JPH0442303B2 - - Google Patents

Description

[Detailed Description of the Invention] (1) Purpose of the Invention [Field of Industrial Application] The present invention relates to a substrate conveyance device, and is particularly effective when applied to a substrate conveyance device used in a thin film attachment device. It is related to technology.

[Prior Art] A printed wiring board used in electronic equipment such as a computer has a predetermined pattern of wiring made of copper or the like formed on one or both sides of an insulating substrate.

This type of printed wiring board can be manufactured by the following manufacturing process.

First, on a conductive layer provided on an insulating substrate,
A laminate consisting of a photosensitive resin (photoresist) layer and a transparent resin film (protective film) that protects it is laminated (attached) by thermocompression. This thermocompression bonding lamination is carried out in mass production using a thin film pasting device, a so-called laminator. Thereafter, a wiring pattern film is placed on the laminate, and the photosensitive resin layer is exposed to light for a predetermined period of time through the wiring pattern film and the transparent resin film. After the transparent resin film is peeled off using a peeling device, the exposed photosensitive resin layer is developed to form an etching mask pattern. Thereafter, unnecessary portions of the conductive layer are removed by etching, and the remaining photosensitive resin layer is further removed to form a printed wiring board having a predetermined wiring pattern.

[Problems to be solved by the invention] In the manufacturing process of the above-mentioned printed wiring board,
What is required is a step of thermocompression laminating (adhering) a laminate consisting of a photosensitive resin layer and a transparent resin film to an insulating substrate with conductive layers on both sides.

The laminate to be applied to the substrate is obtained by pulling out the laminate that is continuously wound around the supply roller of the thin film adhering device and cutting it into pieces corresponding to the dimensions of the substrate.

The substrate conveying device that conveys the substrate to the position of the thermocompression roller is provided with a plurality of rotating bodies each having a plurality of disc-shaped rollers (pinch rollers) inserted therein, and rotates the rotating bodies to move the substrate. When approaching the thermocompression roller, the substrate is brought closer to the center line in the conveyance direction by a fixed guide member, and is then bitten by the thermocompression roller.

However, even if the substrate is accurately set on the transport center line, the supply position of the thin film to be laminated and the set position of the substrate may be misaligned.
At that time, it was difficult to correct the amount of deviation.

The above-mentioned and other problems and novel features to be solved by the present invention will become clear from the description of this specification and the accompanying drawings.

(2) Structure of the Invention [Means for Solving the Problems] Among the inventions disclosed in this application, a brief overview of typical inventions is as follows.

That is, the present invention provides: (a) a substrate transport device for a thin film pasting device that transports a substrate by a transport roller and a presser roller,
A substrate width adjustment device 21 that aligns the center line of the substrate width adjustment members 21B, 21B' which are provided on both sides of the transport path of the substrate 17 and are accessible to each other with the center line of the substrate transport direction; Board position detection sensor 22 that detects the rear end
As soon as the substrate position detection sensor 22 detects that the substrate 17 is at a predetermined position along the transport path, the substrate width adjusting member 2
Means 21 for starting the movement of 1B and 21B' from their initial relatively distant positions and bringing them close to each other.
As soon as the amount of movement of the board width adjusting members 21B, 21B' reaches a distance corresponding to the horizontal width of the board 17, the board width adjusting members 21B, 21B' move.
substrate width detection sensors 23A, 23B that stop the movement of the substrate width adjustment device 21B'; and a width adjustment device moving mechanism 2 that aligns the center line of the substrate width adjustment device 21 with the center line of the thin film attached to the substrate.
The most important feature is that it is equipped with 1F, 21F', 21G, and 21H.

(b) The substrate position detection sensor 22 is characterized in that it is attached at a predetermined position before the substrate width detection sensors 23A and 23B in the transport direction.

(C) The substrate width detection sensors 23A and 23B are characterized in that they detect the ends of the substrate 17 in the width direction.

[Operation] According to the present invention, the substrate on the conveyance roller is conveyed while being pressed by the presser roller by driving the conveyance roller. When a substrate is being transported, the leading edge or trailing edge of the transported substrate is detected by a substrate position detection sensor, and this detection signal starts the operation of a substrate width adjustment (course correction) device. A substrate width detection sensor attached to a substrate width adjustment (substrate course correction) device detects both ends of the substrate, and this detection signal causes the operation of the substrate width adjustment device to be stopped. This makes it possible to accurately and easily match the center line of the substrate in the conveying direction with the center line of the substrate in the conveying direction, and convey even a thin substrate to the thermocompression roller position without causing any deflection. .

In addition, even if the substrate is accurately set on the center line of the substrate transport device, if the supply position of the thin film to be laminated and the set position of the substrate are misaligned,
The substrate width shifting device moving mechanism allows the center line of the substrate width shifting device to match the center line of the thin film laminated to the substrate, thereby correcting the amount of deviation.

[Example] Hereinafter, a thin film pasting device (laminator) for laminating a laminate consisting of a photosensitive resin layer and a transparent resin film to a printed wiring board by thermocompression bonding will be described.
An embodiment applied to a substrate transport device used in the present invention will be described with reference to the drawings.

In addition, in all the figures of the embodiment, parts having the same functions are given the same reference numerals, and repeated explanations thereof will be omitted.

FIG. 2 shows a schematic configuration of a thin film pasting device using a substrate conveying device according to an embodiment of the present invention.

In the thin film pasting device of this embodiment, as shown in FIG. is wrapped around. The laminate 1 of the supply roller 2 is separated by the peeling roller 3 into a laminate 1B consisting of a transparent resin film (protective film) 1A, a photosensitive resin layer with one side (adhesive surface) exposed, and the transparent resin film. It is separated into

The separated translucent resin film 1A is configured to be wound up by a winding roller 4.

The leading end of the laminate 1B in the feeding direction is configured to be attracted to the main vacuum plate 6 via a tension roller 5 that provides an appropriate tension. Main vacuum plate 6
is supported by a frame 8 via an air cylinder 7 whose position can be varied in the direction of arrow A.
The main vacuum plate 6 is attached to the laminate 1 so as not to cause wrinkles or the like together with the tension roller 5.
It is configured to supply B to the substrate 17 side.

The arcuate portion 6A at the tip of the main vacuum plate 6 is provided with a heater 6B therein, and is configured to temporarily thermocompress and laminate the tip of the laminate 1B onto the conductive layer of the substrate 17. There is.

A rotary cutter 9 for cutting the continuous laminate 1B according to the dimensions of the substrate 17 is provided at a position close to the arcuate portion 6A.

At a position facing the rotary cutter 9, the seat end portion of the cut laminate 1B is placed in the arcuate portion 6A.
A sub-vacuum plate 10 is provided which is adsorbed to. This subvacyum plate 10
is supported by the frame 8 via an air cylinder 11 whose position can be varied in the direction of arrow B.

A frame 8 supporting the main vacuum plate 6 and the sub vacuum plate 10 is supported by a frame 13 of the main body of the apparatus via an air cylinder 12 whose position can be varied in the direction of arrow C.

A laminate 1B in which the tip of the arc-shaped portion 6A is laminated on the conductive layer of the substrate 17 by temporary thermocompression bonding.
is configured such that the entire body is laminated by thermocompression using a thermocompression roller 14. The thermocompression roller 14 is configured to move from the position indicated by the dotted line marked 14' in FIG. 2 to the position indicated by the solid line after temporarily thermocompression bonding the tip of the laminate 1B with the arcuate portion 6A. There is.

Laminated body 1B cut with the rotary cutter 9
The rear end portion is guided by a triangular rotating vacuum plate 15 to prevent wrinkles, etc., and is configured to be laminated by thermocompression bonding with a thermocompression roller 14.

The thin film pasting device configured in this manner applies a conductive layer to both sides (or one side) of an insulating substrate that is conveyed by the substrate conveyance device 16, which includes a conveyance roller 16A, a presser roller 16B, etc., using the above-mentioned configurations. The laminate 1B is thermocompression laminated onto the provided substrate 17. The laminate 1B is configured to be thermocompression-bonded and laminated onto the substrate 17 so that the adhesive surface of the photosensitive resin layer from which the transparent resin film 1A has been peeled and the conductive layer surface adhere to each other.
A substrate 17 on which the laminate 1B is laminated by thermocompression bonding
is carried out to the outside by a substrate carrying-out device 18.

A schematic configuration of the substrate transport device 16 is shown in FIG.

As shown in FIG. 1, the substrate transport device 16 includes:
It is connected to a thin film pasting device (laminator). The transport rollers 16A are made of a cylindrical member (solid or hollow: preferably hollow) made of fiber-reinforced plastic, and the plurality of transport rollers 16A are rotatably attached to the frame 20 of the main body of the substrate transport device 16. . These plural conveyance rollers 16
A are arranged at predetermined intervals so that the ends of the thin substrate 17 do not sag. Also, every other conveyance roller 16 among the plurality of conveyance rollers 16A
Only A is connected to a drive source (not shown). Further, the drive source may be connected to every second conveyance roller 16A or all conveyance rollers 16A as necessary.

The substrate 17 is placed on the conveyance roller 16A, and is conveyed while being pressed by a presser roller 16B.Waviness and warping of the thin substrate 17 is corrected. When using a very thin substrate 17 that is easily wavy or warped, the holding roller 16B is connected to the conveying roller 16A to prevent the edge of the substrate 17 from getting caught on a rotating body made of a disc-shaped member and stopping. Similarly, it is composed of a cylindrical member and is rotatably attached to the frame 20. Although the presser roller 16B is not connected to a drive source, it may be connected. Also,
When using the substrate 17 which is not very thin and is less susceptible to waving or warping, the pressing roller 16B may be a rotating body having a plurality of disc-shaped members inserted therein.

Reference numeral 21 denotes a substrate width adjusting device, which is used to align the center line of the substrate 17 in the transfer direction with the center line of the substrate 17 in the transfer direction. This board width adjusting device 21 is shown in FIG. 3 (cross-sectional view taken along the Y-Y line).
As shown in FIG. 4 (perspective view), the support member 2
1A, 21A' board width adjustment members 21B, 21
It is configured to support B′. This support member 2
1A and 21A' are each slidably attached to a support rod 21C. The support members 21A, 21A' are connected to the pulley 21D and the pulley 2.
When the endless belt 21E is moved in the direction of arrow D,
are mounted close to each other. The support members 21A, 21A' are slid by an air cylinder 21 provided on the support member 21A'. The pulleys 21D, 21D' are supported by inverted L-shaped support members 21F, 21F', respectively. These inverted L-shaped support members 21F, 21F' are engaged with a threaded rod 21G. A handle 21H is attached to the threaded rod 21G, and by rotating the handle 21H, the inverted L-shaped support members 21F and 21F' are moved from side to side while keeping the distance between them constant. ing. This moving mechanism (or fine adjustment mechanism)
7 and the center line in the transport direction of the laminate 1B to be laminated by thermocompression bonding, that is, the center line of the substrate transport device 16, if the center line of the board transport device 16 deviates from the center line of the board transport device 16, the center line of the board width adjustment device 21 is adjusted to match the center line of the board transport device 16. This is to adjust the position. The position of the board width adjustment device 16 is fixed by a screw 21J that fixes the rotation of the threaded rod 21G.

22 is a board position detection sensor that detects the front end (or rear end) of the board 17;
This is for generating a drive start signal for the substrate width adjusting members 21B and 21B'. This board position detection sensor 22 is mounted on a frame 20 with a supporting frame 2.
It is attached via 2A. The substrate position detection sensor 22 uses, for example, a reflective optical sensor.

Reference numerals 23A and 23B are substrate width detection sensors that respectively detect both ends of the substrate 17, and are used to generate a drive stop signal for the substrate width adjustment members 21B and 21B' of the substrate width adjustment device 21. These substrate width detection sensors 23A and 23B are connected to the support member 2.
They are attached near the tips of the substrates 1A, 21A' in the transport direction, and on the inner side of the substrate width adjusting members 21B, 21B'. That is, the substrate width detection sensors 23A and 23B are provided at positions where the substrate width adjusting members 21B and 21B' are stopped when the center line of the substrate 17 and the center line of the substrate conveyance device 16 match. Board width adjustment device 2
In the control No. 1, the substrate width adjusting members 21B,
This can be easily realized by generating a drive operation stop signal of 21B'. Board width detection sensor 23
For example, transmission type optical sensors are used for A and 23B.

In this way, the substrate width adjustment device 21 is provided to match the center line of the substrate 17 in the transfer direction with the center line of the substrate transfer device 16 in the transfer direction.
A substrate position detection sensor 22 that starts the operation of the substrate width adjustment device 21, and substrate width detection sensors 23A and 23B that stop the operation of the substrate width adjustment device 21.
By providing this, the substrate 17 can be brought to the thermocompression bonding starting position with the center line of the substrate 17 in the conveying direction aligned with the center line of the substrate conveying device 16 in the conveying direction without causing any deflection of the substrate 17. It can be transported accurately and easily.

In addition, in order to automatically control the substrate width adjustment device moving mechanism that matches the center line of the substrate width adjustment device with the center line of the thin film laminated on the substrate, the laminated thin film is placed at a predetermined position of each upper and lower lamination thin film supply path. A thin film width detection sensor (not shown) is provided to detect the width of the upper and lower laminated thin films, and these detection signals and the substrate width detection sensors 23A and 23B are inputted to a control device (not shown), and the upper and lower laminated thin films are controlled by software. It is also possible to align the center line of the substrate width adjusting device and the center line of the thin film to be laminated on the substrate 17 by controlling the substrate width adjusting device moving mechanism.

The substrate holding member 24 shown in FIG. 1 is used to fix the substrate 17 and hold it so that it does not fall when the substrate 17 reaches the thermocompression bonding starting position. This board holding member 24 is shown in FIG. 5 (side view).
As shown, it is attached to the frame 20 and moved in the direction of arrow E by an air cylinder and spring (not shown).
Further, the substrate support member 25 is designed to protrude in the direction of arrow F in conjunction with or not in conjunction with the driving operation of the substrate holding member 24. This board support member 25
The control in the direction of arrow F is performed by an air cylinder 25A provided on the frame 20, as shown in FIG. 6 (side view). The operation of the substrate holding member 24 or the substrate supporting member 25 is controlled by a drive start signal or a drive stop signal from a substrate position detection sensor (not shown).

In this way, the board holding member 24 and the board supporting member 2
5 to support the substrate 17 so that it does not fall when the substrate 17 reaches the thermocompression bonding start position, and to hold the substrate 17 in a predetermined position until the thermocompression rollers sandwich the substrate 17 from above and below. Therefore, the laminate 1B can be accurately thermocompressed and laminated onto the substrate 17.

Next, the operation of the substrate conveyance apparatus of this embodiment will be briefly described.

In FIG. 1, the substrate 17 is conveyed toward the thermocompression roller 14 by driving a predetermined conveyance roller 16A among the plurality of conveyance rollers 16A. When the substrate 17 is transported and its leading edge is detected by the substrate position detection sensor 22, the substrate width adjusting device 21 starts its operation in response to a drive start signal. The substrate width adjusting device 21 operates to align the center line of the substrate 17 with the center line of the substrate transport device 16 using the substrate width adjusting members 21B and 21B'. After that, the board width detection sensor 23
When both ends of the substrate 17 are detected by A and 23B, the drive operation signal causes the substrate width adjustment device 21 to
operation stops. As a result, the substrate 17 is transported to the thermocompression bonding position in a state in which the center line of the substrate 17 in the transport direction matches the center line of the substrate transport device 16 in the transport direction. At this time, a substrate position detection sensor (not shown) stops the drive of the transport roller 16A, and the holding member 24 moves downward to press the substrate 17 and prevent it from moving. At the same time, the substrate support member 25 comes to protrude and the substrate 17
Support to prevent it from falling.

Thereafter, as shown in FIG.
4 moves to the left toward the substrate 17, and clamps the substrate 17 with the temporary thermocompression bonded laminate 1B interposed therebetween. In this state, the thermocompression roller 14 and the conveyance roller 16A are driven, and the laminate 1B is thermocompression laminated onto the substrate 17.

Although the present invention has been specifically explained based on Examples above, the present invention is not limited to the above Examples, and within the scope of the gist thereof,
It goes without saying that various modifications can be made.

For example, in the above embodiment, when correcting the positional deviation between the substrate and the thin film to be laminated by the substrate width adjusting device moving mechanism, the set positions of the upper and lower thin films to be laminated are detected and automatically controlled. However, it is also possible to fix one of the set positions of the upper and lower laminated thin films, make only the other set position movable, and detect the position of only the movable set position.

Further, the present invention can be applied to a substrate transport device used in a thin film peeling device.

[Effects of the Invention] As described above, according to the present invention, there is provided a substrate width adjustment device that matches the center line of the substrate in the transportation direction with the center line of the substrate transportation device in the transportation direction, and the substrate width adjustment device By providing a substrate width adjusting device moving mechanism for correcting the amount of deviation between the center line of the substrate and the center line of the thin film laminated on the substrate, it is possible to easily correct the positional deviation between the substrate and the thin film to be laminated. This makes it possible to accurately laminate thin films onto substrates.

Furthermore, by providing the center line of the substrate width adjustment device, a substrate position detection sensor that starts the operation of the substrate width adjustment device, and a substrate width detection sensor that stops the operation of the substrate width adjustment device, the center line of the substrate in the transport direction can be adjusted. The substrate can be accurately and easily transported to the thermocompression bonding start position in a state where the line and the center line in the transport direction of the substrate transport device are aligned without causing any deflection of the board.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a schematic configuration of a substrate conveyance device according to an embodiment of the present invention, and FIG. 2 is a schematic diagram showing a schematic configuration of a thin film pasting device related to the substrate conveyance device of this embodiment. , FIG. 3 is a sectional view taken along the Y-Y line in FIG. 1, FIG. 4 is a perspective view showing the configuration of the board width adjusting device shown in FIG. 3, and FIG. 6 is a side view showing the structure of the substrate width detection sensor, the holding member, and the substrate support member. FIG. 6 is a side view showing the structure of the substrate support member shown in FIG. 1. In the figure, 16...Substrate transport device, 16A...Transport roller, 16B...Press roller, 20...Frame of substrate transport device main body, 17...Substrate, 21
... Board width adjusting device, 21A, 21A'... Support member, 21B, 21B'... Board width adjusting member, 2
1C...Support rod, 21E...Endless belt, 21
D, 21D'...Pulley, 21F, 21F'...Reverse L
Character-shaped support member, 21G... Threaded rod, 21H... Handle, 21J... Fixing screw, 22... Board position detection sensor, 23A, 23B... Board width detection sensor, 24... Board holding member, 25... It is a substrate support member.

Claims (1)

[Scope of Claims] 1. A substrate conveyance device for a thin film pasting device that conveys a substrate by a conveyance roller and a holding roller, which includes substrate width aligners that are provided on both sides of a conveyance path of the substrate 17 and that are accessible to each other. A substrate width adjusting device 21 that aligns the center lines of the members 21B and 21B' with the center line of the substrate in the transport direction, a substrate position detection sensor 22 that detects the leading edge or trailing edge of the substrate, and the substrate 1
Immediately after the substrate position detection sensor 22 detects that the substrate 7 is at a predetermined position along the conveyance path, the substrate width adjustment members 21B and 21B' are started to move from the initial relatively distant positions to mutually move them. means 21 for bringing the substrate closer together; and the substrate width adjusting member 2
substrate width detection sensors 23A, 23B that stop the movement of the substrate width adjustment members 21B, 21B' as soon as the amount of movement of the substrate width adjustment members 1B, 21B' reaches a distance corresponding to the width of the substrate 17; A substrate transport device for a thin film pasting device, characterized in that it is equipped with width adjusting device moving mechanisms 21F, 21F', 21G, and 21H for aligning the center line of the device 21 with the center line of a thin film pasted on a substrate. 2. The thin film pasting device according to claim 1, wherein the substrate position detection sensor 22 is installed at a predetermined position before the substrate width detection sensors 23A and 23B in the transport direction. Substrate transport device. 3. The substrate conveyance device for a thin film attachment device according to claim 1 or 2, wherein the substrate width detection sensors 23A and 23B detect the ends of the substrate 17 in the width direction. .