JPH0441977Y2 - - Google Patents

Description

[Detailed description of the invention] <Industrial application field> The invention can be used, for example, to apply a processing liquid to magnetic disks, compact disks, semiconductor substrates, etc.
The present invention relates to improvements in a substrate rotation processing apparatus used for cleaning, development, etching, etc., and particularly to a substrate rotation and holding apparatus for holding and rotating a substrate having a through hole near the center thereof.

<Prior Art> In recent years, when a substrate, such as a magnetic disk or a compact disk, generally has a hole in the center, is treated with a chemical solution, it is often carried out by rotational treatment. The size of this through hole varies depending on the outer dimensions of the substrate, but it is usually about 10 to 50 mm in diameter.

In addition, regarding semiconductor substrates, in order to suppress crystal distortion that occurs during a series of processing steps and to exhaust gas released from photosensitive resin during the photoetching process, etc.
For various reasons, as shown in FIG.
A through hole 25 may be bored near the center of the hole.

When a processing liquid is applied to a substrate 23 having such a through hole 25 or the substrate is cleaned with a cleaning liquid in a rotary processing apparatus, a portion of the processing liquid flows into the through hole 25, causing processing unevenness. (Uneven cleaning, uneven coating, uneven development, uneven etching, etc.).

In order to eliminate such processing unevenness, for example, Japanese Utility Model Publication No. 56-5306 discloses a substrate rotation and holding device shown in FIG. 6. A rotary head 22 is provided at the upper end of a rotary shaft 21 having an intake passage 28, and a suction port 24 that suction-holds a substrate 23 on a substrate holding surface 22a of the rotary head 22 and a processing liquid flowing down from a through hole 25 of the substrate 23 are collected. The suction port 24 and the liquid permeable recess 26 are connected to the intake passage 28 of the rotary shaft 21 through communication passages 27 and 29, and the substrate 23 is fed by a common intake source. It is designed to hold the substrate 23 by suction and to remove the processing liquid and the like flowing down from the through hole 25 of the substrate 23 by suction. Incidentally, Japanese Utility Model Application Publication No. 59-82257 discloses a substrate rotation and holding device in which the suction and holding of the substrate and the suction and removal of processing liquid and the like are performed through separate intake passages.

<Problems to be solved by the invention> However, in the above conventional example, the communication path 2
The processing liquid is sucked into the intake passage 28 through the
This may reduce the functionality of the valve body installed in the intake system and the intake source, causing damage. Also, especially Jikoaki
As described in Publication No. 56-5306, the substrate rotation and holding device shown in FIG. , the suction port 24 and the liquid passage recess 26
, it is actually difficult to maintain the suction negative pressure necessary to suction and hold the substrate 23 while rotating it. Note that the device described in Japanese Utility Model Application Publication No. 59-82257 has separate suction passages for suction and holding of the substrate and suction and removal of processing liquid, etc., so that the suction negative pressure for suctioning and holding the substrate as described above is reduced. Although there are no maintenance problems, there are processing difficulties in suctioning and removing the processing liquid in the central opening of the substrate without leaving any residue.

In other words, if liquid passage holes are formed at multiple locations in the center opening of the substrate so that the processing liquid in the center opening of the substrate is suctioned and removed without leaving any residue, such liquid passage holes are used for removing the processing liquid. A piping route must be formed so as to communicate with the intake passage.
Forming such a piping route requires complicated and difficult machining, partly because the intake passage for sucking and holding the substrate runs vertically through the rotating shaft.

<Means for Solving the Problems> In order to solve the above problems, the present invention improves the above substrate rotation and holding device as follows. That is, the rotary head 2 is fixed to the upper end of the rotary shaft 1, and a liquid passage recess 6 having the same diameter or a larger diameter than the through hole 5 of the substrate 3 is formed on the substrate holding surface 2a of the rotary head 2. In the substrate rotation and holding device of the substrate processing apparatus configured to discharge the processing liquid flowing down from the through hole 5 of No. 3 through the liquid passage recess 6, the substrate rotates outward from the bottom peripheral side of the liquid passage recess 6. A liquid passage hole 9 penetrating to the outside of the head 2 is formed, and the processing liquid flowing down into the liquid passage recess 6 is discharged through the liquid passage hole 9.

<Operation> The substrate 3 is held on the substrate holding surface 2a of the rotating head 2 and rotated. When the processing liquid is supplied to the upper surface of the substrate 3 in the vicinity of the through hole, the processing liquid is uniformly spread and coated on the upper surface of the substrate 3 due to rotational centrifugal force. Further, a part of the processing liquid flows down from the through hole 5 of the substrate 3 and flows into the liquid passage recess 6, but due to the rotational centrifugal force of the rotating head 2, it flows from the bottom peripheral side of the liquid passage recess 6 into the liquid passage hole 9. The particles are scattered and discharged to the outside of the rotary head 2 via the rotary head 2.
This eliminates the inconvenience of the processing liquid flowing into the intake passage 8.

<Example> Hereinafter, an example of the present invention will be described based on FIGS. 1 to 5.

FIG. 1 is a longitudinal sectional view of a substrate rotation and holding device showing a first embodiment of the present invention, and FIG. 2 is a plan view thereof. In these figures, numeral 1 is the rotation axis, 2
3 is a rotating head, and 3 is a substrate such as a semiconductor or a disk.

The rotating shaft 1 is rotatably supported within a substrate processing device (not shown) such as a spin coater and rotated by a rotation drive device (not shown). A rotary head is fixed to the upper end of the rotary shaft 1, and the rotary head 2 has a large number of air intake holes 4 arranged in a radial manner and opened to hold the substrate 3 by suction on its substrate holding surface 2a. A liquid passage recess 6 having approximately the same diameter as the through hole 5 is provided. Each intake hole 4 is communicated with an intake passage 8 formed in the rotation shaft 1 through a communication passage 7 formed in the rotary head 2, and the substrate 3 is attracted and held on the substrate holding surface 2a.

Among the positions on the bottom circumferential side of the liquid passage recess 6, the circumferential wall surface 6a
Four liquid passage holes 9 are formed radially through the rotating head 2 toward the outside from the lower end position of the rotary head 2, and these liquid passage holes 9 and the communication passage 7 of the intake hole 4 are connected to the second As shown in the figure, they are arranged so as not to interfere with each other.

With this structure, even if a part of the processing liquid flows into the liquid passage recess 6 from the through hole 5 of the substrate 3, it is scattered outward from the liquid passage hole 9 by the centrifugal force caused by the rotation of the rotating head 2 and is discharged. be done.

FIG. 3 is a longitudinal sectional view of a substrate rotation and holding device showing a second embodiment of the present invention. In this figure, the same members as in FIG. 1 are represented by the same symbols.

In this embodiment, the liquid passage recess 16 has a larger diameter than the through hole 5 of the substrate 3, the center thereof is formed in a mountain shape, and the liquid passage hole 19 has a downward slope toward the outside.
This embodiment differs from the first embodiment in that the liquid draining effect is enhanced. Further, since the peripheral wall surface of the liquid passage recess 16 is sloped downwardly toward the outside, unlike the conventional device shown in FIG. 6, which is sloped downwardly toward the inside, the processing liquid is There is no problem of climbing up the peripheral wall surface of 16 due to centrifugal force.

FIG. 4 is a perspective view of a substrate rotation and holding device showing a third embodiment of the present invention, and FIG.
A vertical cross-sectional view.

In this embodiment, the substrate holding surface 2 of the rotary head 2 is
A plurality of board enclosing pins 14 are planted in the peripheral part of a,
This embodiment differs from the second embodiment in that the substrate 3 is held by surrounding it with these pins 14. In this case, it can be applied to a so-called mechanical chuck type rotary head that is not a vacuum suction type.

<Effects of the invention> As explained above, the present invention forms a liquid passage hole that extends outward from the circumferential side of the bottom of the liquid passage recess and penetrates to the outside of the rotary head, and the liquid passage hole passes through the liquid passage hole. Since the treatment liquid flowing into the chamber is forcibly scattered and discharged by centrifugal force, the following effects are achieved.

B Unlike the conventional example, since the processing liquid is not sucked into the intake passage through the communication passage, it is possible to prevent functional deterioration or damage to the valve body or intake source in the intake system.

(b) When the present invention is applied to a substrate rotation head using a vacuum suction method, unlike the conventional device in which the suction passage for suctioning and holding the substrate and the passage for suctioning and discharging processing liquid etc. are connected through a common suction passage, There is no problem in that the suction passage that suction-holds the substrate communicates with the atmosphere, and sufficient negative suction pressure can be maintained to suction-hold the substrate.

In addition, in conventional devices in which a suction passage for suctioning and holding the substrate and a passage for suctioning and discharging processing liquid, etc. are provided separately, multiple liquid passage holes are provided to smoothly discharge processing liquid, etc. from multiple locations in the liquid passage recess. To form the
In contrast to the processing difficulties of forming passages for suction and removal of processing liquid, etc. that communicate with a plurality of liquid passage holes so as not to intersect with the suction passages for suction and holding of the substrate, the present invention Each of the liquid passage holes penetrates outward, so even when applied to a substrate rotation head using a vacuum suction method, there is no such difficulty in processing, and processing liquid, etc. can be poured from multiple locations in the liquid passage recess. A plurality of holes can be easily formed so that liquid can be smoothly removed.

C. Since the present invention uses centrifugal force to remove the processing liquid in the liquid passage recess, it is not necessary to provide a suction means with a suction passage for removing the processing liquid. can also be easily applied.

[Brief explanation of the drawing]

1 to 5 show embodiments of the present invention.
The figure is a longitudinal sectional view of the substrate rotation and holding device according to the first embodiment, FIG. 2 is a plan view thereof, FIG. 3 is a longitudinal sectional view of the substrate rotation and holding device according to the second embodiment, and FIG. FIG. 5 is a perspective view of the embodiment of FIG.
FIG. 6 is a vertical cross-sectional view of a conventional example. DESCRIPTION OF SYMBOLS 1... Rotating shaft, 2... Rotating head, 2a... Substrate holding surface, 3... Substrate, 4... Intake hole, 5... Through hole in substrate, 6, 16... Liquid passage recess, 9, 19 ……
Liquid passage hole, 14...board enclosure pin.

Claims (1)

[Claim for Utility Model Registration] A rotary head 2 is fixed to the upper end of the rotary shaft 1, and a liquid passage recess with a diameter equal to or larger than the through hole 5 of the substrate 3 is provided on the substrate holding surface 2a of the rotary head 2. 6, and the substrate rotation and holding device of the substrate processing apparatus is configured to discharge the processing liquid flowing down from the through hole 5 of the substrate 3 through the liquid passage recess 6, the bottom peripheral side of the liquid passage recess 6 A liquid passage hole 9 is formed which extends outward from the rotary head 2 to the outside of the rotary head 2, and the processing liquid flowing down into the liquid passage recess 6 is discharged through the liquid passage hole 9. Substrate rotation and holding device for substrate processing equipment.