JPH0441933B2 - - Google Patents
Info
- Publication number
- JPH0441933B2 JPH0441933B2 JP60178523A JP17852385A JPH0441933B2 JP H0441933 B2 JPH0441933 B2 JP H0441933B2 JP 60178523 A JP60178523 A JP 60178523A JP 17852385 A JP17852385 A JP 17852385A JP H0441933 B2 JPH0441933 B2 JP H0441933B2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- temperature
- membrane
- film
- air flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 17
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims 1
- 239000012528 membrane Substances 0.000 description 36
- 238000010438 heat treatment Methods 0.000 description 19
- 230000001419 dependent effect Effects 0.000 description 18
- 230000007423 decrease Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 238000011144 upstream manufacturing Methods 0.000 description 7
- 238000002485 combustion reaction Methods 0.000 description 5
- 230000004043 responsiveness Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Measuring Volume Flow (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は膜式抵抗を有する直熱形流量センサ、
たとえば内燃機関の吸入空気量を検出するための
空気流量センサに関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a direct heating type flow sensor having a membrane resistor,
For example, the present invention relates to an air flow sensor for detecting the intake air amount of an internal combustion engine.
一般に、電子制御式内燃機関においては、基本
燃料噴射量、基本点火時期等の制御のために機関
の吸入空気量は重要な運転状態パラメータの１つ
である。従来、このような吸入空気量を検出する
ための空気流量センサ（エアフローメータとも言
う）はベーン式のものが主流であつたが、最近、
小型、応答性が良い等の利点を有する温度依存抵
抗を用いた熱式のものが実用化されている。
Generally, in an electronically controlled internal combustion engine, the intake air amount of the engine is one of the important operating state parameters for controlling the basic fuel injection amount, basic ignition timing, and the like. Conventionally, vane-type air flow sensors (also called air flow meters) have been the mainstream for detecting the amount of intake air, but recently,
A thermal type using a temperature-dependent resistor has been put into practical use, and has advantages such as small size and good response.
さらに、温度依存抵抗を有する空気流量センサ
としては、傍熱型と直熱型とがある。たとえば、
傍熱型の空気流量センサは、機関の吸気通路に設
けられた発熱抵抗、およびその上流、下流側に設
けられた２つの温度依存抵抗を備えている。この
場合、上流側の温度依存抵抗は発熱抵抗による加
熱前の空気流の温度を検出するものであり、つま
り、外気温度補償用であり、また、下流側の温度
依存抵抗は加熱抵抗によつて加熱された空気流の
温度を検出する。これにより、下流側の温度依存
抵抗と上流側の温度依存抵抗との温度差が一定に
なるように発熱抵抗の電流値をフイードバツク制
御し、発熱抵抗に印加される電圧により空気流量
（質量）を検出するものである。なお、上流側の
外気温度補償用温度依存抵抗を削除し、下流側の
温度依存抵抗の温度が一定になるように発熱抵抗
を制御すると、体積容量としての空気流量が検出
できる（参照：特公昭54−9662号公報）。他方、
傍熱型に比べて応答速度が早い直熱型の空気流量
センサは、機関の吸気通路に設けられた温度検出
兼用の発熱抵抗、およびその上流側に設けられた
温度依存抵抗を備えている。この場合、傍熱型と
同様に、上流側の温度依存抵抗は発熱抵抗による
加熱前の空気流の温度を検出するものであり、つ
まり、外気温度補償用である。これにより、発熱
抵抗とその上流側の温度依存抵抗との温度差が一
定になるように発熱抵抗の電流値をフイードバツ
ク制御し、発熱抵抗に印刷される電圧により空気
流量（質量）を検出するものである。なお、この
場合にも、外気温度補償用温度依存抵抗を削除
し、発熱抵抗の温度が一定になるように発熱抵抗
を制御すると、体積容量としての空気流量が検出
できる。 Furthermore, there are two types of air flow rate sensors having temperature-dependent resistance: indirect heating type and direct heating type. for example,
The indirectly heated air flow sensor includes a heat generating resistor provided in the intake passage of the engine, and two temperature dependent resistors provided upstream and downstream thereof. In this case, the temperature-dependent resistance on the upstream side detects the temperature of the air flow before heating by the heating resistor, that is, it is for outdoor temperature compensation, and the temperature-dependent resistance on the downstream side detects the temperature of the air flow before heating by the heating resistor. Detects the temperature of the heated air stream. As a result, the current value of the heating resistor is feedback-controlled so that the temperature difference between the temperature-dependent resistance on the downstream side and the temperature-dependent resistance on the upstream side is constant, and the air flow rate (mass) is controlled by the voltage applied to the heating resistor. It is something to detect. Note that if you delete the temperature-dependent resistance for outdoor temperature compensation on the upstream side and control the heating resistor so that the temperature of the temperature-dependent resistance on the downstream side remains constant, the air flow rate as a volumetric capacity can be detected (reference: 54-9662). On the other hand,
A directly heated air flow sensor, which has a faster response speed than an indirectly heated type, includes a heat generating resistor that is provided in the intake passage of the engine and also serves as temperature detection, and a temperature dependent resistor that is provided upstream of the heat generating resistor. In this case, similarly to the indirect heating type, the upstream temperature-dependent resistance detects the temperature of the air flow before being heated by the heating resistor, that is, it is used to compensate for the outside air temperature. This allows feedback control of the current value of the heating resistor so that the temperature difference between the heating resistor and the temperature-dependent resistor upstream thereof is constant, and the air flow rate (mass) is detected by the voltage printed on the heating resistor. It is. In this case as well, if the temperature-dependent resistance for compensating the outside air temperature is deleted and the heating resistor is controlled so that the temperature of the heating resistor is constant, the air flow rate as a volumetric capacity can be detected.
通常、発熱抵抗（膜式抵抗）の発熱温度を吸入
空気温度との差を一定値にするあるいは膜式抵抗
の発熱温度を一定にする空気流量センサの応答
性、ダイナミツクレンジは膜式抵抗の発熱部兼温
度検出部からの空気中への放熱により消費される
熱量の割合（放熱効率）が大きい程よい。このた
め、シリコンもしくはセラミツク基板の両面に膜
式抵抗パターンを単純に形成することにより空気
中への放熱効率を向上せしめることも一案であ
る。 Normally, the responsiveness of an air flow sensor that makes the difference between the heat generation temperature of a heat generation resistor (film type resistor) and the intake air temperature constant, or the heat generation temperature of a membrane type resistor, is determined by the dynamic range of the membrane type resistor. The higher the proportion of heat consumed by heat radiation into the air from the heat generating part/temperature detection part (heat radiation efficiency), the better. Therefore, one idea is to simply form film-type resistor patterns on both sides of a silicon or ceramic substrate to improve the efficiency of heat dissipation into the air.
しかしながら、この場合には、基板表裏の２つ
の膜式抵抗パターンの組付きの困難さすなわち電
気的接続の困難さのために信頼性の低下を招くこ
とになる。
However, in this case, reliability will be lowered due to the difficulty in assembling the two film resistor patterns on the front and back sides of the substrate, that is, the difficulty in electrical connection.
本発明の目的は、放熱効率が高く且つ信頼性が
高い直熱型流量センサを提供とすることにあり、
その手段は、導電性基板の表裏に膜式抵抗パター
ンを形成したことである。
An object of the present invention is to provide a direct heating type flow sensor with high heat dissipation efficiency and high reliability.
The means for achieving this is to form a film-type resistor pattern on the front and back sides of a conductive substrate.
上述の手段によれば、２つの膜式抵抗パターン
はその間の導電性基板により電気的に容易に接続
される。
According to the above-mentioned means, two film-type resistive patterns are easily electrically connected by the conductive substrate between them.
〔実施例〕 以下、図面により本発明の実施例を説明する。〔Example〕 Embodiments of the present invention will be described below with reference to the drawings.
第５図は本発明に係る膜式抵抗を有する直熱型
流量センサが適用された内燃機関を示す全体概要
図、第６図は第５図のセンサ部分の拡大縦断図で
ある。第５図，第６図において、内燃機関１の吸
気通路２にはエアクリーナ３および整流格子４を
介して空気が吸入される。この吸気通路２内に計
測管（ダクト）５が設けられ、その内部に空気流
量を計測するための発熱ヒータ兼用温度依存抵抗
（膜式抵抗）６が設けられている。膜式抵抗６は
ダクト２内に固定され、ステイ７の外側に設けら
れた外気温度補償を行う温度依存抵抗８と共に、
ハイブリツド基板に形成されたセンサ回路９に接
続されている。 FIG. 5 is an overall schematic diagram showing an internal combustion engine to which a directly heated flow rate sensor having a membrane resistor according to the present invention is applied, and FIG. 6 is an enlarged longitudinal sectional view of the sensor portion of FIG. 5. 5 and 6, air is taken into an intake passage 2 of an internal combustion engine 1 via an air cleaner 3 and a rectifying grid 4. As shown in FIGS. A measurement pipe (duct) 5 is provided within the intake passage 2, and a temperature dependent resistor (film type resistor) 6 which also functions as a heat generating heater is provided inside the measurement pipe (duct) 5 for measuring the air flow rate. A membrane resistor 6 is fixed inside the duct 2, and together with a temperature dependent resistor 8 provided outside the stay 7 for compensating for the outside temperature.
It is connected to a sensor circuit 9 formed on a hybrid board.
センサ回路９は外気温度に対して膜式抵抗６の
温度が温度依存抵抗８の温度との差が一定値にな
るように該抵抗６の発熱量をフイードバツク制御
し、そのセンサ出力VQを制御回路１０に供給す
る。制御回路１０はたとえばマイクロコンピユー
タによつて構成され、燃料噴射弁１１の制御等を
行うものである。 The sensor circuit 9 feedback-controls the amount of heat generated by the resistor 6 so that the difference between the temperature of the film resistor 6 and the temperature of the temperature-dependent resistor 8 is a constant value with respect to the outside air temperature, and controls the sensor output V Q. Supplied to circuit 10. The control circuit 10 is composed of, for example, a microcomputer, and controls the fuel injection valve 11 and the like.
センサ回路９は、第７図に示すごとく、膜式抵
抗６、温度依存抵抗８とブリツジ回路を構成する
抵抗９１，９２、比較器９３，比較器９３の出力
によつて制御されるトランジスタ９４、電圧バツ
フア９５により構成される。つまり、空気流量が
増加して膜式抵抗６（この場合、サーミスタ）の
温度が低下し、この結果、膜式抵抗６の抵抗値が
下降してV1≦VRとなると、比較器９３の出力に
よつてトランジスタ９４の導電率が増加する。従
つて、膜式抵抗６の発熱量が増加し、同時に、ト
ランジスタ９４のコレクタ電位すなわち電圧バツ
フア９５の出力電圧VQは上昇する。逆に、空気
流量が減少して膜式抵抗６の温度が上昇すると、
膜式抵抗６の抵抗値が上昇してV1＞VRとなり、
比較器９３の出力によつてトランジスタ９４の導
電率が減少する。従つて、膜式抵抗６の発熱量が
減少し、同時に、トランジスタ９４のコレクタ電
圧すなわち電圧バツフア９５の出力電圧VQは低
下する。このようにして、膜式抵抗６の温度は外
気温度によつて定まる値になるようにフイードバ
ツク制御され、出力電圧VQは空気流量を示すこ
とになる。 As shown in FIG. 7, the sensor circuit 9 includes a film resistor 6, a temperature-dependent resistor 8, resistors 91 and 92 forming a bridge circuit, a comparator 93, and a transistor 94 controlled by the output of the comparator 93. It is composed of a voltage buffer 95. In other words, the air flow rate increases and the temperature of the membrane resistor 6 (thermistor in this case) decreases, and as a result, the resistance value of the membrane resistor 6 decreases and when V 1 ≦ V R , the comparator 93 The output increases the conductivity of transistor 94. Therefore, the amount of heat generated by the film resistor 6 increases, and at the same time, the collector potential of the transistor 94, that is, the output voltage VQ of the voltage buffer 95 increases. Conversely, when the air flow rate decreases and the temperature of the membrane resistor 6 increases,
The resistance value of the membrane resistor 6 increases and becomes V 1 > V R ,
The output of comparator 93 causes the conductivity of transistor 94 to decrease. Therefore, the amount of heat generated by the film resistor 6 decreases, and at the same time, the collector voltage of the transistor 94, that is, the output voltage VQ of the voltage buffer 95 decreases. In this way, the temperature of the membrane resistor 6 is feedback-controlled to a value determined by the outside air temperature, and the output voltage VQ indicates the air flow rate.
第１Ａ図は第５図の膜式抵抗の拡大正面図、第
１Ｂ図は第１Ａ図のＢ−Ｂ線断面図である。第１
Ａ図，第１Ｂ図に示すように、膜式抵抗６はアル
ミニウム、銅等の放熱性の優れた保持部材１２に
よりダクト５内に収容されている。膜式抵抗６
は、導電性基板６１と、その両面に形成された膜
式抵抗パターン（AuもしくはPt）６２，６２′
（後述する）とにより構成され、断熱部材１３ａ，
１３ｂを介して保持部材１２に固定されている。
この場合、断熱部材１３ａは非導電性であり、断
熱部材１３ｂは導電性である。そして、基板６１
の表面側に形成された膜式抵抗パターン６２はボ
ンデイングワイヤ１５により配線１４ａに接続さ
れ、他方、基板６１の裏面側に形成された膜式抵
抗パターン６２′は導電性断熱部材１３ｂにより
配線１４ｂに接続されている。 FIG. 1A is an enlarged front view of the membrane resistor shown in FIG. 5, and FIG. 1B is a sectional view taken along the line B--B in FIG. 1A. 1st
As shown in FIGS. A and 1B, the membrane resistor 6 is housed in the duct 5 by a holding member 12 made of aluminum, copper, or the like and having excellent heat dissipation properties. Membrane type resistor 6
, a conductive substrate 61 and film resistance patterns (Au or Pt) 62, 62' formed on both sides thereof.
(described later), and includes a heat insulating member 13a,
It is fixed to the holding member 12 via 13b.
In this case, the heat insulating member 13a is non-conductive and the heat insulating member 13b is conductive. And the board 61
The film resistance pattern 62 formed on the front side of the substrate 61 is connected to the wiring 14a by the bonding wire 15, while the film resistance pattern 62' formed on the back side of the substrate 61 is connected to the wiring 14b by the conductive heat insulating member 13b. It is connected.
第１Ａ図、第１Ｂ図に示すように、保持部材１
２の下流側部分１２ａは折り曲げられて波状の形
状をなしている。つまり、膜式抵抗６と保持部材
１２の波状部分１２ａとは段違いとなつている。 As shown in FIGS. 1A and 1B, the holding member 1
The downstream portion 12a of No. 2 is bent to form a wavy shape. In other words, the membrane resistor 6 and the wavy portion 12a of the holding member 12 are at different levels.
なお、通常は、膜式抵抗と平板式保持部材とは
空気流に対して同一の位置にある。従つて、膜式
抵抗６から空気流へ放熱された熱は再び保持部材
に伝達され、膜式抵抗から空気流へ放熱される実
効熱量は減少し、これが流量センサの応答性、ダ
イナミツクレンジの低下を招く。これに対し、第
１Ａ図、第１Ｂ図の構成によれば、膜式抵抗６か
ら空気流へ放熱された熱が再び保持部材１２，１
２ａへ伝達される割合が低下するので、流量セン
サの応答性、ダイナミツクレンジの低下を防止で
きる。また、保持部材１２が空気流に当る面積が
大きくなり、保持部材１２自身の放熱効率も大き
くなり、膜式抵抗６の放熱効率の向上に寄与す
る。さらに、保持部材１２の波状部分１２ａはボ
ンデイングワイヤ１５のバツクフアイヤからのプ
ロテクタの役目もなしている。 Note that normally, the membrane resistor and the flat plate holding member are located at the same position with respect to the air flow. Therefore, the heat radiated from the membrane resistor 6 to the air flow is transferred to the holding member again, and the effective amount of heat radiated from the membrane resistor 6 to the air flow decreases, which affects the responsiveness of the flow sensor and the dynamic range. causing a decline. On the other hand, according to the configurations shown in FIGS. 1A and 1B, the heat radiated from the membrane resistor 6 to the air flow is returned to the holding members 12 and 1.
Since the rate of transmission to 2a is reduced, it is possible to prevent the responsiveness and dynamic range of the flow rate sensor from being reduced. Further, the area of the holding member 12 exposed to the airflow becomes larger, and the heat radiation efficiency of the holding member 12 itself also increases, contributing to an improvement in the heat radiation efficiency of the film resistor 6. Furthermore, the wavy portion 12a of the holding member 12 also serves as a protector from the backup wire of the bonding wire 15.
第２Ａ図は第１Ａ図の膜式抵抗６の表面を示す
図、第２Ｂ図は第１Ａ図の膜式抵抗６の断面を示
す図、第２Ｃ図は第１Ａ図の膜式抵抗６の裏面を
示す図である。第２Ａ図〜第２Ｃ図に示すよう
に、膜式抵抗６は、導電性基板６１、絶縁層６
３，６３′、膜式抵抗パターン６２，６２′、パツ
シベーシヨン膜６４，６４′により構成される。
すなわち、導電性基板６１の両面に絶縁層６３，
６３′（たとえばSiO2、Si3N4）を形成し、その
上に、膜式抵抗パターン６２，６２′を形成し、
さらにその上に、パツシベーシヨン膜６４，６
４′（たとえばSiO2、Si3N4）を形成する。各膜
式抵抗パターン６２，６２′は、発熱ヒータ兼温
度検知部６２ａ，６２a′、リード部６２ｂ，６２
b′および電極取出し部６３ｃ，６３c′から構成さ
れている。ここで、発熱ヒータ兼温度検知部６２
ａ，６２a′の一端はリード部６２ｂ，６２b′に延
長されているが、他端は絶縁層６３，６３′のコ
ンタクト部を介して導電性基板６１とオーミツク
コンタクトを形成している。また、電極取出し部
６３ｃ，６３c′に対応するパツシベーシヨン膜６
４ｃ，６４c′にもコンタクト部が形成されてい
る。従つて、２つの膜式抵抗パターン６２，６
２′は特別の配線を設けることなく直列に接続さ
れることになり、２つの膜式抵抗パターン６２，
６２′は１つの膜式抵抗として作用する。つまり、
電流が１つの膜式抵抗パターン６２から導電性基
板６１を通り他の膜式抵抗パターン６２′へ流れ
る。 2A is a diagram showing the front surface of the membrane resistor 6 in FIG. 1A, FIG. 2B is a diagram showing a cross section of the membrane resistor 6 in FIG. 1A, and FIG. 2C is a back side of the membrane resistor 6 in FIG. 1A. FIG. As shown in FIGS. 2A to 2C, the film resistor 6 includes a conductive substrate 61, an insulating layer 6
3, 63', film-type resistor patterns 62, 62', and passivation films 64, 64'.
That is, an insulating layer 63,
63' (for example, SiO 2 , Si 3 N 4 ), and film resistor patterns 62 and 62' are formed thereon;
Furthermore, on top of that, passivation films 64, 6
4' (for example, SiO 2 , Si 3 N 4 ). Each film-type resistance pattern 62, 62' includes a heating heater/temperature detection part 62a, 62a', a lead part 62b, 62
b' and electrode extraction portions 63c, 63c'. Here, the heat generating heater and temperature detection section 62
One ends of the leads 62a and 62a' are extended to lead portions 62b and 62b', while the other ends form ohmic contact with the conductive substrate 61 via contact portions of the insulating layers 63 and 63'. In addition, the passivation film 6 corresponding to the electrode extraction portions 63c and 63c'
Contact portions are also formed at 4c and 64c'. Therefore, the two film resistance patterns 62, 6
2' are connected in series without providing any special wiring, and the two film resistor patterns 62,
62' acts as one membrane resistor. In other words,
Current flows from one film resistor pattern 62 through the conductive substrate 61 to the other film resistor pattern 62'.
このように、基板６１の表裏に膜式抵抗パター
ンを形成することにより、全発熱量のうち空気流
への放熱により消費される熱量の割合が増加する
ので、流量センサの応答性、ダイナミツクレンジ
の向上に役立つものである。 In this way, by forming the film resistance pattern on the front and back surfaces of the substrate 61, the proportion of heat consumed by heat dissipation to the air flow out of the total heat generation increases, which improves the responsiveness and dynamic range of the flow sensor. It is useful for improving the
第３Ａ図、第３Ｂ図は第１Ａ図、第１Ｂ図に対
応し、第４Ａ図〜第４Ｃ図は第２Ａ図〜第２Ｃ図
に対応する。つまり、第１Ａ図、第１Ｂ図、第２
Ａ図〜第２Ｃ図においては、膜式抵抗６はその両
端が保持部材１２に固定保持されている。このよ
うに、膜式抵抗６を両保持部により保持部材６に
固定すると、膜式抵抗６が歪ゲージの作用し、従
つて、膜式抵抗６の歪みによりその出力変化を招
くという欠点が生ずる。これに対し、第３Ａ図，
第３Ｂ図、第４Ａ図〜第４Ｃ図に示す膜式抵抗６
はその一端のみが保持部材１２に固定保持されて
いるので、上述の歪ゲージ作用は防止される。 3A and 3B correspond to FIGS. 1A and 1B, and FIGS. 4A to 4C correspond to FIGS. 2A to 2C. In other words, Figure 1A, Figure 1B, Figure 2
In FIGS. A to 2C, both ends of the membrane resistor 6 are fixedly held by the holding member 12. In this way, when the membrane resistor 6 is fixed to the holding member 6 by both holding parts, the membrane resistor 6 acts as a strain gauge, and therefore, there is a drawback that the distortion of the membrane resistor 6 causes a change in its output. . On the other hand, Fig. 3A,
Film resistor 6 shown in Figures 3B and 4A to 4C
Since only one end thereof is fixedly held by the holding member 12, the above-mentioned strain gauge effect is prevented.
なお、上述の実施例においては、２つの膜式抵
抗パターン６２，６２′が直列接続された構成と
して説明したが、並列接続された構成とすること
もできる。この場合、導電性基板６１を接地し、
２つの膜式抵抗パターン６２，６２′の電極取出
し部６２ｃ，６２c′を共通接続してセンサ回路９
に出力するようにする。 In the above embodiment, the two film resistance patterns 62 and 62' are connected in series, but they may be connected in parallel. In this case, the conductive substrate 61 is grounded,
The sensor circuit 9 is formed by commonly connecting the electrode extraction portions 62c and 62c' of the two membrane resistor patterns 62 and 62'.
Output to .
以上説明したように本発明によれば、特別の配
線を行うことなく、基板の表裏に膜式抵抗パター
ンを形成することによりその放熱効率を向上させ
ることができ、従つて、流量センサの応答性、ダ
イナミツクレンジの向上と共に信頼性の向上に役
立つものである。
As explained above, according to the present invention, the heat dissipation efficiency can be improved by forming film resistance patterns on the front and back surfaces of the substrate without special wiring, and therefore the responsiveness of the flow sensor can be improved. This is useful for improving reliability as well as improving dynamic range.
第１Ａ図は本発明に係る直熱型流量センサの膜
式抵抗を示す正面図、第１Ｂ図は第１Ａ図のＢ−
Ｂ線断面図、第２Ａ図は第１Ａ図の膜式抵抗の表
面を示す図、第２Ｂ図は第１Ａ図の膜式抵抗の断
面を示す図、第２Ｃ図は第１Ａ図の膜式抵抗の裏
面を示す図、第３Ａ図は本発明に係る直熱型流量
センサの他の膜式抵抗を示す正面図、第３Ｂ図は
第３Ａ図のＢ−Ｂ線断面図、第４Ａ図は第３Ａ図
の膜式抵抗の表面を示す図、第４Ｂ図は第３Ａ図
の膜式抵抗の断面を示す図、第４Ｃ図は第３Ａ図
の膜式抵抗の裏面を示す図、第５図は本発明に係
る膜式抵抗を有する直熱型流量センサが適用され
た内燃機関を示す全体概要図、第６図は第５図の
センサ部分の拡大縦断面図、第７図は第３図のセ
ンサ回路の回路図である。
５……ダクト、６……膜式抵抗、８……外気温
度補償用温度依存抵抗、９……センサ回路、１２
……保持部材、１３ａ……非導電性断熱部材、１
３ｂ……導電性断熱部材、１４ａ，１４ｂ……配
線、１５……ボンデイングワイヤ。
FIG. 1A is a front view showing a membrane resistor of a directly heated flow rate sensor according to the present invention, and FIG. 1B is a B--FIG.
2A is a cross-sectional view of the membrane resistor in Figure 1A, Figure 2B is a cross-sectional view of the membrane resistor in Figure 1A, and Figure 2C is the membrane resistor in Figure 1A. FIG. 3A is a front view showing another membrane resistor of the directly heated flow rate sensor according to the present invention, FIG. 3B is a sectional view taken along the line B-B of FIG. 3A, and FIG. 3A is a diagram showing the front surface of the membrane resistor, FIG. 4B is a diagram showing a cross section of the membrane resistor in FIG. 3A, FIG. 4C is a diagram showing the back side of the membrane resistor in FIG. 3A, and FIG. An overall schematic diagram showing an internal combustion engine to which a directly heated flow rate sensor having a membrane resistor according to the present invention is applied, FIG. 6 is an enlarged vertical cross-sectional view of the sensor portion in FIG. 5, and FIG. FIG. 3 is a circuit diagram of a sensor circuit. 5... Duct, 6... Film resistor, 8... Temperature dependent resistance for outdoor temperature compensation, 9... Sensor circuit, 12
...Holding member, 13a...Non-conductive heat insulating member, 1
3b... Conductive heat insulating member, 14a, 14b... Wiring, 15... Bonding wire.
Claims (1)
抗パターンを形成し、該各膜式抵抗パターンを前
記導電性基板を介して電気的に接続し、前記基板
を断熱部材を介して放熱性の優れた保持部材に支
持した直熱型流量センサ。 ２ 前記導電性基板とその下流側に位置する保持
部材の部分とを前記流体の流れに対して段違いに
した特許請求の範囲第１項に記載の直熱型流量セ
ンサ。[Scope of Claims] 1. Film resistance patterns are formed on both sides of a conductive substrate via insulating members, each of the film resistance patterns is electrically connected through the conductive substrate, and the substrate is thermally insulated. A directly heated flow rate sensor supported by a holding member with excellent heat dissipation. 2. The directly heated flow rate sensor according to claim 1, wherein the conductive substrate and a portion of the holding member located downstream thereof are at different levels with respect to the flow of the fluid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60178523A JPS6239721A (en) | 1985-08-15 | 1985-08-15 | Direct heating type flow sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60178523A JPS6239721A (en) | 1985-08-15 | 1985-08-15 | Direct heating type flow sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6239721A JPS6239721A (en) | 1987-02-20 |
| JPH0441933B2 true JPH0441933B2 (en) | 1992-07-09 |
Family
ID=16049958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60178523A Granted JPS6239721A (en) | 1985-08-15 | 1985-08-15 | Direct heating type flow sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6239721A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0642209Y2 (en) * | 1989-02-03 | 1994-11-02 | 東レ株式会社 | Flow sensor |
-
1985
- 1985-08-15 JP JP60178523A patent/JPS6239721A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6239721A (en) | 1987-02-20 |
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