JPH0442705U - - Google Patents
Info
- Publication number
- JPH0442705U JPH0442705U JP8480990U JP8480990U JPH0442705U JP H0442705 U JPH0442705 U JP H0442705U JP 8480990 U JP8480990 U JP 8480990U JP 8480990 U JP8480990 U JP 8480990U JP H0442705 U JPH0442705 U JP H0442705U
- Authority
- JP
- Japan
- Prior art keywords
- resistors
- lands
- insulating substrate
- resistor
- aluminum base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
Landscapes
- Details Of Resistors (AREA)
Description
第１図は本考案のシヤント抵抗器の一実施例を
示す斜視図、第２図および第３図は同シヤント抵
抗器の他の例を示す斜視図である。
図中、１はアルミ・ベース絶縁基板、２はボン
デイング、３はアルミワイヤ、４はランド、５は
部品である。
FIG. 1 is a perspective view showing one embodiment of the shunt resistor of the present invention, and FIGS. 2 and 3 are perspective views showing other examples of the shunt resistor. In the figure, 1 is an aluminum base insulating substrate, 2 is a bonding board, 3 is an aluminum wire, 4 is a land, and 5 is a component.
Claims (1)
成し抵抗器とし、アルミ・ベース等の絶縁基板上
に形成した２個のランドを設け、このランドに１
本もしくは複数本の前記抵抗器の両端をボンデイ
ング接続し、該アルミ・ベース等の絶縁基板を基
部として上部より金属ケースを被せ、内部を放熱
材にて充填してなるシヤント抵抗器。 (2) 上記アルミ・ベース等の絶縁基板上に形成
した複数のランドを設け、このランドに複数の上
記抵抗器を直列に載置し、抵抗器の各両端をボン
デイング接続してなる請求項(1)記載のシヤント
抵抗器。[Scope of Claim for Utility Model Registration] (1) A resistor is formed by forming an aluminum wire into a bridge shape as a resistor, and two lands formed on an insulating substrate such as an aluminum base are provided.
A shunt resistor in which both ends of one or more resistors are connected by bonding, the insulating substrate such as the aluminum base is used as a base, a metal case is covered from above, and the inside is filled with a heat dissipating material. (2) A claim in which a plurality of lands are formed on an insulating substrate such as the aluminum base, a plurality of the resistors are placed in series on the lands, and both ends of the resistors are connected by bonding. 1) Shunt resistor as described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8480990U JPH0442705U (en) | 1990-08-10 | 1990-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8480990U JPH0442705U (en) | 1990-08-10 | 1990-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0442705U true JPH0442705U (en) | 1992-04-10 |
Family
ID=31633536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8480990U Pending JPH0442705U (en) | 1990-08-10 | 1990-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442705U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017133928A (en) * | 2016-01-27 | 2017-08-03 | Koa株式会社 | Shunt resistor, manufacturing method thereof, and current detection device using shunt resistor |
-
1990
- 1990-08-10 JP JP8480990U patent/JPH0442705U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017133928A (en) * | 2016-01-27 | 2017-08-03 | Koa株式会社 | Shunt resistor, manufacturing method thereof, and current detection device using shunt resistor |
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