JPH0441622Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to piezoelectric resonators, and more particularly to the integration of piezoelectric resonators with other circuit components.

FIG. 1 is a plan view of a conventional piezoelectric resonator.
FIG. 2 is a plan view of the piezoelectric resonator covered with resin. Piezoelectric resonator 1 shown in these figures
Here, first and second resonator electrodes 5 and 6 are formed on both main surfaces 3 and 4 of piezoelectric substrate 2, respectively. Both resonator electrodes 5 and 6 are formed facing each other with the piezoelectric substrate 2 in between. The first resonator electrode 5 is connected to an extraction electrode 7 formed to extend to one end of one main surface 3 of the piezoelectric substrate 2 . The second resonator electrode 6 is connected to an extraction electrode 8 formed to extend to one end of the other main surface 4 of the piezoelectric substrate 2 .
Each of the lead electrodes 7 and 8 is formed wide at one end of the main surfaces 3 and 4 for connecting a lead terminal, and the lead terminals 11 and 12 are soldered to the wide lead electrode portions 9 and 10. Fixed by
After the lead terminals 11 and 12 are fixed, the piezoelectric substrate is covered with resin 13 as shown in FIG. by the way,
Such a piezoelectric resonator 1 is sometimes used in an oscillation circuit 14 as shown in FIG. In FIG. 3, 15 is an inverter, 1 is the piezoelectric resonator, 1
6 and 17 are first and second capacitors serving as load capacitances. Conventionally, when the piezoelectric resonator 1 is used in such an oscillation circuit 14, it has been manufactured separately from the first and second capacitors 16 and 17. Therefore, the oscillation frequency of the oscillation circuit 14 depends on the capacitance values of the first and second capacitors 16 and 17 as load capacitances, the resonance frequency of the piezoelectric resonator 1, and variations in the circuit constants inside the inverter 15. The structure is subject to change. When the oscillation circuit 14 of FIG. 3 is used as an oscillation clock source for a computer or the like, it is preferable that such fluctuations be as small as possible. Furthermore, if the parts are manufactured separately, the number of parts increases and the size becomes large, which is also undesirable from the viewpoint of parts management.

Therefore, it is better to integrally configure the capacitors 16 and 17 together with the piezoelectric resonator 1 on the same piezoelectric substrate.
As in the piezoelectric resonant oscillation device shown in Figures 3 and 7 of Publication No. 28663, the number of pairs of resonator electrodes is increased, resulting in an increase in the size of the piezoelectric substrate, or , Utsukai Showa 57-
Even if the number of pairs of resonator electrodes is one as in the ceramic resonator of Publication No. 10125, one signal input/output lead terminal and the grounding lead terminal located between them are The output lead terminal and the grounding lead terminal are attached to one main surface side of the piezoelectric substrate, while the other signal input/output lead terminal is attached to the other main surface side of the piezoelectric substrate. Another disadvantage is that once the piezoelectric substrate is attached, the piezoelectric substrate cannot be stably held by the lead terminals.

The present invention enables, for example, when a piezoelectric resonator is used as an oscillation element in an oscillation circuit, variations in the oscillation frequency of the oscillation circuit to be minimized, reduces the number of parts, and downsizes the oscillation circuit.
In addition to making parts management easier,
In this case, it is an object of the present invention to provide a structure that can avoid an increase in size and at the same time can hold the piezoelectric substrate with good stability using lead terminals.

Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings. FIG. 4 is a plan view of the piezoelectric resonator of this embodiment. The piezoelectric resonator 20 of this embodiment is of an energy trap type thickness longitudinal vibration mode. This piezoelectric resonator 20 includes a piezoelectric substrate 21 . First and second resonator electrodes 24 and 25 are formed on both main surfaces 22 and 23 of this piezoelectric substrate 21, facing each other with the piezoelectric substrate 21 in between. First and second capacitor electrodes 2 constituting the first capacitor 26 are arranged along one end of one main surface 22 of the piezoelectric substrate 21 on which the first resonator electrode 24 is formed.
The first capacitor electrode 27 of the capacitors 7 and 28 is connected to the first resonator electrode 24 via the lead electrode 29, and the third and fourth capacitor electrodes 31 and 32 constituting the second capacitor 30 A third capacitor electrode 31 is formed. A first connection electrode 34 is connected to the second resonator electrode 25 via an extraction electrode 35 at a corner 33 at the other end of the other main surface 23 of the piezoelectric substrate 21 on which the second resonator electrode 25 is formed. formed by connecting. Similarly, on the other main surface 23, a second capacitor electrode 28 is formed opposite to the first capacitor electrode 27, and a fourth capacitor electrode 32 of the second capacitor 30 is formed opposite to the third capacitor electrode 31. At the same time, the second and fourth capacitor electrodes 28 and 32
They are connected to each other via a connection electrode 36. The first and second capacitors 26 and 30 are
It is formed by leaving the portion of the piezoelectric substrate 21 where the capacitors 6 and 30 are formed unpolarized or by applying solder to the capacitor electrode. A third connection electrode 37 is formed on one main surface 22 facing the corner 33 and connected to the third capacitor electrode 31 via an extraction electrode 38 . In such a configuration, as shown in FIGS. 5 to 7, the first and third connection electrodes 34 and 37 are connected to each other at their corners 33 with conductive paint 39. FIG. 5 is a plan view of such a piezoelectric resonator 20 viewed from the same direction as FIG. 4, and in FIG. The first and second lead terminals 40, 41 of
are connected and fixed by solders 42 and 43. FIG. 6 is a plan view of the piezoelectric resonator 20 viewed from the opposite direction to that shown in FIG. 4, and in FIG. A third lead terminal 44 for grounding is also connected and fixed to 36 with solder 45 .
FIG. 7 is a sectional view taken along the cutting line A-A in FIG. 6, and it is clear from FIG. 7 that the conductive paint 3
Reference numeral 9 connects the first and third connection electrodes 34 and 37 with the corner 33 of the piezoelectric substrate 21 in between. Therefore, according to this embodiment, one piezoelectric substrate 21
A piezoelectric resonator 20 and two capacitors 1 are shown in FIG.
6, 17 (numerals 26, 3 in Figures 4 to 7)
0) are formed in accordance with the connection configuration shown in FIG. 3, making it possible to integrate circuit components.

As described above, according to the present invention, since the piezoelectric resonator in the oscillation circuit of FIG. 3 is integrated with each capacitor on the same piezoelectric substrate, it can be used, for example, as an oscillation element in the oscillation circuit of the same figure. When used, the variation in the oscillation frequency of the oscillation circuit can be minimized, and the number of parts can be reduced, making component management easier than when manufacturing each capacitor separately from the piezoelectric resonator as in the past. This is a structure that can facilitate this.

In addition, in the present invention, when the circuit configuration of the piezoelectric resonator and capacitor shown in FIG. 3 is configured on one piezoelectric substrate, the number of pairs of resonator electrodes is
This makes it possible to avoid increasing the size of the configuration. What is important in this case is that while minimizing the number of pairs of resonator electrodes to avoid increasing their size, when attaching the three lead terminals to one end of the piezoelectric substrate, A pair of lead terminals for each signal input/output, which should be attached to both sides of the piezoelectric substrate, are attached to one main surface side of the piezoelectric substrate, while a lead terminal for grounding, which should be attached to the center of the one end side, is attached to the other side of the piezoelectric substrate. Since the lead terminal can be attached to the main surface side of the piezoelectric substrate, the stability of attaching the lead terminal to the piezoelectric substrate can be improved.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a conventional piezoelectric resonator, FIG. 2 is a plan view of the piezoelectric resonator shown in FIG. 1 covered with resin, FIG. 3 is an oscillation circuit diagram including the piezoelectric resonator, and FIG.
7 to 7 show embodiments of the present invention, FIG. 4 is a plan view of the piezoelectric resonator, and FIG. 5 is a piezoelectric resonator provided with solder, conductive paint, and lead terminals. 6 is a plan view similar to FIG. 5 but viewed from the opposite direction to the piezoelectric resonator in FIG. 4;
The figure is a sectional view taken along section line A-A in FIG. 6. 20 is a piezoelectric resonator, 21 is a piezoelectric substrate, 22, 2
3 is the main surface, 24 is the first resonator electrode, 25 is the second
Resonator electrode, 26 is the first capacitor, 27, 28
are first and second capacitor electrodes, 29 is an extraction electrode,
30 is the second capacitor, 31 and 32 are the first and second capacitors.
Capacitor electrode, 33 is a corner, 34 is a first connection electrode, 35 is an extraction electrode, 36 is a second connection electrode,
37 is a third connection electrode, 38 is an extraction electrode, 39 is a conductive paint, 40, 41, 44 are lead terminals,
42, 43, 45 are solder.

Claims (1)

[Claims for Utility Model Registration] First and second resonator electrodes 24 and 25 are formed on both main surfaces 22 and 23 of the piezoelectric substrate 21, and are opposed to each other with the piezoelectric substrate 21 in between. Piezoelectric substrate 21 on which electrodes 24 are formed
The first capacitor electrode 27 of the first and second capacitor electrodes 27 and 28 constituting the first capacitor 26 is placed along one end of one main surface 22 of
The third capacitor electrode 31 of the third and fourth capacitor electrodes 31 and 32 constituting the second capacitor 30 is formed by being connected to the resonator electrode 24 via the extraction electrode 29, and the second resonance Piezoelectric substrate 21 on which child electrodes 25 are formed
A first connection electrode 34 is connected to the second resonator electrode 25 via an extraction electrode 35 at a corner 33 at the other end of the other main surface 23 . has a second capacitor electrode 28 facing the first capacitor electrode 27 and a fourth capacitor electrode 3 facing the third capacitor electrode 31.
2, the second and fourth capacitor electrodes 28 and 32 are connected to each other via a second connection electrode 36, and a third connection electrode is provided on one main surface 22 facing the corner 33. 37 is connected to the third capacitor electrode 31 via an extraction electrode 38, and the first and third connection electrodes 34, 37 are connected to each other at the corners with a conductive material 39, and the piezoelectric substrate 21 is Lead terminals 40 and 41 for signal input/output are connected to the first capacitor electrode 27 and the third capacitor electrode 31 on one main surface 22 side, respectively.
A grounding lead terminal 44 is connected to the second connection electrode 36 on the other main surface 23 side of the piezoelectric substrate 21.
A piezoelectric resonator is formed by connecting the