JPH0442738U - - Google Patents

Info

Publication number
JPH0442738U
JPH0442738U JP8553690U JP8553690U JPH0442738U JP H0442738 U JPH0442738 U JP H0442738U JP 8553690 U JP8553690 U JP 8553690U JP 8553690 U JP8553690 U JP 8553690U JP H0442738 U JPH0442738 U JP H0442738U
Authority
JP
Japan
Prior art keywords
diode package
slugs
diode
diode chip
metallized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8553690U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8553690U priority Critical patent/JPH0442738U/ja
Publication of JPH0442738U publication Critical patent/JPH0442738U/ja
Pending legal-status Critical Current

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  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の縦断面図、第2図
は従来のパツケージの縦断面図である。 1……ダイオードチツプ、2,3,12,13
……スラツグ、4……セラミツク外筒、5,6,
15,16……リード線、14……ガラス外筒。
FIG. 1 is a longitudinal sectional view of an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view of a conventional package. 1...Diode chip, 2, 3, 12, 13
... Slug, 4... Ceramic outer cylinder, 5, 6,
15, 16...Lead wire, 14...Glass outer cylinder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ダイオードチツプを収容するアキシヤルリード
形のダイオードパツケージにおいて、リード線を
有して前記ダイオードチツプと電気的および機械
的に同一軸上で接続される2つのスラツグと、前
記2つのスラツグの外周と接触する内面部分がメ
タライズ処理されたセラミツク製の円筒状外筒と
を溶着してなることを特徴とするダイオードパツ
ケージ。
In an axial lead type diode package that accommodates a diode chip, two slugs having lead wires are electrically and mechanically connected to the diode chip on the same axis, and contact with the outer periphery of the two slugs. A diode package characterized in that the inner surface of the diode package is welded to a cylindrical outer cylinder made of ceramic whose inner surface is metallized.
JP8553690U 1990-08-13 1990-08-13 Pending JPH0442738U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8553690U JPH0442738U (en) 1990-08-13 1990-08-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8553690U JPH0442738U (en) 1990-08-13 1990-08-13

Publications (1)

Publication Number Publication Date
JPH0442738U true JPH0442738U (en) 1992-04-10

Family

ID=31634732

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8553690U Pending JPH0442738U (en) 1990-08-13 1990-08-13

Country Status (1)

Country Link
JP (1) JPH0442738U (en)

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