JPH0442598A - High frequency components and their manufacturing methods - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a high frequency component used in high frequency equipment and a method for manufacturing the same.

Conventional technology The conventional configuration was as shown in FIG.

That is, various electronic components 2 are mounted on the upper and lower surfaces of the wiring board 1.

Further, a plurality of lead-out terminals 3 are drawn out downward from the wiring board 1. In this state, these outer peripheries are covered with metal shield covers 4a, 4b, thereby preventing the intrusion of unnecessary radio waves and preventing the outside view.

Note that the lead terminal 3 is drawn out through a through hole in the shield cover 4b.

As shown in FIG. 3, this high frequency component is mounted on the board 5 by passing the lead terminal 3 through the through hole 5a of the board 5 and fixing it with solder 6 on the back side thereof.

Problems to be Solved by the Invention However, the device shown in FIG. 3 inevitably becomes large in size, and there is a problem in that it becomes impossible to downsize products that use it, such as mobile phones.

In other words, the shield covers 4a and 4b are absolutely necessary for shielding, but since they are made of metal, dimensional errors and mutual errors may occur if a sufficient distance is not maintained between them and the various electronic components 2. This results in an electrical short circuit with the electronic component 2.

Therefore, these shield covers 4a, 4b are spaced apart from the electronic component 2 in the upper and lower directions, which results in an increase in size.

Therefore, an object of the present invention is to miniaturize the device.

Means for Solving the Problems In order to achieve this object, the present invention molds a wiring board on which electronic components are mounted with a resin body, and provides a metal coating on the outer surface of the resin body. It is something.

Function: With the above configuration, since the metal coating is provided on the outer surface of the resin body covering the electronic components, shielding is reliably achieved by the metal coating. Furthermore, since a resin body is always interposed between the metal coating and the electronic component, even if the distance between the metal coating and the electronic component is reduced, an electrical short circuit between the two will not be prevented, resulting in the above-mentioned The distance can be shortened and the size can be significantly reduced.

Embodiment In FIG. 1, reference numeral 6 denotes a wiring board, and conductive patterns (not shown) are provided on the upper and lower surfaces thereof, and various electronic components 7 are mounted by soldering using the conductive patterns.

Further, when soldering the electronic component 7, the inner ends of a plurality of metal lead-out terminals 8 are sometimes soldered to the conductive pattern. In this soldering process, the outer end of the lead terminal 8 is sometimes not yet bent as shown in FIG. 1, but has a shape extending in the horizontal direction.

In this state, the outer circumferences of the wiring board 6 and the electronic component 7 are molded with the thermoplastic resin body 9 using a mold.

After this molding, a metal coating 10 is provided on the outer surface of the resin body 9 by solder plating on top of the copper plating.

Note that when providing this metal coating 10, the above-mentioned lead-out terminal 8
Among these, the peripheral edge of the base portion of the resin body 9 of the signal terminal 8a shown in FIG. 2 is masked to form a non-forming portion 11 in which the metal coating 10 is not formed.

Furthermore, since the ground terminal 8b portion of the lead-out terminal 8 is not masked, the metal coating 10 is in mechanical and electrical contact therewith.

When the formation of the metal coating 10 is completed, the lead terminal 8 is bent as shown in FIGS. 1 and 2, and its outer end is wrapped around the lower periphery of the resin body 9.

At this time, only the lower surface portion of the resin body 9 corresponding to the outer end portion of the signal terminal 8a is a portion where the metal coating 10 is not formed.

Therefore, if the lead terminal 8 is bent and fixed on the board 11 with the adhesive 12, the lead terminal 8 will come into contact with the conductive pattern Ila on the board 11, and will be electrically connected with the cream solder 13. A mechanical connection is made.

Effects of the Invention As described above, in the present invention, since a metal coating is provided on the outer surface of the resin body covering the electronic component, shielding is reliably achieved by the metal coating. Furthermore, since a resin body is always interposed between the metal coating and the electronic component, even if the distance between the metal coating and the electronic component is reduced, an electrical short circuit between the two will not be prevented, resulting in the above-mentioned The distance can be shortened and the size can be significantly reduced.

[Brief explanation of the drawing]

Figure 1 is a sectional view showing a high frequency component according to an embodiment of the present invention mounted on a board, Figure 2 is a perspective view of the same high frequency component, and Figure 3 is a conventional high frequency component mounted on a board. FIG. 6...Wiring board, 7...Electronic components, 8.
...Output terminal, 9...Resin body, 10...
...Metal coating.

Claims (5)

[Claims] (1) A wiring board, electronic components mounted on the wiring board, and a plurality of lead-out terminals drawn out from the wiring board,
A high frequency component comprising the wiring board and an insulating resin body in which an electronic component is molded, and a metal coating is provided on the outer surface of the resin body. (2) The high-frequency component according to claim (1), wherein at least one of the plurality of lead-out terminals is a ground terminal, and the ground terminal is electrically connected to the metal coating. (3) The high frequency component according to claim (2), wherein the tip of the ground terminal is bent and brought into contact with the metal coating. (4) For high-frequency components, electronic components are mounted on a wiring board and lead-out terminals are connected, then the outer periphery of these components is molded with an insulating resin body, and then a metal coating is applied to the outer surface of the resin body. Production method. (5) At least one of the extraction terminals is a ground terminal,
5. The method of manufacturing a high-frequency component according to claim 4, wherein the other terminals are signal terminals, and the resin body lead-out portion of the signal terminal is masked and provided with a metal coating.