JPH0442557A - Chip-shaped part pickup apparatus - Google Patents

Abstract

PURPOSE:To reduce frequency in generation of defect of chip-shaped part in the pickup operation by providing a structure that the end point of the sticking pin, among a plurality of sticking pins, located at the region irradiated with an energy beam such as ultraviolet ray or at the diagonal part thereof is more separated from the adhesive tape than the end points of the other sticking pins. CONSTITUTION:When a semiconductor chip 2 is sticked upward by sticking pins 3b to 3d, since adhesive force of the expand tape 1 at the region irradiated with the ultraviolet ray is lowered, the expand tape 1 is easily peeled from this region. Thereby, since the end point of the sticking pin 3a is separated from the expand tape 1, the semiconductor chip 2 is inclined around the diagonal line thereof, a part of the peeled angled area is separated and floated from the sticking pin 3d and the peeling of expand tape 1 progresses up to the center of the semiconductor chip 2. The sticked semiconductor chip 2 is absorbed and held with a collet 5 positioned at the upper part of this semiconductor chip 2 and the semiconductor chip 2 is peeled from the expand tape 1 and is picked up.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a method for peeling off chip-shaped components such as semiconductor chips that are adhesively fixed to an adhesive tape such as an expandable tape one by one from the adhesive tape. Regarding the device for picking up.

[Conventional technology]

In the manufacturing process of semiconductor devices, hybrid ICs, etc., chip-shaped parts such as semiconductor chips fixed on adhesive tape such as expanded tape are peeled off from the adhesive tape, picked up, and placed on a predetermined substrate. Die bonding and storage in a predetermined tray are performed. Then, in order to make it easier for the chip-like parts to peel off from the adhesive tape, the chip-like parts are pushed up from the back side of the adhesive tape (the side to which the chip-like parts are not fixed) using a push-up bottle to facilitate the peeling of the adhesive tape. ing.

However, chip-shaped components picked up from adhesive tapes as described above, especially recent large-scale integrated circuit devices, have become larger and flatter.

For this reason, excessive stress is applied to the chip-shaped component when the chip-shaped component is pushed up, and the frequency with which defects such as cracks and chips occur in the chip-shaped component increases. Under these circumstances, it has been proposed to use a plurality of push-up bins to simultaneously push up each corner of a chip-like component, thereby preventing the concentration of stress that occurs in the chip-like component during push-up, and thereby reducing the frequency of defects in the chip-like component. Ta. Furthermore, by setting the tip of the push-up bin located at a position corresponding to a predetermined corner of the plurality of push-up bins farther from the adhesive tape than the tips of the other push-up bins, peeling of the adhesive tape is facilitated and the pickup is It has been proposed to reduce the frequency of defects occurring in chip-like parts (for example,
2-56264).

Moreover, some adhesive tapes are known to have their adhesive strength reduced by being irradiated with energy rays such as ultraviolet rays. Therefore, in order to reduce defects that occur in chip-shaped parts when they are picked up from above the adhesive tape, it is desirable to irradiate the adhesive tape with energy rays such as ultraviolet rays before picking up the chip-shaped parts.

[Problem to be solved by the invention]

However, when the entire surface of the adhesive tape is irradiated with energy rays such as ultraviolet rays in order to weaken the adhesive strength of the adhesive tape, the adhesive strength of the entire adhesive tape decreases. For this reason, while one chip-shaped component is being picked up, other chip-shaped components may be displaced from their fixing positions or may come off from the adhesive tape. In addition, if you pick up a part of the chip-like parts that are adhesively fixed on the adhesive tape and try to store the remaining chip-like parts with the remaining chip-like parts adhesively fixed on the adhesive tape, some external force may be applied during storage. However, there are inconveniences such as the fixed position of the chip-shaped component being shifted or the chip-shaped component peeling off from the adhesive tape, and it is not suitable for re-storing the chip-shaped component.

Therefore, in view of the above-mentioned circumstances, the present invention reduces the frequency of defective chip-like parts during pickup, and also allows the chip-like parts left on the adhesive tape to remain adhesively fixed with a strong enough adhesive force for preservation. , the purpose is to be able to re-save it.

[Means to solve the problem]

In order to achieve the above-mentioned object, in the present invention, energy rays such as ultraviolet rays are irradiated to the adhesive surface of the adhesive tape, where the corners of the chip-shaped parts are adhesively fixed, to increase the adhesive strength of that area. Among a plurality of push-up bottles that push up each corner of the chip-shaped component from the side opposite to the adhesive surface, the portion irradiated with energy rays such as ultraviolet rays or the tip of the push-up bottle located diagonally thereto The tip of the push-up bottle other than these is configured to be further away from the adhesive tape.

[Effect]

By doing so, concentration of stress generated in the chip-shaped component when the chip-shaped component is pushed up is prevented, and the frequency of occurrence of defects in the chip-shaped component due to pushing up is reduced. In addition, the adhesive tape peels off from the corner of the chip-shaped component fixed to the part where the adhesive strength has decreased due to UV irradiation, and this causes the adhesive tape to peel off smoothly from the entire bottom surface of the chip-shaped component. be done.

〔Example〕

Embodiments of the present invention will be described below with reference to FIGS. 1 to 5.

FIG. 1 schematically shows the characteristic parts of a semiconductor chip pickup device to which the present invention is applied. This pickup device pushes up a plurality of semiconductor chips 2 that are adhesively fixed to the adhesive surface of the expanding tape 1 one by one from the back side of the expanding tape 1 (the side where the semiconductor chips 2 are not adhesively fixed) with the tip 4. The push-up pins 3a to 3d of the book, the collet 5 that attracts and holds the pushed-up semiconductor chips 2 one by one from the front side of the expand tape 1 and peels them off from the expand tape 1, and the collet 5 that holds the pushed up semiconductor chips 2 one by one from the front side of the expand tape 1, and The mask 7 includes an ultraviolet source 6 that irradiates ultraviolet rays, and a mask 7 that is disposed between the ultraviolet source 6 and the expand tape 1 and allows only a predetermined portion to transmit the ultraviolet rays. The expandable tape 1 is made of a stretchable resin or the like that transmits ultraviolet rays, and an adhesive material whose adhesive strength decreases when irradiated with ultraviolet rays is coated on its front side. Therefore, if the expandable tape 1 is irradiated with ultraviolet rays from the back side, the adhesive strength of the portion irradiated with ultraviolet rays will be reduced. The mask 7 is formed with a through hole 7a perforated in such a portion so that only the portion corresponding to the corner of each semiconductor chip 2 fixed to the expandable tape 1 transmits ultraviolet rays, or , only that part is made of UV-transparent material. Therefore, when the ultraviolet rays are irradiated from the ultraviolet ray source 6 to the expandable tape 1 with this mask 7 in between, only the adhesive strength of the portions where the corners of each semiconductor chip 2 are fixed is reduced. That is, in this embodiment, each semiconductor chip 2
The mask 7 and the ultraviolet source 6 constitute an ultraviolet irradiation means that irradiates ultraviolet rays only to the fixed corner portions.

FIG. 2 shows an enlarged view of the arrangement of the push-up pins 3a to 3d in relation to the bottom surface of the semiconductor chip 2 fixed to the expandable tape 1. Note that in the figure, the hatched area is the area irradiated with ultraviolet light.

The four push-up pins 3a to 3d are arranged symmetrically and evenly on the diagonal of the semiconductor chip 2 at positions corresponding to each corner thereof. Among them, the tip of the push-up pin 3a is located further away from the expanded band tape 1 than the tips of the other push-up pins 3b to 3d. In other words, the semiconductor chip 2 fixed to the part irradiated with ultraviolet rays
Push-up pin 3 located corresponding to the diagonal part to the corner of
The tip of a is located further away from the expandable tape 1 than the tips of the other push-up pins 3b to 3d.

Note that the extended tape 1 referred to here refers to the tape in the state set in the pickup device, and refers to the tape in the state not pushed up by the push-up pins 3a to 3d.

Next, a description will be given of how the semiconductor chip 2 on the expanded tape 1 is picked up by the above-mentioned pickup device.

First, when the expandable tape 1 to which a plurality of semiconductor chips 2 are adhesively fixed is set in a pickup device, the mask 7 is positioned in accordance with the arrangement of the semiconductor chips 2. The ultraviolet light source 6 irradiates only the corners of each semiconductor chip 2 with ultraviolet light. After the ultraviolet irradiation, the mask 7 is removed and the semiconductor chip 2 is pushed up by the push-up pins 3a to 3d. During this pushing up, the semiconductor chip 2 is first pushed up evenly by the pushing up pins 3b to 3d. Therefore, stress caused by pushing up is not concentrated in one place, but is dispersed, and the frequency of occurrence of defects such as cracks and chips in the semiconductor chip 2 is reduced.

FIG. 3 shows how the expandable tape 1 is peeled off from the semiconductor chip 2 when the semiconductor chip 2 is pushed up by the push-up pins 3a to 3d.

As shown in FIG. 2(a), when the semiconductor chip 2 is pushed up by the push-up pins 3b to 3d, the adhesive strength of the expandable tape 1 in the part irradiated with ultraviolet rays has decreased, so that Peeling of the extract band tape 1 occurs easily. Then, extract band tape 1
In the part where the semiconductor chip 2 is peeled off, the force that pulls the semiconductor chip 2 downward no longer acts, and the balance of the force that pulls the semiconductor chip 2 downward on both sides of the diagonal line connecting the push-up pins 3b and 3c is lost. Then, since the tip of the push-up pin 3a is located away from the expand band tape 2, the semiconductor chip 2 is tilted about the diagonal line as shown in FIG. 3d, and the peeling of the extended band tape 1 progresses to the center of the semiconductor chip 2. The pushed-up semiconductor chip 2 is sucked and held by the collet 5 positioned above the semiconductor chip 2, and as the collet 5 rises, the semiconductor chip 2 is peeled off from the expanded tape 1 and picked up. Note that if a part of the outer periphery of the adhesive area to which the semiconductor chip 2 is adhesively fixed (in this example, the corner part of the semiconductor chip 2 fixed to the area irradiated with ultraviolet rays) peels off, that part Even if the adhesive strength of the entire adhesive area has not decreased, the peeling will proceed smoothly throughout the adhesive area. Therefore, even if the semiconductor chip is large and flattened, the semiconductor chip can be easily peeled off from the expanded tape and picked up without increasing the vacuum suction force of the collet 5.

Furthermore, even if a part of the semiconductor chips 2 adhesively fixed on the expandable tape 1 is picked up and the remaining semiconductor chips 2 are to be stored while being adhesively fixed on the expandable tape 1, Since the irradiation area of ultraviolet rays is limited and the adhesive strength of the entire adhesive area where the semiconductor chip 2 is fixed is not reduced, the semiconductor chip 2 left on the expandable tape 1
It has a strong enough adhesive force to preserve the material and can be re-preserved with the adhesive fixed.

Next, a second embodiment of the present invention, which is different from the embodiments described above, will be described with reference to FIGS. 4 and 5.

In the above-described embodiment shown in FIGS. 1 to 3, the tip of the push-up bottle 3a on the diagonal side of the part irradiated with ultraviolet rays is separated from the expandable tape 1, but instead of this, As shown in FIG. 4, the tip of the push-up bin 3d provided at a position corresponding to the corner of the semiconductor chip 2 fixed to the part irradiated with ultraviolet rays is connected to the other push-up bins 3a to 3C. is further away from the expanding tape than the tip of the FIG. 5 shows how the expanded tape 1 is peeled off in this case. First, when the push-up bottles 38 to 3C come into contact with the expanding tape 1 and the semiconductor chip 2 is pushed up, the expanding tape 1
Peeling begins from the portion where the push-up bottle is not in contact and where the adhesive strength has decreased due to irradiation with ultraviolet rays, and this peeling progresses to the center of the semiconductor chip 2. Then, the semiconductor chip 2 is attracted and held by the collet 5, and the semiconductor chip 2 is peeled off from the expanded tape 1 and picked up. In this case, as shown.

Since the semiconductor chip 2 does not tilt, the collet 5 can easily attract and hold the semiconductor chip 2, which is preferable.

Next, the results of an experiment in which the present invention was applied to picking up a 5-dragon semiconductor chip will be described.

The adhesive fixing force of each semiconductor chip is approximately 30% before UV irradiation.
0 g, and the adhesive fixing force after irradiating ultraviolet rays to the portion where the corner of the semiconductor chip was fixed was 250 g. In this case, when I performed the pickup mentioned above,
The frequency of defects such as cracks in semiconductor chips that occur during push-up can be reduced by irradiating the entire adhesive area with ultraviolet rays to increase the adhesive strength by 10%.
It was comparable to the conventional case where the adhesive strength was reduced to 0g9.Also, since the area where the adhesive strength is reduced by being irradiated with ultraviolet rays is limited, the semiconductor chip 2 left on the expandable tape 1 can be re-preserved. It had sufficient adhesive strength and could be re-stored.

Incidentally, the above-mentioned ultraviolet ray irradiation itself involves condensing the ultraviolet rays emitted from the ultraviolet source 6 and guiding the ultraviolet rays by a light guide or the like to direct a spot light of the ultraviolet rays onto the corners of each semiconductor chip 2. - It is also possible to irradiate each knob in turn. However, as in the above-mentioned embodiment, if the UV rays are irradiated all at once using the mask 7 on the portions where the corners of each semiconductor chip 2 are fixed, then the push-up means Since a semiconductor chip can be picked up with only two steps: a push-up step using a push-up step and a back-up step using a collet, it is possible to shorten the time required for one pick-up operation (takt time).

Note that the present invention is not limited to the embodiments described above, and various modifications are possible.

For example, in the above-described embodiment, the tips of the push-up pins 3a and 3d may be placed further away from the stretch band tape 1 than the push-up pins 3b and 3c.

Further, in the above-mentioned embodiment, an example is shown in which the present invention is applied to the pickup of the semiconductor chip 1 adhesively fixed on the expanded band tape 1, but the present invention is not limited to this, and the adhesive of the expanded band tape etc. The present invention is also applicable to picking up chip-shaped components such as chip capacitors and chip resistors that are adhesively fixed to tape.

Further, in the above embodiments, ultraviolet rays are used as the energy rays, but it is preferable to use energy rays that can efficiently reduce the adhesive force depending on the adhesive material used in the adhesive tape such as expanded tape. For example, for adhesive tape coated with an adhesive whose adhesive strength is effectively reduced by infrared irradiation,
It is preferable to use infrared rays as the energy beam.

〔Effect of the invention〕

As explained above, according to the present invention, the concentration of stress that occurs in chip-shaped parts when pushing up the chip-shaped parts is prevented, the frequency of occurrence of defects such as cracks in the chip-shaped parts due to pushing up is reduced, and the yield is improved. do.

In addition, the adhesive tape peels off from the corner of the chip-shaped component fixed to the part where the adhesive strength has decreased due to UV irradiation, and this causes the adhesive tape to peel off smoothly from the entire bottom surface of the chip-shaped component. be done. Therefore, it is possible to pick up chips smoothly without reducing the adhesive strength of the entire adhesive area where chip-shaped parts are adhesively fixed, and even when UV rays are irradiated all at once, the chip-shaped parts left on the adhesive tape can be picked up easily. It is possible to re-save the parts while fixed on the adhesive tape with a strong enough adhesive force for storage.

[Brief explanation of the drawing]

FIG. 1 is a diagram schematically showing the characteristic parts of a pickup device to which the present invention is applied, FIG. 2 is a diagram showing the arrangement of push-up pins in relation to the bottom surface of a semiconductor chip, and FIG. Figure 4 shows the arrangement of the push-up pins, which is different from Figure 2. Figure 5 shows how the expandable tape peels off, similar to Figure 3. This is a diagram. 1... Expanded tape, 2... Semiconductor chip,
3a, 3b, 3c, 3d... push-up pin, 5...
Collet, 6...UV source, 7...Mask.

Claims (1)

[Scope of Claims] A device for holding a plurality of chip-shaped parts adhesively fixed at a rectangular bottom surface on the adhesive surface of an adhesive tape whose adhesive strength is reduced by irradiation with energy rays using a collet, peeling them off from the adhesive tape, and picking them up. means for irradiating an energy beam to a portion of the adhesive surface to which one corner of each chip-like component is fixed, out of a portion of the adhesive surface where each chip-like component is adhesively fixed; and the chip-like component. are placed at positions corresponding to each corner of the
a plurality of push-up pins that come into contact with the adhesive tape from the side opposite to the adhesive surface at a tip end and push up the chip-like component; At least one tip of the push-up pin located corresponding to a corner or a diagonal corner thereof of the chip-shaped part is further away from the adhesive tape than the tips of other push-up pins. Parts pickup device.