JPH0482864U - - Google Patents
Info
- Publication number
- JPH0482864U JPH0482864U JP12759290U JP12759290U JPH0482864U JP H0482864 U JPH0482864 U JP H0482864U JP 12759290 U JP12759290 U JP 12759290U JP 12759290 U JP12759290 U JP 12759290U JP H0482864 U JPH0482864 U JP H0482864U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- lead terminals
- external lead
- package
- pin member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000002513 implantation Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の半導体素子収納用パツケージ
の一実施例を示す拡大断面図、第２図は第１図に
示すパツケージの絶縁基板の底面側から見た平面
図、第３図は従来の半導体素子収納用パツケージ
の断面図である。
１……絶縁基体、２……蓋体、４……容器、５
……外部リード端子、８……ピン部材。
FIG. 1 is an enlarged cross-sectional view showing an embodiment of the package for storing semiconductor elements of the present invention, FIG. 2 is a plan view of the package shown in FIG. 1, viewed from the bottom side of the insulating substrate, and FIG. FIG. 2 is a sectional view of a package for housing semiconductor elements. 1... Insulating base, 2... Lid, 4... Container, 5
...External lead terminal, 8...Pin member.
Claims (1)
を収容するための空所を有する容器と、該容器内
に収容される半導体素子を外部電気回路に接続す
るための複数個の外部リード端子とから成る半導
体素子収納用パツケージにおいて、前記各外部リ
ード端子はその各々にピン部材が植設されており
、且つ各ピン部材の植設位置が隣接する外部リー
ド端子間で異なることを特徴とする半導体素子収
納用パツケージ。 A container consisting of an insulating base and a lid and having a cavity for accommodating a semiconductor element therein; and a plurality of external lead terminals for connecting the semiconductor element housed in the container to an external electric circuit. A package for housing a semiconductor element comprising: a semiconductor device, wherein each of the external lead terminals has a pin member implanted therein, and the implantation position of each pin member is different between adjacent external lead terminals; Package cage for storing elements.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12759290U JPH0482864U (en) | 1990-11-28 | 1990-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12759290U JPH0482864U (en) | 1990-11-28 | 1990-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0482864U true JPH0482864U (en) | 1992-07-20 |
Family
ID=31875086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12759290U Pending JPH0482864U (en) | 1990-11-28 | 1990-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0482864U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6039643A (en) * | 1983-08-12 | 1985-03-01 | Ricoh Co Ltd | Image forming method |
| JPS6427654A (en) * | 1987-07-21 | 1989-01-30 | Shinetsu Chemical Co | Method of recovering valued substances from shavings of high functional material |
-
1990
- 1990-11-28 JP JP12759290U patent/JPH0482864U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6039643A (en) * | 1983-08-12 | 1985-03-01 | Ricoh Co Ltd | Image forming method |
| JPS6427654A (en) * | 1987-07-21 | 1989-01-30 | Shinetsu Chemical Co | Method of recovering valued substances from shavings of high functional material |