JPH044196A - Ic card assembly device - Google Patents

Abstract

PURPOSE:To assembly an IC card rapidly and correctly by a method wherein a primer is applied on the rear surface of an IC module on a module table, and this IC module is loaded in a recessed part of a card on an assembly table through an adhesive sheet and heated under pressure. CONSTITUTION:An IC card assembly device 10 is provided with a module table 12 and an assembly table 14. Modules 3 are successively disposed on the module table 12 with the rear surface disposed upward. On the module table 12, the rear surface of the IC module 3 is coated with a fixed amount of primer by a primer applicator 22. On the other hand, a thermoplastic or thermosetting adhesive sheet 5 of a predetermined shape is loaded in a recessed part of a card 2 disposed on the assembly table 14 by an adhesive sheet supply device 28. The IC module 3 coated with the primer is reversed by a reversing device 24 to be loaded on the adhesive sheet 5 in the recessed part by a module supply device 25. The IC module 3 in the recessed part is heated and pressed from upward by a heat bonding device to be assembled as an IC card.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to an IC card assembly device for producing an IC card.

(Prior Art) In recent years, various studies have been carried out regarding IC cards called chip cards, memory cards, microcomputer cards, or electronic cards equipped with IC chips such as microcomputers and memories.

Compared to conventional magnetic cards, such IC cards have
Because of its large storage capacity, banks are considering using it to store the history of deposits and savings in place of passbooks, and credit cards are considering storing transaction history such as shopping.

As shown in FIG. 7, the IC card 1 is composed of an IC module 3 on which an IC chip and tab are mounted, and a card 2 in which a recess 2a for mounting the IC module is formed. Further, a primer 4 is applied to the back side of the IC module 3, and an adhesive sheet 5 is applied to the inside of the four parts 2a of the card 2.
is located. Note that the shape of the adhesive sheet 5 is such that it is placed on the intermediate step portion 7 of the recessed portion 2a.

By the way, the IC card 1 as shown in FIG.
A primer is applied to the back surface of the module 3, an adhesive sheet 5 is installed in the recess 2a formed in advance on the card 2, the IC module 3 is installed on the adhesive sheet 5 in the recess 2a, and the IC module 3 is heated. It can be assembled by pressing.

However, the reality is that conventional IC card assembly processes have been manually performed by humans.

(Problems to be Solved by the Invention) As described above, IC cards are assembled manually, and there are problems in that it takes a long time to assemble the IC cards, and the reliability of the product is low.

The present invention has been made in consideration of these points,
IC that allows you to quickly and accurately assemble IC cards
The purpose of the present invention is to provide a card assembly device.

[Structure of the invention]

(Means for Solving the Problems) The present invention provides a module table that rotates with IC modules arranged in sequence with their back sides facing upward, and an assembly table that rotates with cards in which recessed portions are formed in advance. , a primer coating device that applies a primer to the IC module on the module table; an adhesive sheet supply device that attaches an adhesive sheet of a predetermined shape to the recess of the card on the assembly table;
A reversing device for reversing the C module and the reversed IC
A module supply device that supplies the module to the assembly table side and mounts the IC module on the adhesive sheet in the recess of the card, and a heat device that heats and presses the IC module mounted in the recess of the card on the assembly table from above. This is an IC card assembling device characterized by comprising a mounting device.

(Function) The IC modules are placed one after another on the module table with their back sides facing upward, and a certain amount of primer is applied to the back sides of the IC modules on the module table using a primer coating device, while the IC modules are placed on the assembly table. A thermoplastic or thermosetting adhesive sheet of a predetermined shape is attached to the recess of the placed card by an adhesive sheet supplying device, the IC module coated with a primer is reversed by a reversing device, and the module supplying device inserts a thermoplastic or thermosetting adhesive sheet into the recess. An IC card is assembled by mounting the IC card on an adhesive sheet and heating and pressing the IC module in the recess from above using a heat bonding device. Furthermore, by cooling the heated and pressed IC module with a cooling device, thermal deformation of the card can be minimized, and the adhesive curing time can be shortened when a thermoplastic adhesive sheet is used.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

1 to 6 are diagrams showing an embodiment of an IC card assembly apparatus according to the present invention. Of these, FIG. 1 is a schematic system diagram of the IC card assembly device, FIG. 2 is a sectional view taken along the line ■-■ in FIG. 1, and FIG. 3 is a sectional view taken along the line ■-■ in FIG.
Figure 4 is a cross-sectional view of Figure 1, and Figure 5 is a cross-sectional view of Figure 1.
-V line sectional view, and FIG. 6 is a plan view of the IC card assembly device.

In FIG. 1, an IC cart assembly device 10 includes a module table 12 on which IC modules 3 with their back sides facing upward are sequentially arranged and rotated, and an assembly table 14 on which cards 2 are sequentially arranged and rotated. .

Further, a tray 18 in which a large number of IC modules 3 are stored in advance is arranged on the right side of the module table 12, and between the tray 18 and the module table 12, a tray 18 is provided.
A module take-out device 20 for taking out the IC module 3 in the IC module 8 and placing it on the module table 12 is provided. Further, on the module table 12, a primer coating device 2 for coating a primer on the back surface of the IC module 3 is provided.
2 is provided.

Further, between the module table 12 and the assembly table 14, the IC modules 3 are successively nested (mounting table) 6.
a module transfer device 26 that dries the primer applied to the module 3 by transferring it onto the modules 2a, 62b, and 62c;
A reversing device 24 for reversing the IC module 3 transferred by the module transfer device 26 by 180°, and an IC
A module supply device 25 is provided for supplying the module 3 to the card 2 on the assembly table 14 and for mounting the IC module 3 into the recess 2a.

On the other hand, on the left side of the assembly table 14, there is a card stocker 3.
The card 2 stored in the card 8 is supplied to the assembly table 14 side, and the I assembled by the assembly table 14 is
A card supply/discharge device 36 is provided to discharge the C card 1 to the discharge conveyor 40 side.

The assembly table 14 also includes a card supply/discharge device 36.
on the downstream side (downstream side in the rotational direction) of the card 2.
An adhesive sheet supply device 28 for loading adhesive sheets 5 of a predetermined shape is disposed therein.

Furthermore, on the downstream side of this adhesive sheet supplying device 28, there is a module supplying device 25 for mounting the IC module 3 on the adhesive sheet 5 in the recess 2a, and an IC module provided in the four parts 2a.
A thermal bonding device 30 heats and presses the C module 3 from above, a cooling device 32 cools the IC module 3, and performs a peel inspection of the IC module 3 from the card 2, and discharges the defective IC card 1 to the outside. A peel inspection and NG discharge device 34 are sequentially arranged.

Next, each component will be explained in more detail with reference to FIG.

As shown in FIG. 6, the trays 18 near the module table 12 are supplied from a real tray magazine 42. As shown in FIG. Further, the used trays 18 are stored in an empty tray magazine 48.

Furthermore, a module take-out device 20 for taking out IC modules from the tray 18 has a module take-out section 20a. Moreover, this module take-out part 20a is movable in the XY force directions by the XY robot 21.

Further, the IC module 3 placed on the module table 12 is observed from above, and it is determined whether the IC module 3 is facing the back side (the side to which the primer is applied) or upward. A front/back discrimination device 70 is provided. Furthermore, a primer coating device 22 is disposed downstream of this front/back discriminating device 70.

The primer coating device 22 has a primer tank 44 in which a primer such as a polyurethane resin, such as a moisture-curable liquid polyurethane resin, or a two-component cure polyurethane resin of isocyanate and polyol, is stored. Then, by this primer coating device 22, a portion (seventh
Primer 4 is applied to the area shown in the figure.

Further, on the downstream side of the primer coating device 22, an image sensor 45 is disposed for determining whether or not the IC module 3 arranged on the module table 12 is oriented in a predetermined direction. That is, as shown in FIG. 1, for example, the image sensor 45 determines whether the IC modules 3 are arranged on the module table 12 with the D side facing outward, or whether all the IC modules 3 are facing in this direction. be done.

Further, a module transfer device 26 provided on the downstream side of the image sensor 45 transfers the IC module 3 on the module table 12 to a plurality of, for example, three nests (mounting tables) 62a provided on the side of the module table 12. , 62
b and 62c, and at the same time blow hot air to evaporate the residual solvent component of the primer.

Further, a reversing device 24 for reversing the IC module 3 by 180 degrees is disposed between the final nest 62c and the module supply device 25. The reversing device 24 allows the IC module 3 to have its front surface facing upward. Furthermore, the module supply device 25
It has a module supply section 25a that is movable in the XY force directions by the robot 50.

On the other hand, the card supply/discharge device 36 provided on the assembly table 14 has a cross-shaped planar shape and is rotatable about a rotation shaft 37. That is, the card supply/discharge device 3
One leg 36a of the card stocker 38 holds the card 2 in the card stocker 38 by suction, and the other leg 36b holds the card 2 on the assembly table 14.
By suctioning and holding the upper IC card 1 and rotating it clockwise in this state, insert a new card 2 onto the assembly table 1.
4, and the assembled IC card 1 can be discharged to the discharge conveyor 40 side.

Further, on the downstream side of the card supply/discharge device 36, a four-part inspection device 46 and an adhesive sheet supply device 28 are sequentially arranged.

The adhesive sheet supply device g7128 includes a supply roll 58 for supplying a belt-shaped adhesive sheet such as unsaturated polyester,
A winding roll 52 for winding up the belt-shaped adhesive sheet is provided. Also, between the supply roll 58 and the take-up roll 52, there is an adhesive sheet supply section 56 that punches out a band-shaped adhesive sheet to form an adhesive sheet of a predetermined shape and mounts this adhesive sheet into the four parts 2a of the card 2. is installed.

Furthermore, the adhesive sheet supply unit 56 includes a punching die (not shown) for punching out a band-shaped adhesive sheet, a suction unit (not shown) for sucking and holding the punched adhesive sheet, and a dust suction unit (not shown) for sucking and processing unnecessary parts. ). Note that the adhesive sheet supply section 56 is movable in the XY force directions by the XY robot 54.

Additionally, an adhesive sheet supply device 28 is provided on the assembly table 14.
A module supply device 25 and a thermal bonding device 3 are installed on the downstream side of the
0 are arranged sequentially.

Among these, the heat bonding device 30 attaches the IC module 3 mounted in the recess 2a of the card 2 from above using a heating rod (not shown).
The IC module is heated and pressed to melt the adhesive sheet 5 and fix the IC module in the recess 2a.

Furthermore, on the downstream side of the thermal bonding device 30, a cooling device 32 for cooling the IC module 3 within the recess 2a is provided. This cooling device 32 cools the IC module 3 by bringing a cooling rod (not shown) into contact with the IC module 3 from above, minimizing thermal deformation of the card, and shortening the curing time when using a thermoplastic adhesive sheet. This is intended to speed up the process.

The cooling device 32 also has a function of simultaneously inspecting the level difference between the surface of the card 2 and the surface of the IC module 3 and determining whether the terminal unevenness from the card surface satisfies the standard.

Further, on the downstream side of the cooling device 32, a peeling inspection and NG discharge device 34 is arranged.

Next, the operation of this embodiment having such a configuration will be explained.

First, the tray 18 is taken out from the actual tray magazine 42. Next, a large number of IC modules 3 stored in the tray 18 are sucked and held by the module take-out device 20 and taken out.
are arranged sequentially on top.

In this case, the IC module 3 is arranged with the back side (the side to which the primer is applied) facing upward, and the four directions of the IC module 3 are A, B, and C.

When it is set as the D direction, it is arranged with the D direction facing outward.

Next, the IC module 3 is checked by the front/back discrimination device 70.
It is determined whether the back side is correctly facing upward.

Next, the IC module 3 is coated with the primer coater 22.
After positioning, a primer 4 is applied to the back surface side of the adhesive sheet 5 in contact with the adhesive sheet 5. As mentioned above, the primer 4 is made of polyurethane resin, etc.
and the adhesive sheet 5 made of unsaturated polyester or the like.

Next, the IC module 3 is determined by the image sensor 45 whether the D direction of the IC module 3 is correctly facing outward, and then reaches the position of the module transfer device 26 (see FIGS. 1 and 5). figure). The module transfer device 26 sequentially transfers the IC modules 3 on the module table 12 to the nests 62a, 62b, and 62c on the sides of the module table 12. The transfer device 26 uses a suction unit (not shown) to suction and hold the part of the back surface of the IC module 3 on which the primer is not applied, and attaches the part of the back surface of the IC module 3 to the nests 62a and 62b.

62c. In this way, the nest 62a.

During the sequential transfer to 62b and 62c, the IC module 3
The applied primer 4 can be dried.

Next, the IC module 3 that has reached the final nest 62 is reversed by 180 degrees by the reversing device 24 and sent to the module supply device 25 side with the front side facing upward.
The IC module 3 with its front side facing upward is held by suction by the module supply section 25a of the module supply device 25. In this state, the module supply section 25a
moves toward the assembly table 14, and the IC module 3 is mounted within the four parts 2a of the card 2 on the assembly table 14 (FIGS. 1 and 4).

On the other hand, the card 2 stored in the card stocker 38 and having the four parts 2a formed in advance is held by suction by one leg 36a of the card supply/discharge device 36. When the card supply/discharge device 36 rotates clockwise about the rotation shaft 37, the card 2 is attracted to the leg 36a.
is placed on the assembly table 14.

Next, it is determined by the recess inspection device 46 whether the card 2 has the recess 2a formed in advance (FIGS. 1 and 2). Subsequently, the card 2 is delivered to the adhesive sheet supply device 28
reach.

In the adhesive sheet supply device 28 , the band-shaped adhesive sheet supplied from the supply roll 58 is punched into a predetermined shape by the punching die of the adhesive sheet supply section 56 , and the punched adhesive sheet 5 is punched by the suction section of the adhesive sheet supply section 56 . It is retained by adsorption. In this state, the adhesive sheet supply unit 56 is moved horizontally by the XY robot 54, and the adhesive sheet 5 is placed in the recess 2a of the card 2 (see FIGS. 1 and 3).
figure).

Note that the shape of the adhesive note 5 is such that it is arranged on the middle step part 7 of the four parts 2a of the card 2.

Further, the band-shaped adhesive sheet after being punched out is placed on a winding roll 5.
The unnecessary part in the center of the second side is subjected to suction processing.

Next, the card 2 with the adhesive sheet 5 placed inside the recess 2a
is sent to the module supply device 25, and as described above, the I
The C module 3 is mounted on the adhesive sheet 5 in the recess 2a (FIGS. 1 and 5).

Next, the card 2 with the IC module 3 attached thereto is transferred to the thermal bonding device 30. Then, the heating rod of the thermal bonding device 30 heats and presses the IC module 3 from above (150
°C, 5 seconds). In this case, the adhesive sheet 5 is melted, the IC module 3 is fixed in the recess 2a of the card 2, and the IC card 1 is assembled in this way.

Subsequently, the IC module 3 fixed in the fourth part 2a is
It comes into contact with the metal rod of the cooling device 32 and is cooled. at the same time,
The cooling device 32 determines whether the heights of the surface of the card 2 and the surface of the IC module 3 match. Next, the IC card 1 is transferred to a peel inspection and NG discharge device 34,
Here, the peeling of the IC module 3 from the card 2 is inspected, that is, it is inspected to see if the IC module 3 is securely fixed within the four parts 2a. At the same time, IC cards 1 that are determined to be defective as a result of various tests, such as a surface height test in the cooling device 32 or a peel test, are discharged to the outside by the peel test and NG discharge device 34. Subsequently, the IC card 1 determined to be a good product is discharged to the discharge conveyor 40 side by the card supply/discharge device 36.

As described above, according to this embodiment, the primer 4 is applied to the back surface of the IC module 3 on the module table 12, and the IC module 3 is supplied to the assembly table 14 side, and the adhesive sheet 5 is applied inside the recess 2a of the card 2. Then, the IC module 3 is mounted on the assembly table 14.
By heating and pressing, the IC card can be quickly assembled into the cylinder.

〔Effect of the invention〕

As explained above, according to the present invention, a primer is applied to the back surface of an IC module on a module table, this IC module is installed in a recess of a card on an assembly table via an adhesive sheet, and then the IC module is An IC card can be assembled by heating and pressing. For this reason, compared to the conventional method of manually assembling each piece one by one, this system provides stable, quick, accurate, and highly reliable
It is possible to assemble C cards.

FIG.

1...IC cart, 2...card, 2a, 4 parts, 3...
- IC module, 4... Primer, 5... Adhesive sheet, 12... Module table, 14... Assembly table, 22... Primer device, 24... Reversing device,
25... Module supply device, 28... Adhesive sheet supply device, 30... Heat bonding device, 32... Cooling device.

Claims (2)

[Claims] 1. A module table that rotates on which IC modules with their back sides facing upward are sequentially arranged; and an assembly table that rotates on which cards with recesses formed in advance are sequentially arranged;
a primer coating device that applies a primer to the IC module on the module table; an adhesive sheet supply device that attaches an adhesive sheet of a predetermined shape to the recess of the card on the assembly table; and an adhesive sheet supply device that inverts the IC module on the module table. a reversing device; a module supplying device that supplies the inverted IC module to the assembly table and mounts the IC module on the adhesive sheet in the recess of the card; and an IC mounted in the recess of the card on the assembly table. An IC card assembly device comprising: a heat bonding device that heats and presses a module from above. 2. 2. The IC card assembly device according to claim 1, further comprising a cooling device provided on the assembly table downstream of the thermal bonding device to cool the heated and pressed IC module.