JPH0442746U - - Google Patents
Info
- Publication number
- JPH0442746U JPH0442746U JP8430690U JP8430690U JPH0442746U JP H0442746 U JPH0442746 U JP H0442746U JP 8430690 U JP8430690 U JP 8430690U JP 8430690 U JP8430690 U JP 8430690U JP H0442746 U JPH0442746 U JP H0442746U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- cooling fin
- package
- positioning means
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims 8
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
Description
第１図は本考案の一実施例による冷却フイン取
着構造を示す断面図、第２図は本実施例の冷却フ
インを示す斜視図、第３図は他の実施例の冷却フ
インを示す斜視図、第４図は従来の冷却フイン取
着構造を示す断面図である。
図において、１は配線基板、２はＬＳＩ、２−
１はパツケージ、２−２はリード端子、１３，２
３は冷却フイン、１３−１，２３−１はフイン、
１３−２，２３−２は取着面、１３−２ａは凹部
、２３−２ａは突起、を示す。
Fig. 1 is a sectional view showing a cooling fin attachment structure according to an embodiment of the present invention, Fig. 2 is a perspective view showing a cooling fin of this embodiment, and Fig. 3 is a perspective view showing a cooling fin of another embodiment. 4 are sectional views showing a conventional cooling fin attachment structure. In the figure, 1 is a wiring board, 2 is an LSI, and 2-
1 is the package cage, 2-2 is the lead terminal, 13,2
3 is a cooling fin, 13-1, 23-1 is a fin,
13-2 and 23-2 are mounting surfaces, 13-2a is a recess, and 23-2a is a protrusion.
Claims (1)
な平板の一面側に複数枚のフイン１３−１を成形
するとともに、他面の中央部に当該半導体装置２
との位置決め手段１３−２ａを設けた熱伝導の優
れた冷却フイン１３を備え、 上記半導体装置２の該パツケージ２−１上部に
上記冷却フイン１３の位置決め手段１３−２ａを
係合し、当該位置決め手段１３−２ａの底面と上
記パツケージ２−１の放熱面とを熱伝導の優れた
接着剤４を介して接合したことを特徴とする冷却
フイン取着構造。 (2) 上記半導体装置２との位置決め手段は、当
該半導体装置２のパツケージ２−１が挿入できる
浅い凹部１３−２ａを設けたことを特徴とする請
求項１記載の冷却フイン取着構造。 (3) 上記半導体装置２との位置決め手段は、当
該半導体装置２のパツケージ２−１側面上部に係
合する低い突起２３−２ａを設けたことを特徴と
する請求項１記載の冷却フイン取着構造。[Claims for Utility Model Registration] (1) A plurality of fins 13-1 are formed on one side of a flat plate larger than the projected area of the semiconductor device 2 to be cooled, and the semiconductor device 2 is formed in the center of the other side.
A cooling fin 13 with excellent heat conduction is provided with a positioning means 13-2a for the semiconductor device 2, and the positioning means 13-2a of the cooling fin 13 is engaged with the upper part of the package 2-1 of the semiconductor device 2 to determine the position. A cooling fin attachment structure characterized in that the bottom surface of the means 13-2a and the heat dissipating surface of the package 2-1 are joined via an adhesive 4 having excellent heat conductivity. (2) The cooling fin attachment structure according to claim 1, wherein the means for positioning the semiconductor device 2 includes a shallow recess 13-2a into which the package 2-1 of the semiconductor device 2 can be inserted. (3) The cooling fin attachment according to claim 1, wherein the positioning means with respect to the semiconductor device 2 is provided with a low protrusion 23-2a that engages with the upper side surface of the package 2-1 of the semiconductor device 2. structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8430690U JPH0442746U (en) | 1990-08-08 | 1990-08-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8430690U JPH0442746U (en) | 1990-08-08 | 1990-08-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0442746U true JPH0442746U (en) | 1992-04-10 |
Family
ID=31632686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8430690U Pending JPH0442746U (en) | 1990-08-08 | 1990-08-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442746U (en) |
-
1990
- 1990-08-08 JP JP8430690U patent/JPH0442746U/ja active Pending
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