JPH0455218A - Card stocker - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a card stocker used for producing cards such as magnetic cards.

(Prior Art) In recent years, various studies have been carried out regarding IC cards called chip cards, memory cards, microcomputer cards, or electronic cards equipped with IC chips such as microcomputers and memories.

Compared to conventional magnetic cards, such IC cards have
Because of its large storage capacity, banks are considering using it to store the history of deposits and savings in place of passbooks, and credit cards are considering storing transaction history such as shopping.

As shown in FIG. 8, the IC card 1 is composed of an IC module 3 on which an IC chip is mounted, and a card 2 on which four parts 2a for mounting the IC module are formed. Further, a primer 4 is applied to the back side of the IC module 3, and an adhesive sheet 5 is arranged inside the four parts 2a of the card 2. Note that the shape of the adhesive sheet 5 is four parts 2.
The size is such that it can be placed on the middle step part 7 of the portion a.

By the way, an IC card like the one shown in Figure 8 is an IC card.
Apply primer to the back of module 3, card 2
The adhesive sheet 5 is mounted in the four parts 2a formed in advance, and then the IC module 3 is mounted on the adhesive sheet 5 of the four parts 2a, and the IC module 3 is assembled by heating and pressing.

However, the reality is that conventional IC card assembly processes have been manually performed by humans.

(Problems to be Solved by the Invention) As mentioned above, the actual situation is that IC card assembly is done manually and takes a long time.

Therefore, it has been considered to automatically assemble the IC card using an IC card assembly device. In such a case,
It would be convenient if a large number of cards could be stored, and new cards could be reliably and automatically delivered to the IC card assembly device one after another without damaging the cards.

The present invention has been made in consideration of these points,
To provide a card stocker capable of storing a large number of cards and quickly and surely carrying them into an IC card assembly device without damaging the cards.

[Structure of the invention]

(Means for Solving the Problems) The present invention provides a card storage body that stores cards in a stacked state, and a card storage body that is provided on the bottom side of the card storage body and presses the card of the highest layer to send it out laterally. Equipped with a sending device,
A locking device that supports the bottom surface of the card is attached to the side of the card storage body so as to be able to move forward and backward. It is a card stocker that is characterized by being able to take the cards forward and backward at will.

(Operation/Operation) The locking device is moved inward of the card storage body to set it to the locking state 11-, and the card is pressed and held by the pressing device, and then the locking state by the frame 11-1 device is released. A predetermined amount of cards are dropped, and the lowest card is sent out by the sending device.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings. 1, 2, and 2 are diagrams showing one embodiment of a card stocker according to the present invention, FIG. 3 is a schematic system diagram of an IC card assembly device incorporating the card stocker, and FIG. 4 is a diagram showing an embodiment of the card stocker according to the present invention. Figure 3 is a sectional view taken along the line ■■, Figure 5 is a sectional view taken along the line ■-v in Figure 3, Figure 6 is a sectional view taken along the line Vl-VI in Figure 3, and Figure 7 is a sectional view taken along the line Vl-VI in Figure 3. It is a sectional view taken along the line ■-■.

First, the entire IC card assembly device 10 incorporating a card stocker will be explained with reference to FIG.

In FIG. 3, the IC card assembly device 10 includes a module table 12 on which IC modules 3 with their back sides facing upward are sequentially arranged and rotated, and an assembly table 4 on which corners 2 are sequentially arranged and rotated. There is.

Further, a tray 18 in which a large number of IC modules 3 are stored in advance is arranged on the right side of the module table 12, and between the tray 18 and the module table 12, a tray 18 is provided.
A module take-out device 20 for taking out the IC module 3 in the IC module 8 and placing it on the module table 12 is provided. Further, on the module table 12, a primer coating device 2 for coating a primer on the back surface of the IC module 3 is provided.
2 is provided.

Further, between the module table 12 and the assembly table 4, the IC modules 3 are successively nested (mounting table) 6.
2a, 62b, 6'l! A module transfer device 2 that dries the primer applied to the module 3 by transferring it onto the module c.
6. A reversing device 24 that inverts the IC module 3 transferred by the module transfer device 26 by 80 degrees, and supplies the IC module 3 to the card 2 on the assembly table 4; Module supply devices 25 to be installed in the recesses 2a are respectively disposed.

On the other hand, on the left side of the assembly table 14, a card stocker 38 is provided that stores the cards 2 and carries the cards 2 into the assembly table 14 via the card supply device 36. Note that the card supply device 36 also has a function of simultaneously discharging the IC cards assembled by the assembly table 14 to the discharge conveyor 40 side.

Additionally, a card supply/discharge device 3 is installed on the assembly table 14''.
6 (on the downstream side in the rotational direction), the four parts 2a of corner 2
An adhesive sheet supply device 28 for loading adhesive sheets 5 of a predetermined shape is disposed therein.

Furthermore, on the downstream side of this adhesive sheet supplying device 28, there is a module supplying device 25 for mounting the IC module 3 on the adhesive sheet 5 in the fourth section 2a, and an IC module installed in the fourth section 2a.
A thermal bonding device 30 that heats and presses the C module 3 from above, a cooling device 32 that cools the IC module 3, and a peeling test of the IC module 3 from the card 2 are performed, and the defective IC card 1 is discharged to the outside. A peel inspection and NG discharge device 34 are sequentially arranged.

Next, a card stocker according to the present invention will be explained with reference to FIGS. 1 and 2.

As shown in FIGS. 1 and 2, the card stocker 38
consists of a plurality of pillars, and is provided with a card storage body 70 that stores cards 2 in a stacked state. Further, on the lower side of the card storage body 70, there is a sending device 72 that presses the lowest card 2 and sends out the cards 2 one by one laterally.
is provided, and this delivery device has a distance between it and the card 2.

In addition, approximately in the center of the card storage body 70, there is a tab 74 at the tip.
A pair of locking devices 74 having a diameter are provided to be swingable about side pins 78.

This pair of locking devices 74 supports the bottom surface of the card 2 at the claws 74a. Further, seven vertical levers are attached to one end of each side pin 78, and each vertical lever 79 is further connected to a horizontal lever 76 via a fulcrum 80.

Further, the ends of each horizontal lever 76 are connected to each other to form a point of action 76a, and the lower end of a cylinder 81 is connected to this point of action 76a.

Note that the cylinder 81 is fixed to a support body 82 attached to the card storage body 70.

On the other hand, above the pair of claws 74a, a pressing body 86 that presses the card 2 from the side is provided at a predetermined interval so as to be movable forward and backward. This pressing body 86 is housed in a box 92 fixed to the card storage body 70, and is connected to a pair of locking devices 74.
It is designed to move forward and backward in a direction perpendicular to the direction of swing. Further, a rubber body 88 is fixed to the tip of the pressing body 86,
Further, a rubber receiver 90 is fixed to a portion of the card storage body 70 facing the rubber body 88. and pressing body 8
6 and the receiver 90 form a pressing device.

A flange 86a is fixed to the rear end of the pressing body 86, and a spring 84 is installed between the flange 86a and the box 92.
is mediated. Further, the flange 86a is attached to the support body 91.
The upper end of the drive lever 83 rotates around a fulcrum 91a, and the lower end of the drive lever 83 is pushed by a cylinder 85 fixed to the card storage body 70. ing. Further, the support body 91 is fixed to a box 92.

Next, the operation of this embodiment having such a configuration will be explained.

First, a large number of IC modules 3 are housed in the tray 18.
is suction-held and taken out by the module take-out device 20, and then this IC module 3 is placed on the module table 1.
2 are arranged sequentially. In this case, the IC module 3 is arranged with the back side (the side to which the primer is applied) facing upward, and the four directions of the IC module 3 are A and B.
, C, and D directions, they are arranged with the D direction facing outward.

Next, the IC module 3 is coated with the adhesive sheet 5 on the back side of the IC module 3 by the primer coating device 22.
Primer 4 is applied to the portion that comes into contact with. As mentioned above, the primer 4 is made of a polyurethane resin, such as moisture-curing liquid polyurethane or two-component curing polyurethane, and improves the adhesion between the IC module 3 and the adhesive sheet 5 made of unsaturated polyester or the like. It is something that makes you

Next, the IC module 3 reaches the position of the module transfer device 26 (FIGS. 3 and 7).

Then, by this module transfer device 26, the IC module 3 of the module table 12''- is sequentially transferred to the nests 62a, 62b, 62c on the side h'' of the module table 12, and during this time, the primer 4 applied to the IC module 3 is dried. be able to.

Next, the IC module 3 that has reached the final nest 62C is reversed by 180 degrees by the reversing device 24, and sent to the module supply device 25 side with the front side facing upward. 14 in the recess 2a of the card 2 (the third
(Fig. and Fig. 6).

On the other hand, the card 2 stored in the card stocker 38 and having the four parts 2a formed in advance is carried into the card supply/discharge device 36 side.

Next, the function of the card stocker 38 will be explained.

As shown in FIG. 1, first, the point of action 76a of the horizontal lever 76 is lifted upward by the cylinder 81, and the horizontal lever 79 rotates about the side pin 8. Subsequently, the pair of locking devices 74 rotate around the side pins 78, and the pair of claws 74a move inward of the card storage body 70, and the pair of claws 74a lock the card 2.
supports the bottom of the

Subsequently, the pressure on the drive lever 83.\ by the cylinder 85 is released, and the force of the spring 84 moves the pressing body 86 to the left in FIG. In this way, the card 2 above the rubber body 88 is dropped onto the pair of claws 74a.

Subsequently, the upper end of the drive lever 83 is pressed by the cylinder 85, and the upper end of the drive lever 83 pushes the pressing body 86.
It moves to the right in FIG. 2 against the force of the spring 84.

In this case, a predetermined number of cards 2 are pressed between the rubber body 88 at the tip of the pressing body 86 and the receiver 90.

Thereafter, the action point 76a of the horizontal lever 76 is lowered by the cylinder 81, and the pair of locking devices 11-74 are rotated via the seven vertical levers and the side pins 78. Then, the pair of claws 74a move toward the outside of the card storage body 70, and the locked state with respect to the card 2 is released. In this way, a predetermined number of cards 2 located above the claw 74a and below the rubber body 88 fall to the bottom of the card storage body 2.

Next, the point of action 76 of the horizontal lever 76 is controlled by the cylinder 81.
a rises, the pair of locking devices 74 rotate via the vertical lever 79 and the side pins 78, and the pair of claws 74a move inward of the card storage body 70.

By repeating such operations, a predetermined number of cards 2 are sequentially dropped to the bottom of the card storage body 70.

On the other hand, the cards 2 stacked on the bottom of the card storage body 70 are sequentially sent out one by one by the sending device 72 starting from the lowest layer, and in this way, the cards 2 are carried into the card supplying and discharging device 36 side.

Note that a photoelectric sensor 95 is installed near the bottom of the card storage body 70.
is attached, and the height (number of cards) of the cards 2 stacked on the bottom of the card storage body 70 can be detected by this photoelectric sensor 95. and photoelectric sensor 9
If the number of cards 2 detected by cylinder 81.5 is determined to be less than the specified amount, cylinder 81. ．． 85 are sequentially driven as described above to drop a predetermined number of cards 2 onto the bottom of the card storage body 70.

In this way, the cards 2 in the card storage body 70 are held by the pair of locking devices 74 and the pressing body 86, and a predetermined number of cards are allowed to fall to the bottom of the card storage body 70 as necessary. . Therefore, only a certain amount of cards are stacked on the bottom, so that the card 2 with the largest layer can be reliably delivered by the delivery device 72 without damaging the card.

That is, when all the cards 2 in the card storage body 70 are stacked and stored from the bottom, the card 2 in the lowest layer cannot be reliably sent out by the sending device 72 due to the frictional force due to the weight of many cards 2. Put it away.

The card 2 carried into the card supply device 36 side in this way
are supplied to the assembly table 14 by a card supply device 36 (FIGS. 3 and 4).

The card 2 then reaches the adhesive sheet supply device 28, and the adhesive sheet 5 is placed in the recess 2a of the card 2 (FIGS. 3 and 5).

Next, the card 2 with the adhesive sheet 5 placed inside the recess 2a
is sent to the module supply device 25, and as described above, the I
The C module 3 is mounted on the adhesive sheet 5 in the quadrant 2a (FIGS. 3 and 6).

Next, the card 2 with the IC module 3 attached thereto is transferred to the thermal bonding device 30, and the heating rod of the thermal bonding device 30 heats and presses the IC module 3 from above (150° C. for 5 seconds).

In this case, the adhesive sheet 5 is melted and the IC module 3 is fixed in the recess 2a of the card 2, and in this way the IC
Card 1 is assembled.

Subsequently, the IC module 3 fixed in the fourth part 2a is
It is cooled by a cooling device 32. Next, IC card 1
is transferred to the peel inspection and NG discharge device 34, where the IC module 3 is inspected for peeling from the card 2, that is, it is inspected to see if the IC module 3 is securely fixed in the four parts 2a. At the same time, the IC card 1 determined to be defective is discharged to the outside by this peel inspection and NG discharge device 34. Subsequently, the IC card 1 determined to be a good product is discharged to the discharge conveyor 40 side by the card supply/discharge device 36.

〔Effect of the invention〕

As explained above, according to the present invention, a predetermined amount of cards are dropped to the bottom of the card storage body and stacked, and the lowest amount of cards is sent out by the sending device.
The card can be sent out reliably without applying excessive load to the lowest card and without damaging the card.

[Brief explanation of drawings]

FIG. 1 is a side view showing one embodiment of a card stocker according to the present invention, FIG. 2 is a cross-sectional view of the card stocker shown in FIG. Figure 4 is a sectional view taken along line IV-IV in Figure 3, and Figure 5 is a cross-sectional view taken along line IV-IV in Figure 3.
6 is a sectional view taken along the line VI-Vl in FIG. 1, FIG. 7 is a sectional view taken along the line ■■ in FIG.
It is a sectional view of a C card. DESCRIPTION OF SYMBOLS 1... IC card, 2... Card, 2a... Recessed part, 3... IC module, 4... Primer, 5...
・Adhesive sheet, 12...Module table, 14・
...Assembly table, 38...Card stocker, 70.
... Card storage body, 72 ... Sending device, 74 ... Locking device, 74a ... Claw, 86 ... Pressing body, 88 ...
...Rubber body, 90...Receptor. Applicant's agent Mr. Sato Figure

Claims (1)

[Claims] It is equipped with a card storage body that stores cards in a stacked state, and a sending device that is installed on the side of the bottom of the card storage body and presses the lowest card and sends it out in the lateral direction. A card stocker characterized in that a locking device that supports the bottom surface of the card is attached so as to be freely advanced and retractable, and a pressing device that presses and holds the card from the side at a predetermined interval above the locking device is attached so that it can be freely advanced and retracted. .