JPH0442733U - - Google Patents

Info

Publication number
JPH0442733U
JPH0442733U JP8521790U JP8521790U JPH0442733U JP H0442733 U JPH0442733 U JP H0442733U JP 8521790 U JP8521790 U JP 8521790U JP 8521790 U JP8521790 U JP 8521790U JP H0442733 U JPH0442733 U JP H0442733U
Authority
JP
Japan
Prior art keywords
probe
tip
electronic component
card
probe pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8521790U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8521790U priority Critical patent/JPH0442733U/ja
Publication of JPH0442733U publication Critical patent/JPH0442733U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａおよびｂは、この考案によるプローブ
カードの実施例におけるプローブピンの絶縁コー
テイングの説明図、第２図ａおよびｂは従来のプ
ローブカードと、その欠点の説明図である。 １……プローブカード、１１……セラミツク基
板、１２……円形孔、１３……プローブアーム、
１４……プローブピン、１４ａ……先端部、１５
……配線、１６……端子、１７……絶縁コーテイ
ング、２……ＩＣチツプ、２１……接続パツト、
３……金属クズ。 1A and 1B are explanatory diagrams of the insulating coating of the probe pins in the embodiment of the probe card according to the present invention, and FIGS. 2A and 2B are explanatory diagrams of the conventional probe card and its drawbacks. 1... Probe card, 11... Ceramic substrate, 12... Circular hole, 13... Probe arm,
14... Probe pin, 14a... Tip, 15
... Wiring, 16 ... Terminal, 17 ... Insulating coating, 2 ... IC chip, 21 ... Connection part,
3... Metal scraps.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属線のプローブピンが微小間隔で配列され、
該プローブピンの先端を電子部品の微小な接続パ
ツトに接触して該電子部品をテストするプローブ
カードにおいて、上記先端を除いた表面を絶縁コ
ーテイングした上記各プローブピンを有すること
を特徴とする、プローブカード。 Metal wire probe pins are arranged at minute intervals,
A probe card for testing an electronic component by bringing the tip of the probe pin into contact with a minute connection part of the electronic component, characterized in that each of the probe pins has an insulating coating on the surface other than the tip. card.
JP8521790U 1990-08-10 1990-08-10 Pending JPH0442733U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8521790U JPH0442733U (en) 1990-08-10 1990-08-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8521790U JPH0442733U (en) 1990-08-10 1990-08-10

Publications (1)

Publication Number Publication Date
JPH0442733U true JPH0442733U (en) 1992-04-10

Family

ID=31634228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8521790U Pending JPH0442733U (en) 1990-08-10 1990-08-10

Country Status (1)

Country Link
JP (1) JPH0442733U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007171078A (en) * 2005-12-26 2007-07-05 Zhizhong Wang Method for treating surface of probing stylus installed on probe card

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007171078A (en) * 2005-12-26 2007-07-05 Zhizhong Wang Method for treating surface of probing stylus installed on probe card

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