JPH044158A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH044158A JPH044158A JP10480490A JP10480490A JPH044158A JP H044158 A JPH044158 A JP H044158A JP 10480490 A JP10480490 A JP 10480490A JP 10480490 A JP10480490 A JP 10480490A JP H044158 A JPH044158 A JP H044158A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- hole
- base
- fpc
- thermal head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 25
- 239000000470 constituent Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Common Mechanisms (AREA)
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は熱転写方式の画像形成装置のサーマルヘッドに
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thermal head for a thermal transfer type image forming apparatus.
［従来の技術］
従来の熱転写方式の画像形成装置のサーマルヘッドは、
第５図のように、画像形成装置本体４に、ヘッドを取り
付けた後、画像形成時にインクリボン、あるいは感熱紙
との摩擦によって、ヘッドチップ１に蓄えられた静電気
を、基材３を介し放電する目的で、アース用ＦＰＣ２を
、ネジで基材３に固定接続するという構成であった。[Prior art] The thermal head of a conventional thermal transfer image forming apparatus is
As shown in FIG. 5, after the head is attached to the image forming apparatus main body 4, the static electricity accumulated in the head chip 1 is discharged through the base material 3 due to friction with the ink ribbon or thermal paper during image formation. For this purpose, the grounding FPC 2 was fixedly connected to the base material 3 with screws.
［発明が解決しようとする課題］
しかし、従来の方法では、ヘッドを画像形成装置本体４
に取り付けた後、基材３にアース用ＦＰＣ２を固定接続
する段階で、画像形成装置本体４に設けられたネジ山が
、スペース上の問題で狭い場所にあり、かつＦＰＣ２は
弾性を有するため、ＦＰＣ２に設けられたネジ穴２ｂと
、基材３に設けられたネジ穴３ｂの位置合わせに非常に
手間がかかり、画像形成装置の組立効率を低下させると
いう課題があった。[Problems to be Solved by the Invention] However, in the conventional method, the head is connected to the main body 4 of the image forming apparatus.
At the stage of fixedly connecting the grounding FPC 2 to the base material 3 after attaching it to the base material 3, the screw thread provided on the image forming apparatus main body 4 is in a narrow place due to space issues, and the FPC 2 has elasticity. There was a problem in that it took a lot of effort to align the screw holes 2b provided in the FPC 2 and the screw holes 3b provided in the base material 3, which reduced the assembly efficiency of the image forming apparatus.
そこで本発明はこのような課題を解決するものであり、
その目的とするところは、アース用ＦＰＣの基材への固
定接続を簡単にし、画像形成装置の組立効率を高め、更
には、部品点数の小数化、部品の加工工程の省略化を可
能とするサーマルヘラドを提供する事にある。Therefore, the present invention solves these problems,
The purpose of this is to simplify the fixed connection of the grounding FPC to the base material, increase the assembly efficiency of the image forming device, and further reduce the number of parts and simplify the processing process of parts. The purpose is to provide thermal helads.
［課題を解決するための手段］
本発明のサーマルヘッドは、前記サーマルヘッドの構成
要素である基材に突起を設け、かつ前記基材に接続され
るアース用ＦＰＣに穴を設け、前記穴に前記突起を挿入
して構成されることを特徴とする。[Means for Solving the Problems] The thermal head of the present invention includes a base material that is a component of the thermal head, which is provided with a protrusion, and a grounding FPC connected to the base material is provided with a hole, and the hole is provided with a projection. It is characterized in that it is configured by inserting the protrusion.
［作 用］
上記発明より構成されるサーマルヘッドを用いた画像形
成装置は、アース用ＦＰＣの基材への固定接続が容易に
なり、組立効率が向上し、更には部品点数小数化、部品
加工工程の省略化が可能となる。[Function] The image forming apparatus using the thermal head configured according to the above invention facilitates fixed connection of the grounding FPC to the base material, improves assembly efficiency, and further reduces the number of parts and facilitates parts processing. It becomes possible to omit the process.
［実施例］
以下に、本発明を、熱転写方式の画像形成装置の一つで
あるシリアル型プリンタの、サーマルヘッドに適用した
場合の実施例にもとづき説明する。[Example] The present invention will be described below based on an example in which the present invention is applied to a thermal head of a serial printer, which is one of thermal transfer type image forming apparatuses.
第２図は、シリアルタイプのプリンタのサーマルヘッド
の構成を示す図であり、ヘッドチップ１はセラミックス
からなる基板表面にグレーズ部を搭載し、更にその上に
発熱要素１ａを搭載するという構成である。更に、その
ヘッドチップ１は、アルミニウム、及びその合金等、放
熱性の高い金属で作製された基材３上に搭載されている
。また、発熱要素１ａを駆動するためのＦＰＣｌｂがグ
レーズ部に接続されている。ただし、第２図以外では簡
略化のため、発熱要素駆動用ＦＰＣ１ｂは省略する。FIG. 2 is a diagram showing the configuration of a thermal head of a serial type printer. The head chip 1 has a configuration in which a glaze part is mounted on the surface of a substrate made of ceramics, and a heat generating element 1a is further mounted on the glaze part. . Further, the head chip 1 is mounted on a base material 3 made of a metal with high heat dissipation such as aluminum and its alloy. Further, an FPClb for driving the heat generating element 1a is connected to the glaze portion. However, for the sake of simplification, the FPC 1b for driving the heat generating element is omitted in other parts than FIG.
以下、本実施例では、第２図のように、ヘッドチップ１
、基材３から構成されたサーマルヘッドを単にヘッドと
呼ぶ。Hereinafter, in this embodiment, as shown in FIG.
, the thermal head constructed from the base material 3 is simply called a head.
・実施例１
第１図は、第２図のように構成されたヘッドに本発明を
実施し、実際に画像形成装置本体４に取り付け、アース
用ＦＰＣ２を、ネジにより基材３に固定接続するときの
様子を示したものである。・Example 1 FIG. 1 shows the present invention implemented in a head configured as shown in FIG. 2, which is actually attached to the image forming apparatus main body 4, and the grounding FPC 2 is fixedly connected to the base material 3 with screws. This shows the situation at that time.
拡大図は、特に本発明の要部であるアース用ＦＰＣ２と
、基材３の接続部分である。拡大図から判るように、ア
ース用ＦＰＣ２と、基材３は、ネジにより固定接続され
る際、アース用ＦＰＣ２に設けられた穴２ａに、基材３
に設けられた突起３ａがあらかじめ挿入されている。こ
のため、両者をネジで固定する際、ＦＰＣ２に設けられ
たネジ穴２ｂと、基材３に設けられたネジ穴３ｂの位置
あわせは、第５図の、従来のサーマルヘッドの場合に比
べ非常に容易になり、画像形成装置の組立効率が向上す
る。The enlarged view shows in particular the connecting portion between the grounding FPC 2 and the base material 3, which are the essential parts of the present invention. As can be seen from the enlarged view, when the grounding FPC 2 and the base material 3 are fixedly connected with screws, the base material 3 is inserted into the hole 2a provided in the grounding FPC 2.
The protrusion 3a provided on the holder is inserted in advance. Therefore, when fixing the two with screws, the alignment of the screw hole 2b provided in the FPC 2 and the screw hole 3b provided in the base material 3 is much more difficult than in the case of the conventional thermal head shown in Fig. 5. The assembly efficiency of the image forming apparatus is improved.
・実施例２ 実施例２は本発明を更に応用したものである。・Example 2 Example 2 is a further application of the present invention.
第３図は、実施例２の要部をあられす部分である基材３
と、ＦＰＣ２の接続部分の拡大図であり、第４図は第３
図を平面Ａで切断したときの断面図である。Figure 3 shows the base material 3, which is the main part of Example 2.
This is an enlarged view of the connection part of FPC2, and Figure 4 is an enlarged view of the connection part of FPC2.
FIG. 3 is a cross-sectional view when the figure is cut along plane A;
実施例２では、突起は円柱形をしており、第４図から判
るように、基材３に設けられた突起３ａは、「二」の字
状の断面を持つ切り欠きに設けられている。その突起は
、アース用ＦＰＣ２に設けられた穴２ａに挿入されてい
る。この状態を保持したまま、ヘッドを画像形成装置本
体４に取り付けると、「二」の字状の切り欠きは、塑性
変形を起こし、ＦＰＣ２は強固に挟持され、導通も保た
れる。そのため、第５図の従来例で、基材３に設けられ
たネジ穴３ｂと、ＦＰＣ２に設けられたネジ穴２ｂの位
置合わせに手間取るという課題が解決されるばかりでな
く、ネジ穴２ｂ、３ｂが不要になる。また、基材３とＦ
ＰＣ２を同定接続するのにネジが不要となる。これに付
随して、画像形成装置本体４にネジ山を設ける必要もな
くなる。In Example 2, the protrusion has a cylindrical shape, and as can be seen from FIG. 4, the protrusion 3a provided on the base material 3 is provided in a notch with a cross section in the shape of a "2" shape. . The protrusion is inserted into a hole 2a provided in the grounding FPC 2. When the head is attached to the image forming apparatus main body 4 while maintaining this state, the ``two''-shaped notch undergoes plastic deformation, the FPC 2 is firmly clamped, and electrical continuity is maintained. Therefore, in the conventional example shown in FIG. 5, the problem that it takes time to align the screw holes 3b provided in the base material 3 and the screw holes 2b provided in the FPC 2 is not only solved, but also the problem that the screw holes 2b, 3b becomes unnecessary. In addition, base material 3 and F
No screws are required to connect the PC2. Along with this, there is no need to provide a screw thread on the image forming apparatus main body 4.
以上述べたように、本発明は、画像形成装置の組立時に
、従来費やされていた手間を省くのみでなく、部品点数
の小数化、部品の加工工程の省略を可能とし、画像形成
装置の組立効率の向上と、生産コストの低減をもたらす
のに極めて有効な手段である。As described above, the present invention not only saves the conventional effort when assembling an image forming apparatus, but also makes it possible to reduce the number of parts and omit processing steps for parts, thereby making it possible to assemble an image forming apparatus. This is an extremely effective means for improving assembly efficiency and reducing production costs.
尚、本発明は実施例１、実施例２の例に限定されず、突
起と穴の形状を工夫することにより、広く応用可能であ
る。Note that the present invention is not limited to the examples of Examples 1 and 2, but can be widely applied by devising the shapes of the protrusions and holes.
［発明の効果］
以上述べたように、本発明のサーマルヘッドは、前記サ
ーマルヘッドの構成要素である基材に突起を設け、かつ
前記基材に接続されるアース用ＦＰＣに穴を設け、前記
穴に前記突起を挿入して構成されることを特徴とするの
で、アース用ＦＰＣと基材の固定接続が容易になり、画
像形成装置の組立効率が向上する。更に応用すれば、部
品点数の少数化、部品加工工程の省略化により、組立効
率の向上とコストダウンの両方が可能となる。[Effects of the Invention] As described above, in the thermal head of the present invention, a projection is provided on the base material which is a component of the thermal head, and a hole is provided in the grounding FPC connected to the base material. Since the structure is characterized in that the projection is inserted into the hole, the fixed connection between the grounding FPC and the base material is facilitated, and the efficiency of assembling the image forming apparatus is improved. If applied further, it becomes possible to both improve assembly efficiency and reduce costs by reducing the number of parts and omitting part processing steps.
また、本発明を実施したサーマルヘッドは、プリンタ、
ビデオプリンタ、ファクシミリ、複写機等の画像形成装
置へ広く応用できる。また、ドツトインパクト方式等、
他の方式の画像形成装置のヘッドであっても、ヘッドに
蓄えられた静電気をアース用ＦＰＣを用いて放電するも
のであれば、本発明を適用する事が可能である。Further, the thermal head implementing the present invention can be used in printers,
It can be widely applied to image forming devices such as video printers, facsimile machines, and copying machines. In addition, dot impact method etc.
The present invention can be applied to heads of other types of image forming apparatuses as long as the static electricity accumulated in the heads can be discharged using a grounding FPC.
第３図は、本発明の実施例２の要部の拡大図。FIG. 3 is an enlarged view of the main parts of Embodiment 2 of the present invention.
第４図は、本発明の実施例２の要部の断面図。FIG. 4 is a cross-sectional view of the main parts of Example 2 of the present invention.
第５図は、従来例を表す概要図。FIG. 5 is a schematic diagram showing a conventional example.
Claims (1)
の構成要素である基材に突起を設け、かつ前記基材に接
続されるアース用ＦＰＣに穴を設け、前記穴に前記突起
を挿入して構成されることを特徴とするサーマルヘッド
。In a thermal transfer type thermal head, a projection is provided on a base material that is a component of the thermal head, a hole is provided in a grounding FPC connected to the base material, and the projection is inserted into the hole. A thermal head characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10480490A JPH044158A (en) | 1990-04-20 | 1990-04-20 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10480490A JPH044158A (en) | 1990-04-20 | 1990-04-20 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH044158A true JPH044158A (en) | 1992-01-08 |
Family
ID=14390617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10480490A Pending JPH044158A (en) | 1990-04-20 | 1990-04-20 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH044158A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6382574U (en) * | 1986-11-19 | 1988-05-31 |
-
1990
- 1990-04-20 JP JP10480490A patent/JPH044158A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6382574U (en) * | 1986-11-19 | 1988-05-31 |
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