JPH0442740U - - Google Patents
Info
- Publication number
- JPH0442740U JPH0442740U JP8367790U JP8367790U JPH0442740U JP H0442740 U JPH0442740 U JP H0442740U JP 8367790 U JP8367790 U JP 8367790U JP 8367790 U JP8367790 U JP 8367790U JP H0442740 U JPH0442740 U JP H0442740U
- Authority
- JP
- Japan
- Prior art keywords
- package
- weight
- external lead
- lead terminals
- insulating container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案にかかる半導体素子収納用パツ
ケージの一実施例を示す断面図、第２図は第１図
に示すパツケージの絶縁基体の斜視図、第３図は
第２図に示すパツケージの外部リード端子と絶縁
枠体の連結状態を説明するための部分拡大断面図
、第４図は従来の半導体素子収納用パツケージの
断面図、第５図は第４図のパツケージの絶縁基体
の平面図である。
１……絶縁基体、２……蓋体、３…絶縁容器、
７……外部リード端子、８……絶縁枠体、９……
ガラス部材。
FIG. 1 is a sectional view showing an embodiment of the package for housing semiconductor elements according to the present invention, FIG. 2 is a perspective view of the insulating base of the package shown in FIG. 1, and FIG. 3 is a cross-sectional view of the package shown in FIG. 2. 4 is a sectional view of a conventional package for storing semiconductor elements; FIG. 5 is a plan view of the insulating base of the package shown in FIG. 4; FIG. It is. 1... Insulating base, 2... Lid, 3... Insulating container,
7... External lead terminal, 8... Insulating frame, 9...
glass parts.
Claims (1)
突出して成る半導体素子収納用パツケージにおい
て、前記絶縁容器の側辺より突出する外部リード
端子の各々が酸化シリコン６０．０乃至７０．０
重量％、酸化バリウム５．０乃至１５．０重量％
、ナトリウムもしくはカリウムの酸化物１０．０
乃至２０．０重量％から成るガラス部材を介して
絶縁枠体に接着されていることを特徴とする半導
体素子収納用パツケージ。 In a semiconductor element storage package comprising a plurality of external lead terminals protruding from the side of an insulating container, each of the external lead terminals protruding from the side of the insulating container is silicon oxide 60.0 to 70.0.
Weight%, barium oxide 5.0 to 15.0% by weight
, sodium or potassium oxide 10.0
1. A package for housing a semiconductor device, characterized in that the package is bonded to an insulating frame via a glass member made of 20.0% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8367790U JP2514898Y2 (en) | 1990-08-07 | 1990-08-07 | Package for storing semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8367790U JP2514898Y2 (en) | 1990-08-07 | 1990-08-07 | Package for storing semiconductor devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0442740U true JPH0442740U (en) | 1992-04-10 |
| JP2514898Y2 JP2514898Y2 (en) | 1996-10-23 |
Family
ID=31631540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8367790U Expired - Lifetime JP2514898Y2 (en) | 1990-08-07 | 1990-08-07 | Package for storing semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2514898Y2 (en) |
-
1990
- 1990-08-07 JP JP8367790U patent/JP2514898Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2514898Y2 (en) | 1996-10-23 |
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