of the printed circuit board 9 are likely to get caught, making it difficult to automatically convey the printed circuit board 9 within the cooler.

In view of these points, the present invention is a shape correction method that enables uniform cooling of any substrate and good shape correction without necessarily using an uneven absorber, and also makes it easier to transport the substrate. The purpose is to provide equipment.

[Means for solving problems]

In order to solve the above-mentioned problems, the printed circuit board shape correction device of the present invention includes a pair of pressure plates facing each other vertically, and corrects the shape of the board by sandwiching the board between the pair of pressure plates. In the substrate shape correction device configured to, the pressure plate also serves as a cooling plate, a lower pressure plate among the pressure plates is provided with a plurality of grooves, and a plurality of grooves are provided movably in the pressing direction of the pressure plate. A wire rod is provided so that the wire rod can move in and out of the groove.

The configuration of the present invention will be explained as follows using FIG. 1, which shows an embodiment of the present invention, which will be described in detail later. That is, as illustrated in FIG. 1, the present invention provides a pair of pressure plates 1 and 2 that face each other vertically,
The pressure plates 1 and 2 also serve as cooling plates, and the pressure plates 1 and 2 also serve as cooling plates.
A plurality of grooves 2a are provided in the lower pressure plate 2 of 2,
The plurality of grooves 2a are provided with wire rods 4 that are movable in the pressing direction of the pressure plates 1 and 2 (vertical direction in the figure) and can move in and out of the grooves 2a.

[Effect]

According to the present invention, by placing the substrate on the wire 4 with the wire 4 raised above the groove and moving it, the substrate can be easily transported, and the wire 4 can be moved into the groove. Pressure plates 1 and 2 in the housed state
By applying pressure, various substrates can be uniformly brought into contact with the pressure plate, and good shape correction can be achieved. Moreover, since the pressure plate of the present invention also serves as a cooling plate, the shape correction can be realized while achieving uniform cooling by shortening the contact between the pressure plates 1 and 2 and the substrate. Although not essential, it is also possible to use an uneven absorber as explained in FIG.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to FIGS. 1 to 5.

The shape correction device of this example has pressure plates 1 and 2 installed above and below, as shown in FIG. 1, and these pressure plates 1 and 2 also serve as a cooling mechanism. In the following description of this example, the upper pressure plate 1 that also serves as a cooling plate will be referred to as the upper cooling plate 1, and the lower pressure plate that also serves as the cooling plate will be referred to as the lower cooling plate 2.

That is, in this embodiment, the upper cooling plate 1 is provided directly above the fixed lower cooling plate 2 and is movable up and down by the lifting drive shaft 8. And lower cooling plate 2
A plurality of grooves, for example, five grooves 2a are provided in parallel on the surface, and five wire rods 4, for example, are stretched above each groove 2a. In this example, a wire is used as the wire material 4. The wire rods 4 are capable of supporting a board on which they are placed, and are therefore stretched at such intervals that the printed circuit board on which they are placed will not fall. This wire 4 is supported by a frame 3 surrounding the lower cooling plate 2. This frame 3 is held by a plurality of bearing housings 6 via springs 7. When the frame 3 is pushed from above, the spring 7 is compressed, the frame 3 moves downward, and the wire rods 4 are accommodated in the grooves 2a. Further, a plurality of pushers 5 are provided on the side surface of the upper cooling plate 1, and the pushers 5 come into contact with the frame 3 when the upper cooling plate 1 is lowered. Note that this pusher 5 protrudes somewhat below the cooling surface (lower surface) of the upper cooling plate 1. The cooling mechanism of the shape correction device of this example is configured as described above. Other parts such as the heating mechanism may be configured in the same manner as conventional ones.

Next, the correction operation by the shape correction device of this example will be explained with reference to FIGS. 2 to 5.

First, as shown in FIG. 2, the upper cooling plate 1 is raised, and the printed circuit board 9 to be straightened is placed on the wire 4. From this state, as shown in FIG. 3, the upper cooling plate 1 is lowered by the elevating drive shaft 8, and the pusher 5 is brought into contact with the frame 3. At this time, the printed circuit board 3 approaches the upper cooling plate 1 with an interval of several mm or less, and is on the verge of contacting the upper cooling plate 1. From this state, as shown in FIG. 4, the upper cooling plate 1 is further lowered and the pusher 5 pushes down the frame 3. Thereby, when the wire 4 becomes flush with the surface of the lower cooling plate 2, the printed circuit board 9 on the wire 4 comes into contact with the lower cooling plate 2. Further, when the upper cooling plate 1 is lowered and pushed down, the wire rod 4 is moved into the groove 2 as shown in FIG.
a, the printed circuit board 9 comes into contact with the upper cooling plate 1, and the printed circuit board 9 is cooled under pressure from both the upper and lower sides. After cooling, the upper cooling plate 1 is raised again to return to the state shown in FIG. 2, and the printed circuit board 9 is transported outside.

By cooling in this way,
Since the upper and lower cooling plates 1 and 2 come into contact with the printed circuit board 9 in an extremely short period of time, uniform cooling is achieved. That is, the fourth
Since the transition from the state shown in the figure to the state shown in FIG. 5 in which the upper cooling plate 1 is in contact with the upper cooling plate 1 occurs in almost no time, the upper and lower cooling plates 1 are in contact with the printed circuit board 9 at the same time, and a uniform cooling state is obtained. Warpage, twisting, etc. of the printed circuit board 9 are corrected.

Therefore, when the present invention is used, there is no need to provide an uneven absorber as in the conventional case, and there is no need to change the parts of the cooling device depending on the shape and thickness of the printed circuit board 9.

Furthermore, since the printed circuit board 9 can be placed on the wire 4, the sliding properties of the printed circuit board 9 are improved, and the printed circuit board 9 can be easily transported. For example, the correction device can be installed with an inclination, and after correction, the printed circuit board 9 can be automatically discharged to the outside by gravity.

Note that the illustrated example has a configuration in which the pressure plates are arranged vertically and the pressure direction is up and down, but it is also possible to arrange the pressure plates horizontally on the left and right, place the board vertically, and sandwich the board from the left and right. can. In addition, it goes without saying that the present invention is not limited to the above-described embodiments, and can take various configurations.

[Effect of idea]

According to the substrate shape correction device of the present invention, it is possible to uniformly cool substrates of various shapes and thicknesses without replacing parts, and it is possible to perform good shape correction and to place the substrate on a wire rod. This has the effect of making it easier to transport the substrate.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of the substrate shape correction device of the present invention, FIGS. 2 to 5 are explanatory diagrams of the operation of the example shown in FIG. 1, and FIG. 6 is an example of a conventional correction device. FIG. 1... Pressure plate (upper cooling plate), 2... Pressure plate (lower cooling plate), 2a... groove, 3... frame, 4... wire (wire), 5... pusher, 7... spring ,
9...Printed circuit board.

Claims (1)

[Claims for Utility Model Registration] A substrate shape correction device comprising a pair of pressure plates facing each other vertically and correcting the shape of the substrate by sandwiching the substrate between the pair of pressure plates, comprising: The pressure plate also serves as a cooling plate, and a plurality of grooves are provided in the lower pressure plate among the pressure plates, and a plurality of wire rods are provided movably attached in the pressing direction of the pressure plate, and the wire rods are provided with the above-mentioned wire rods. A board shape correction device characterized by being configured to be able to go in and out of a groove.